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CN-121995705-A - Wafer edge exposure method and device in coating and developing machine

CN121995705ACN 121995705 ACN121995705 ACN 121995705ACN-121995705-A

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer edge exposure method and device in a coating and developing machine. The device comprises a light source component, a wafer carrying platform, a moving mechanism and an alignment module, wherein the wafer carrying platform is arranged on the moving mechanism and is used for carrying a wafer, the light source component is used for exposing an annular exposure area and a rectangular exposure area at the edge of the wafer, the alignment module is used for detecting the position information of the wafer, the moving mechanism is used for driving the wafer carrying platform to rotate, and the position dynamic compensation is carried out according to the position information of the wafer detected by the alignment module, so that the uniformity of the exposure width of the annular exposure area and the uniformity of the exposure dose are ensured. The invention improves the problem of insufficient exposure energy of the starting and stopping points of the rectangular exposure area at the wafer edge through the control of the exposure mode, thereby achieving the effect of consistent exposure quantity of the exposure area.

Inventors

  • HAN YANG
  • SUN PENG
  • JIANG BEIHONG
  • WANG YONGJIE
  • ZHANG DEQIANG

Assignees

  • 沈阳芯源微电子设备股份有限公司

Dates

Publication Date
20260508
Application Date
20241106

Claims (10)

  1. 1. The wafer edge exposure method in the coating and developing machine is characterized in that the light intensity of the starting point of the rectangular exposure area (15) of the wafer (5) is compensated through the motion control or the process control of light spots so as to obtain the consistency of the exposure energy of the rectangular exposure area (15).
  2. 2. The method of wafer edge exposure in a coating and developing machine according to claim 1, characterized in that the movement control of the light spot comprises a movement speed control and/or a movement time control of the light spot at the start point of the rectangular exposure area (15).
  3. 3. The method for exposing an edge of a wafer in a coating and developing machine according to claim 2, wherein the movement time of the light spot at the start-stop point of the rectangular exposure area (15) is controlled to increase the exposure energy of the start-stop point by compensating the exposure time of the start-stop point of the rectangular exposure area (15).
  4. 4. The method according to claim 2, wherein the movement speed of the light spot at the start point of the rectangular exposure area (15) is controlled such that the acceleration of the start point of exposure is minimum and then gradually increases, the uniform exposure process is started when the speed reaches a set value, and the speed starts to gradually decrease when the speed approaches the end point of exposure.
  5. 5. The method of exposing an edge of a wafer in a coating and developing machine according to claim 1, wherein the process control of the light spot comprises three sections of rectilinear motion with a light spot movement start point located outside the wafer (5), wherein the second section of motion is within a rectangular exposure area (15), and the start point of the second section of motion overlaps with the stop point of the first section of motion, and the stop point of the second section of motion overlaps with the start point of the third section of motion.
  6. 6. A wafer edge exposure device in a coating and developing machine for implementing the method as claimed in any one of claims 1 to 5, comprising a light source assembly, a wafer carrying platform, a moving mechanism and an alignment module (14), wherein the wafer carrying platform is arranged on the moving mechanism and is used for carrying a wafer (5), the light source assembly is used for exposing an annular exposure area (7) and a rectangular exposure area (15) of the edge of the wafer (5), the alignment module (14) is used for detecting position information of the wafer (5), the moving mechanism is used for driving the wafer carrying platform to rotate and carrying out position dynamic compensation according to the position information of the wafer (5) detected by the alignment module (14), so that uniformity of exposure width of the annular exposure area (7) and uniformity and accuracy of exposure width of the rectangular exposure area (15) are ensured.
  7. 7. The wafer edge exposure apparatus in the coating and developing machine according to claim 6, wherein the light source assembly comprises a light source (1), a lens (2) and a mask plate (3) which are sequentially arranged along a light path, light emitted by the light source (1) sequentially passes through the lens (2) and the mask plate (3) to form rectangular light spots, and the annular exposure area (7) and the rectangular exposure area (15) of the wafer (5) are exposed through the rectangular light spots.
  8. 8. The wafer edge exposure apparatus in a coating and developing machine according to claim 7, wherein the movement mechanism comprises a Y-axis linear movement module, an X-axis linear movement module and a main shaft rotating motor (8) which are sequentially connected from bottom to top, wherein an output shaft of the main shaft rotating motor (8) is connected with the wafer carrying platform, the main shaft rotating motor (8) is used for driving the wafer carrying platform to rotate, and the Y-axis linear movement module and the X-axis linear movement module are respectively used for driving the wafer carrying platform to move along the Y direction and the X direction.
  9. 9. The apparatus according to claim 6, wherein the wafer position information includes wafer center deviation state information and wafer notch position information.
  10. 10. The wafer edge exposure apparatus in a coating and developing machine according to claim 6, wherein the overall exposure dose of the rectangular exposure area (15) is made to be uniform by controlling the movement time and the movement mode of different positions in the exposure process.

