CN-121995587-A - Semiconductor device, method of manufacturing the same, and method of optical coupling

Abstract

Methods of semiconductor device fabrication are provided. The method includes providing a device including a photonics die having a grating coupler. The method includes patterning an upper surface of the device to form a lens feature configured to receive light from an upper surface of the photonics die. The method includes forming a first mirror configured to optically couple the lens component with the grating coupler according to an angle of incidence between the light and the grating coupler of less than about 15 degrees. Embodiments of the present application also relate to a semiconductor device, a method of manufacturing the same, and a method of optical coupling.

Inventors

• GUO FENGWEI

Assignees

• 台湾积体电路制造股份有限公司

Dates

Publication Date

20260508

Application Date

20251231

Priority Date

20250623

Claims (10)

1. 1. A semiconductor device, comprising: A photonics die including a waveguide; an electronics die coupled to and vertically spaced apart from the photonics die; A silicon-containing layer having a lens feature configured to collimate light from a light source disposed above the electronic die, and A first mirror configured to redirect light received from the lens component to the waveguide.
2. 2. The semiconductor device of claim 1, further comprising: a grating coupler to inject the light received from the lens component into the waveguide, wherein the first mirror is disposed in the silicon-containing layer or beside the electronic die.
3. 3. The semiconductor device of claim 1, further comprising: The light source, and A second mirror is laterally spaced from the light source and is optically coupled to the first mirror via an air gap.
4. 4. A semiconductor device according to claim 3, wherein the second mirror is a curved mirror.
5. 5. The semiconductor device according to claim 3, further comprising: An alignment component configured to align a first portion of the semiconductor device including the first mirror, the photonics die, and the electronics die with a second portion of the semiconductor device including the second mirror and the light source.
6. 6. A method for fabricating a semiconductor device, comprising: Providing a device comprising a photonics die having a grating coupler; Patterning an upper surface of the device to form a lens feature configured to receive light from an upper surface of the photonics die, and A first mirror is formed that is configured to optically couple the lens component with the grating coupler according to an angle of incidence between the light and the grating coupler of less than about 15 degrees.
7. 7. The method of claim 6, further comprising: coupling the photonics die with an electronic die to form the semiconductor device, wherein a lower surface of the electronic die is coupled with the upper surface of the photonics die and a dielectric layer separates the lens component from the photonics die, wherein the light passes from the first mirror through the dielectric layer to the grating coupler.
8. 8. The method of claim 7, wherein the lens component and the first mirror are formed in a silicon-containing layer formed over the dielectric layer.
9. 9. The method of claim 7, further comprising forming the first mirror in at least one of the following below a silicon-containing layer: The dielectric layer or The photonics die.
10. 10. A method of optical coupling, comprising: Redirecting light received from the light source towards a lens component disposed vertically below the light source by a first mirror; collimating the light through the lens component, and Redirecting the collimated light toward a grating coupler by a second mirror to couple the light with a waveguide.

Description

Semiconductor device, method of manufacturing the same, and method of optical coupling Technical Field Embodiments of the present application relate to a semiconductor device, a method of manufacturing the same, and a method of optical coupling. Background Optics, such as those used in silicon photonics, are used in a variety of applications, including data communications, high performance computing, sensing, and advanced imaging systems. An optical device is fabricated by sequentially depositing an insulating or dielectric layer, a conductive layer, and an optical waveguide layer over a substrate and patterning by photolithography to define optical circuit assemblies and elements. As the silicon photonics industry advances to support higher data rates, improved energy efficiency, and greater integration with electronic systems, challenges related to manufacturing accuracy, alignment, and optical loss have driven the development of new packaging technologies. Disclosure of Invention Some embodiments of the present application provide a semiconductor device comprising a photonics die including a waveguide, an electronics die coupled to and vertically spaced apart from the photonics die, a silicon-containing layer having a lens component configured to collimate light from a light source disposed above the electronics die, and a first mirror configured to redirect light received from the lens component to the waveguide. Further embodiments of the present application provide a method for fabricating a semiconductor device comprising providing a device comprising a photonics die having a grating coupler, patterning an upper surface of the device to form a lens component configured to receive light from the upper surface of the photonics die, and forming a first mirror configured to optically couple the lens component with the grating coupler according to an angle of incidence between the light and the grating coupler of less than about 15 degrees. Still further embodiments of the present application provide a method of optical coupling comprising redirecting light received from a light source towards a lens component disposed vertically below the light source by a first mirror, collimating the light by the lens component, and redirecting the collimated light towards a grating coupler by a second mirror to couple the light with a waveguide. Drawings The various aspects of the embodiments of the present disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that the various components are not drawn to scale according to standard practice in the industry. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Fig. 1 illustrates an example of a semiconductor device including a grating coupler coupled to a light source, according to some embodiments. Fig. 2 illustrates another example of a semiconductor device including a grating coupler coupled to a light source, according to some embodiments. Fig. 3 illustrates yet another example of a semiconductor device including a grating coupler coupled to a light source, according to some embodiments. Fig. 4 illustrates an exemplary flow chart of a method for optical coupling according to some embodiments. Fig. 5 illustrates an exemplary flow chart of a method for semiconductor device fabrication according to some embodiments. Fig. 6, 7, 8A, 8B, 9, 10, 11, 12, 13, 14, 15, and 16 illustrate exemplary cross-sectional views of a semiconductor device during various stages of fabrication according to the method of fig. 5, according to some embodiments. Detailed Description The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure embodiments. These are, of course, merely examples and are not intended to be limiting. For example, in the following description, forming a first component over or on a second component may include embodiments in which the first component and the second component are formed in direct contact, and may also include embodiments in which additional components may be formed between the first component and the second component, such that the first component and the second component may not be in direct contact. Further, embodiments of the present disclosure may repeat reference numerals and/or characters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms such as "under", "below", "lower", "above", "upper", "top", "bottom", and the like may be used herein for ease of description to describe one element or component's relationship to another element(s) or com