Search

CN-121995694-A - Core-shell compound, photosensitive resin composition and layer, color filter and sensor

CN121995694ACN 121995694 ACN121995694 ACN 121995694ACN-121995694-A

Abstract

Provided are a core-shell compound, a photosensitive resin composition including the core-shell compound, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a complementary metal oxide semiconductor image sensor including the color filter, the core-shell compound including a core represented by chemical formula 1 and a shell surrounding the core, the shell being represented by chemical formula 2: [ chemical formula 1] [ Chemical formula 2]

Inventors

  • Wen Xichao
  • Pu Baicheng
  • XU GUANGYUAN
  • JIN YICHEN
  • Pu Xiubin

Assignees

  • 三星SDI株式会社

Dates

Publication Date
20260508
Application Date
20250912
Priority Date
20241101

Claims (15)

  1. 1. A core-shell compound comprising a core represented by chemical formula 1 and a shell surrounding the core, the shell being represented by chemical formula 2: [ chemical formula 1] [ Chemical formula 2] Wherein in chemical formula 1 and chemical formula 2, R 1 is a thermosetting group, and the thermosetting group, R 2 and R 3 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group, L 1 and L 6 are each independently a substituted or unsubstituted C1 to C10 alkylene group, or a group represented by formula L, provided that at least one of L 1 and L 6 is a group represented by formula L, L 2 、L 4 、L a and L b are each independently a single bond, or a substituted or unsubstituted C1 to C10 alkylene group, L 3 is a single bond, or an ester group represented by x-C (=o) O-, or x-OC (=o) -, L 5 is a single bond, or a substituted or unsubstituted C1 to C10 alkylene group, and N is an integer greater than or equal to 2, [ Chemical formula L ] Wherein in the formula L, the amino acid sequence of the formula, L 7 is a substituted or unsubstituted C1 to C10 alkylene radical, and M is an integer from 2 to 10.
  2. 2. The core-shell compound of claim 1 wherein the thermoset group comprises a substituted or unsubstituted epoxy group, a substituted or unsubstituted oxetanyl group, or a combination thereof.
  3. 3. The core-shell compound of claim 1 wherein: R 1 is a thermosetting group, and the thermosetting group, R 2 and R 3 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L 1 and L 5 are each independently a substituted or unsubstituted C1 to C10 alkylene group, L 2 to L 4 are each independently a single bond, and L 6 is a group represented by formula L.
  4. 4. The core-shell compound of claim 1 wherein: R 1 is a thermosetting group, and the thermosetting group, R 2 and R 3 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L 1 is a group represented by the formula L, L 2 、L 4 and L 6 are each independently a substituted or unsubstituted C1 to C10 alkylene group, L 3 is an ester group represented by-C (=o) O-, or-OC (=o) -, an L 5 is a single bond, or a substituted or unsubstituted C1 to C10 alkylene group.
  5. 5. The core-shell compound of claim 1 wherein: R 1 is a thermosetting group, and the thermosetting group, R 2 and R 3 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L 1 and L 6 are each independently a group represented by the formula L, L 2 and L 4 are each independently a substituted or unsubstituted C1 to C10 alkylene group, L 3 is an ester group represented by-C (=o) O-, or-OC (=o) -, an L 5 is a substituted or unsubstituted C1 to C10 alkylene group.
  6. 6. The core-shell compound according to claim 1, wherein the core represented by chemical formula 1 has a maximum absorption wavelength of 610nm to 640 nm.
  7. 7. The core-shell compound according to claim 1, wherein the shell represented by chemical formula 2 is represented by chemical formula 2-1: [ chemical formula 2-1]
  8. 8. The core-shell compound of claim 1 wherein the core-shell compound is represented by one of formulas a-C: [ chemical formula A ] [ Chemical formula B ] [ Chemical formula C ]
  9. 9. The core-shell compound of claim 1 wherein the core-shell compound is a green dye.
  10. 10. A photosensitive resin composition comprising the core-shell compound according to claim 1.
  11. 11. The photosensitive resin composition according to claim 10, further comprising a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a pigment, or a solvent.
  12. 12. The photosensitive resin composition according to claim 10, wherein the photosensitive resin composition is used for a complementary metal oxide semiconductor image sensor.
  13. 13. A photosensitive resin layer produced using the photosensitive resin composition according to claim 10.
  14. 14. A color filter comprising the photosensitive resin layer according to claim 13.
  15. 15. A complementary metal oxide semiconductor image sensor comprising the color filter of claim 14.