Description

Wafer edge exposure method and device in coating and developing machine Technical Field The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer edge exposure method and device in a coating and developing machine. Background Gluing, exposure and development are important processes responsible for transferring mask patterns, but due to process limitations, wafer edge film thickness bulges and photoresist build-up at wafer edges are unavoidable in the gluing process. In order to solve this problem, the photoresist is usually removed by edge cleaning (EBR, edge bead removal) with a chemical solvent, but the accuracy of the cleaning removal is insufficient, and a wafer edge exposure method is also needed to remove the photoresist within a specific width of the edge, so as to avoid edge defects in the subsequent process such as exposure or etching stage of a photolithography machine. WEE is a short name for WAFER EDGE exposure of the wafer edge, and the principle of this is that by exposing a specific area of the wafer, which is to be photoresist removed, for a certain period of time, the specific area can be the edge of the wafer or the scribe area or alignment mark area of the wafer surface, and then the exposed area is exposed in the developing process. The exposure process of WEE requires precise control, exposure to precise widths, and no effect on the pattern area on the chip. When the existing WEE process is used for exposing the wafer edge marking area, the wafer needs to do linear motion during exposure because the shape of the marking area is generally rectangular, so that the purpose that the exposure area is rectangular is achieved. However, since the mask is generally regular rectangular with a certain size, the exposure amount received by the photoresist at different positions in the whole exposure area is inconsistent, the exposure amount received by the start-stop points of the exposure area is less than that of the middle area, and the difference of the exposure amount can be greatly amplified on some sensitive photoresists, so that corners of the rectangular exposure area are not very straight, as shown in fig. 1-2. In addition, insufficient exposure to the start and stop points may result in a larger width of the transition color stripe region between the start and stop point exposure region and the non-exposure region. It is therefore important to develop a device and method that can precisely control WEE exposure. Disclosure of Invention The invention aims to solve the problem that the exposure quantity of a starting point and a stopping point is insufficient when a WEE edge rectangular marking area of the existing WEE process is exposed, so that the effect of consistent exposure quantity of an exposure area is achieved. In order to achieve the above purpose, the present invention adopts the following technical scheme: the invention provides a wafer edge exposure method in a coating and developing machine, which compensates the light intensity of a start point and a stop point of a rectangular exposure area of a wafer through the motion control or the process control of light spots so as to obtain the consistency of the exposure energy of the rectangular exposure area. The movement control of the light spot comprises movement speed control and/or movement time control of the light spot at the starting point of the rectangular exposure area. The movement time of the light spot at the starting point of the rectangular exposure area is controlled to be that the exposure energy of the starting point is increased by compensating the exposure time of the starting point of the rectangular exposure area. The movement speed of the light spot at the starting point and the stopping point of the rectangular exposure area is controlled to be the minimum acceleration of the exposure starting point and then gradually increased, the uniform speed exposure process is started when the speed reaches a set value, and the speed is gradually slowed down when the speed approaches to the exposure ending point. The light spot process control comprises three sections of linear motions with light spot motion starting points positioned on the outer side of the wafer, wherein the second section of motion is positioned in the rectangular exposure area, the starting point of the second section of motion is overlapped with the stopping point of the first section of motion, and the stopping point of the second section of motion is overlapped with the starting point of the third section of motion. The invention further provides a wafer edge exposure device in the coating and developing machine for realizing the method, which comprises a light source component, a wafer carrying platform, a motion mechanism and an alignment module, wherein the wafer carrying platform is arranged on the motion mechanism and is used for carrying a wafer, the light source component is used for exposing