CN-121995700-A - Hot plate cooling device and substrate heat treatment equipment

CN121995700ACN 121995700 ACN121995700 ACN 121995700ACN-121995700-A

Abstract

The application discloses a hot plate cooling device and substrate heat treatment equipment. The hot plate cooling device is used for reducing the surface temperature of the hot plate and comprises a cooling plate, a moving mechanism and a controller, wherein the cooling plate is provided with a cooling surface matched with the surface of the hot plate, the moving mechanism is used for moving the cooling plate, the controller is in communication connection with the moving mechanism, the controller is configured to control the moving mechanism to load the cooling plate onto the surface of the hot plate, the cooling surface corresponds to the surface of the hot plate so as to reduce the surface temperature of the hot plate to a preset temperature, and then the moving mechanism is controlled to unload the cooling plate from the surface of the hot plate. The application realizes the effects of shortening the cooling time of the hot plate and improving the working efficiency of the hot plate.

Inventors

ZHANG JIANSONG
WANG WENJUN
WANG HUI
LI KANGZHI

Assignees

盛美半导体设备(上海)股份有限公司
盛美半导体设备韩国有限公司
清芯科技有限公司

Dates

Publication Date: 20260508
Application Date: 20241101

Claims (13)

1. A thermal plate cooling device for reducing the surface temperature of a thermal plate, comprising: a cooling plate having a cooling surface that mates with a surface of the hot plate; a moving mechanism for moving the cooling plate; A controller in communication with the mobile mechanism, wherein, The controller is configured to control the moving mechanism to load the cooling plate to the surface of the hot plate, to make the cooling surface correspond to the surface of the hot plate, to reduce the surface temperature of the hot plate to a preset temperature, and to control the moving mechanism to unload the cooling plate from the surface of the hot plate.
2. A platen cooling device according to claim 1, wherein the cooling plate comprises: The cooling device comprises a shell, wherein a cavity is formed in the shell and used for containing cooling liquid, the cooling surface is located on the bottom surface of the shell, and a vent communicated with the cavity is formed in the shell.
3. A platen cooling device according to claim 2, wherein the cavity comprises: And the cooling liquid storage piece is arranged in the cavity and is used for storing the cooling liquid.
4. A platen cooling device according to claim 2, comprising: the first fluid supplementing mechanism is connected with the cavity and is used for supplementing cooling fluid into the cavity.
5. A platen cooling device according to claim 4, comprising: a first temperature sensor in communication with the controller for detecting a temperature of the cooling fluid within the cavity; The controller is configured to control the first fluid supplementing mechanism to supplement a preset volume of the cooling fluid into the cavity after the first temperature sensor detects that the temperature of the cooling fluid rises to the boiling point of the cooling fluid and a preset time passes in the process that the cooling plate cools the hot plate, and the preset volume is configured to be not larger than the volume reduction amount of the cooling fluid in the preset time.
6. A platen cooling device according to claim 4, comprising: the first pressure sensor is in communication connection with the controller, and is arranged on the bottom surface of the shell and used for detecting the weight of the cooling plate; And the controller is configured to control the first fluid supplementing mechanism to supplement the cooling fluid into the cavity when the first pressure sensor detects that the weight of the cooling plate is reduced to a preset first weight in the process of cooling the hot plate by the cooling plate, and control the first fluid supplementing mechanism to stop supplementing the cooling fluid into the cavity when the first pressure sensor detects that the weight of the cooling plate is equal to a second preset weight.
7. A platen cooling device according to claim 4, comprising: And the second temperature sensor is in communication connection with the controller and is used for detecting the surface temperature of the hot plate.
8. A platen cooling device according to claim 2, comprising: the cooling device comprises a carrying table, a cooling plate and a cooling device, wherein the carrying table is used for storing the cooling plate, the surface temperature of the carrying table is configured to be a preset adjusting temperature, the preset adjusting temperature is not higher than the preset temperature, and the carrying table is used for adjusting the surface temperature of the cooling plate.
9. A platen cooling device according to claim 8, comprising: The second pressure sensor is in communication connection with the controller, is arranged on the carrying table and is used for detecting the weight of the cooling plate; The second fluid supplementing mechanism is used for supplementing cooling fluid into the cavity; And the controller is configured to control the second fluid supplementing mechanism to supplement the cooling fluid into the cavity when the weight of the cooling plate detected by the second pressure sensor is smaller than a first preset weight, and control the second fluid supplementing mechanism to stop supplementing the cooling fluid into the cavity when the weight of the cooling plate detected by the second pressure sensor is equal to a second preset weight.
10. A platen cooling device according to claim 1, wherein the cooling plate comprises: The cooling device comprises a shell, wherein a closed cavity is formed in the shell, cooling liquid is stored in the inner bottom of the cavity, and the cooling surface is positioned on the bottom surface of the shell; The cavity is configured such that, during the cooling of the hot plate by the cooling plate, the cooling liquid is heated and vaporized into gas at the inner bottom of the cavity, and the gas rises to the inner top of the cavity, and then the cooling liquid is liquefied into the cooling liquid and flows back to the inner bottom of the cavity.
11. A platen cooling device according to claim 10, wherein the cavity comprises: The cooling liquid storage piece is arranged in the cavity, an inner cavity is formed in the cooling liquid storage piece, the bottom of the cooling liquid storage piece corresponds to the inner bottom of the cavity, the top of the cooling liquid storage piece corresponds to the inner top of the cavity, and the side wall of the cooling liquid storage piece corresponds to the inner side wall of the cavity; and the cooling liquid storage piece is configured to be heated and gasified into gas in the process of cooling the hot plate by the cooling plate, wherein the gas rises to the top of the cooling liquid storage piece in the inner cavity and then is cooled to be the cooling liquid, and then flows back to the bottom of the cooling liquid storage piece along the top and the side wall of the cooling liquid storage piece in sequence.
12. The thermal plate cooling device of claim 10 wherein, The internal air pressure of the cavity is configured as a negative pressure.
13. A substrate heat treatment apparatus comprising the hot plate cooling device according to any one of claims 1 to 12, further comprising: A chamber provided with an openable substrate transfer port; a hot plate arranged in the cavity for bearing and heating the substrate, wherein, The controller is configured to control the moving mechanism to unload the substrate from a surface of the hot plate and load the cooling plate after the hot plate completes heat treatment of the substrate.