Description

Core-shell compound, photosensitive resin composition and layer, color filter and sensor Cross reference to related applications The present application claims priority and rights of korean patent application No. 10-2024-0153668 filed in the korean intellectual property agency on 1/11/2024, the entire contents of which are incorporated herein by reference. Technical Field Embodiments relate to a core-shell compound, a photosensitive resin composition including the core-shell compound, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a complementary metal oxide semiconductor image sensor including the color filter. Background With the recent rapid development of advanced information and communication processing technologies and the entire electronic industry, next-generation detectors that rapidly transmit and receive a large amount of information have been considered and development of new conceptual devices and systems has been considered. With the rise of video processing and the like in mobile devices, the development of ultra-small-sized and ultra-power-saving (ultra-power-saving) image sensors has been rapidly accelerated with the existing charge coupled devices (Charge Coupled Device, CCDs) and complementary metal oxide semiconductors (Complementary Metal Oxide Semiconductor, CMOS) as centers. As a semiconductor that converts photons into electrons and displays them on a display or stores them in a storage device, an image sensor may include a light receiving element that converts an optical signal into an electrical signal, a pixel Circuit portion that amplifies and compresses the converted electrical signal, and an Application Specific Integrated Circuit (ASIC) portion that converts these preprocessed analog signals into digital signals to process image signals and include, for example, a CCD, a CMOS, a contact image sensor (Contact Image Sensor, CIS), and the like. The CCD image sensor uses the same light receiving element as the CMOS image sensor, but in the CCD image sensor, charges generated in the light receiving element sequentially move through metal oxide semiconductor (Metal Oxide Semiconductor, MOS) capacitors connected in series and are converted into voltages in a source follower connected at the final end. In the CMOS image sensor, charges are converted into voltages in a source follower built into each pixel, and output to the outside. The CCD image sensor moves electrons generated by light to an output unit as they are using a gate pulse (gate pulse), and the CMOS image sensor converts the electrons generated by light into a voltage in each pixel and then outputs them through several CMOS switches. These image sensors are very widely used in household products such as digital cameras and cell phones up to endoscopes used in hospitals and telescopes for satellites orbiting the earth. Disclosure of Invention These embodiments can be achieved by providing a core-shell compound comprising a core represented by chemical formula 1 and a shell surrounding the core, the shell being represented by chemical formula 2: [ chemical formula 1] [ Chemical formula 2] Wherein in chemical formulas 1 and 2, R 1 is a thermosetting group, R 2 and R 3 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group, L 1 and L 6 are each independently a substituted or unsubstituted C1 to C10 alkylene group, or a group represented by chemical formula L, provided that at least one of L 1 and L 6 is a group represented by chemical formula L, L 2、L4、La and L b are each independently a single bond, or a substituted or unsubstituted C1 to C10 alkylene group, L 3 is a single bond, or an ester group represented by x-C (=o) O-or x-OC (=o) -, L 5 is a single bond, or a substituted or unsubstituted C1 to C10 alkylene group, and n is an integer of 2 or more, [ Chemical formula L ] Wherein in formula L, L 7 is a substituted or unsubstituted C1 to C10 alkylene group, and m is an integer from 2 to 10. The thermosetting group can include a substituted or unsubstituted epoxy group, a substituted or unsubstituted oxetanyl group, or a combination thereof. R 1 may be a thermosetting group, R 2 and R 3 may each independently be a hydrogen atom, or a substituted or unsubstituted C1 to C20 alkyl group, L 1 and L 5 may each independently be a substituted or unsubstituted C1 to C10 alkylene group, L 2 to L 4 may each independently be a single bond, and L 6 may be a group represented by formula L. R 1 may be a thermosetting group, R 2 and R 3 may each independently be a hydrogen atom, or a substituted or unsubstituted C1 to C20 alkyl group, L 1 may be a group represented by formula L, L 2、L4 and L 6 may each independently be a substituted or unsubstituted C1 to C10 alkylene group, L 3 may be an ester group represented by x-C (=o) O-or x-OC (=o) -, and