Description

Hot plate cooling device and substrate heat treatment equipment Technical Field The application relates to the field of semiconductor equipment, in particular to a hot plate cooling device and substrate heat treatment equipment. Background The substrate heat treatment apparatus is one of the key devices inside a coating and developing machine, and is mainly used for coating or developing a substrate, and then heating the substrate at a high temperature to remove a solvent in photoresist, so as to harden the photoresist. The utilization rate of the substrate heat treatment apparatus in the coating and developing machine is extremely high. However, for routine maintenance, in order to ensure the safety of operators, when maintaining and repairing the substrate heat treatment apparatus, it is necessary to lower the hot plate inside the substrate heat treatment apparatus from a high temperature (70 ℃ to 230 ℃) to a room temperature (23 ℃ to 30 ℃) to perform the operation. In addition, the temperatures required for heat treatment of different types of photoresist may be different, and the hot plate may be cooled after the heat treatment process with higher temperature is performed, so that the heat treatment process with lower temperature may be performed. In addition, the higher the temperature of the hot plate, the longer the cooling time will be, which in turn leads to reduced utilization of the equipment. Disclosure of Invention Aiming at the technical problems, the application aims to shorten the cooling time of the hot plate and improve the working efficiency of the hot plate. In order to achieve the above purpose, the application provides a hot plate cooling device and a substrate heat treatment device. In some embodiments, a platen cooling apparatus for reducing a surface temperature of a platen includes a cooling plate having a cooling surface that mates with a surface of the platen, a moving mechanism for moving the cooling plate, a controller in communication with the moving mechanism, wherein the controller is configured to control the moving mechanism to load the cooling plate onto the surface of the platen, to correspond the cooling surface to the surface of the platen, to reduce the surface temperature of the platen to a preset temperature, and to control the moving mechanism to unload the cooling plate from the surface of the platen. In some embodiments, the substrate heat treatment equipment comprises the hot plate cooling device, and further comprises a cavity provided with an openable and closable substrate conveying port, a hot plate arranged in the cavity and used for bearing and heating a substrate, wherein the controller is further configured to control the moving mechanism to unload the substrate from the surface of the hot plate and load the cooling plate after the hot plate completes heat treatment on the substrate. Compared with the prior art, the application has the advantages that the cooling plate is loaded on the surface of the hot plate through the moving mechanism to cool the surface temperature of the hot plate, the cooling time of the hot plate is shortened, and the working efficiency of the hot plate is further improved. Drawings The above features, technical features, advantages and implementation of the present application will be further described in the following description of preferred embodiments with reference to the accompanying drawings in a clear and easily understood manner. FIG. 1 is a schematic view of a thermal plate cooling device according to one embodiment of the present application; FIG. 2 is a schematic view of FIG. 1 in the direction a-a; FIG. 3 is a schematic view of a platen cooling apparatus according to another embodiment of the present application; FIG. 4 is a schematic view of a platen cooling apparatus according to another embodiment of the present application; FIG. 5 is a schematic view of FIG. 4 in the direction b-b, and Fig. 6 is a schematic view of a substrate heat treatment apparatus according to an embodiment of the present application. Detailed Description In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following description will explain the specific embodiments of the present application with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the application, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort. For the sake of simplicity of the drawing, the parts relevant to the present application are shown only schematically in the figures, which do not represent the actual structure thereof as a product. Additionally, in order to simplify the drawing for ease of understanding, components having the same structure or function in some of the drawings are shown schematically with only one of them, or only one of them is labele