CN-121995985-A - Temperature control system and control method for controlling CPU substrate to be cooled by cylindrical thermoelectric refrigerator in partition mode

Abstract

The invention relates to a temperature control system and a control method for controlling CPU substrate cooling by a cylindrical thermoelectric refrigerator partition, in particular to a temperature control system and a control method for adjusting the cylindrical thermoelectric refrigerator partition and a cooling fan according to CPU working conditions, aiming at realizing efficient and accurate CPU temperature control, preventing overheat and improving energy efficiency. The system mainly comprises a central control unit MCU, a cylindrical thermoelectric refrigerator partition, a temperature sensor, a driving unit and a cooling fan. The MCU monitors the core temperature of each CPU through a cold end temperature sensor, and adjusts the power of the thermoelectric refrigerator partition and the rotating speed of the cooling fan according to the working conditions of starting, half-load, full-load and the like, so that the independent temperature control and the integral heat dissipation of the partition are realized. The system and the control method can eliminate the problem of local overheating of the CPU, solve the problems of slow response, inaccurate temperature control and high leakage risk of the water cooling system of the traditional heat dissipation scheme, have the advantages of quick temperature control response, safe and reliable operation and high energy efficiency, and can effectively improve the working stability and the service life of the CPU.

Inventors

• KONG YUYANG
• ZHU HAIRONG
• SONG QINGSONG
• XIN GU
• Di Yinuo
• WANG ZHUOCHENG

Assignees

• 河北科技大学

Dates

Publication Date

20260508

Application Date

20251222

Claims (3)

1. 1. A temperature control system for controlling the temperature of a CPU substrate in a partitioned manner by a thermoelectric cooler, comprising: A central control unit (10); A host communication interface (20) connected with the central control unit (10) and used for communicating with an external computer and receiving CPU load information; a power management module (30) for powering the components of the system; A plurality of drive units (41, 42, 43, 44) whose inputs are connected to the central control unit (10); A plurality of cylindrical thermoelectric cooler partitions (51, 52, 53, 54) arranged in an array on a CPU substrate (100) and connected to output ends of one of the driving units (41, 42, 43, 44), respectively; a plurality of cold end temperature sensors (61, 62, 63, 64) arranged on the CPU substrate (100) and corresponding to the positions of the cylindrical thermoelectric refrigerator partitions (51, 52,53, 54), and the output ends of the cold end temperature sensors are connected with the central control unit (10); A heat radiation fan (70); a fan driving switch (71) with a control end connected with the central control unit (10) and controlled by PWM signals, and an output end connected with the cooling fan (70); A hot end safety sensor (80) arranged on the radiator of the cylindrical thermoelectric refrigerator partitions (51, 52,53, 54), and the output end of which is connected with the central control unit (10); Wherein the central control unit (10) is configured to independently adjust the output power of each driving unit (41, 42,43, 44) and the PWM signal of the fan driving switch (71) according to the signals of the cold end temperature sensor (61, 62,63, 64) and the hot end safety sensor (80) and the working condition information from the host communication interface (20) so as to control the refrigeration intensity of the corresponding thermoelectric refrigerator partition and the rotating speed of the cooling fan; The central control unit (10) is further configured to boost the output power of the corresponding drive unit to an emergency power level for a predetermined response time when any of the cold side temperature sensors (61, 62,63, 64) detects a temperature exceeding a single core superheat threshold.
2. 2. A control method applied to the temperature control system according to claim 1, comprising the steps of: And a temperature control step: the central control unit (10) executes a corresponding control strategy according to the CPU load working condition: Under start-up conditions, controlling all drive units (41, 42,43, 44) to operate at a first power level, said first power level being 20% -30% of the rated power of the corresponding thermoelectric cooler partition; under the half-load working condition, the power of the corresponding driving units (41, 42,43, 44) is independently regulated according to the readings of the cold end temperature sensors (61, 62,63, 64), so that the core corresponding partition with higher temperature operates at a second power level, and the core corresponding partition with lower temperature operates at a third power level, wherein the second power level is 50-70% of rated power, and the third power level is 20-40% of rated power; Under full load conditions, controlling all drive units (41, 42,43, 44) to operate at a fourth power level, the fourth power level being 80% -100% of the rated power of the corresponding thermoelectric cooler partition; A fan control step: The central control unit (10) adjusts the PWM duty ratio of the fan driving switch (71) according to the signal of the hot end safety sensor (80) and the CPU working condition so as to control the rotating speed of the cooling fan (70): Controlling the fan to operate or shut down in a first rotational speed range (400-700 RPM) when the fan is in a start-up condition and the cold end temperatures are below a first temperature threshold (50 ℃); When the working condition is half-load and any cold end temperature is between a first temperature threshold value (50 ℃) and a second temperature threshold value (70 ℃), controlling the fan to operate in a second rotating speed range (800-1500 RPM); Controlling the fan to operate in a third speed range (1600-2100 RPM) when the full load condition is met and any cold end temperature is higher than a second temperature threshold (70 ℃); controlling the fan to operate at a maximum rotational speed (about 2500 RPM) when the hot side safety sensor (80) detects that the temperature exceeds a safety threshold (85 ℃); In the temperature control step, the central control unit (10) calculates the temperature deviation of each partition in real time through a PID algorithm, and dynamically adjusts the output power of a corresponding driving unit; In the fan control step, the first rotation speed range is 400-700 RPM, the second rotation speed range is 800-1500 RPM, the third rotation speed range is 1600-2100 RPM, the maximum rotation speed is about 2500-RPM, the first temperature threshold is 50 ℃, the second temperature threshold is 70 ℃, and the safety threshold is 85 ℃.
3. 3. The control method according to claim 2, wherein the central control unit (10) further receives a CPU load pre-warning signal through the host communication interface (20) and adjusts the operation states of the cylindrical thermoelectric refrigerator partitions (51, 52,53, 54) and the cooling fan (70) in advance based on the signal to realize pre-cooling.

Description

Temperature control system and control method for controlling CPU substrate to be cooled by cylindrical thermoelectric refrigerator in partition mode Technical Field A temperature control system and a control method for controlling CPU substrate cooling by cylindrical thermoelectric refrigerator partition, in particular to a temperature control system and a control method for dynamically adjusting cylindrical thermoelectric refrigerator partition and a cooling fan according to CPU working conditions, which belong to the field of electronic equipment thermal management. Background With the continuous progress of integrated circuit technology and the wide application of multi-core architecture, the power density of CPU continues to rise, and the problems of local hot spot formation and heat accumulation are becoming more serious. The high temperature not only causes the carrier mobility of the semiconductor device to decrease and the leakage current to increase, but also causes the thermal stress concentration to affect the long-term reliability and performance stability of the chip. Therefore, efficient and accurate thermal management has become a key element in the design and optimization of high performance computing systems. The current mainstream heat dissipation scheme mainly comprises technologies such as air cooling, water cooling and phase change cooling which are emerging in recent years. The air cooling system depends on the combination of the radiating fins and the fan, has simple structure and controllable cost, but the radiating capacity is obviously restricted by the environment temperature and the air flow organization, and particularly in small-sized and high-integration equipment, the air cooling is difficult to cope with instantaneous high heat load, and the inherent contradiction exists between noise control and energy efficiency ratio. The water cooling system takes away heat through liquid circulation, has higher heat capacity and heat conducting property, and is suitable for high-power scenes. However, the water cooling system has a complex structure and comprises a plurality of parts such as a pump, a water tank, a pipeline, a cold head and the like, liquid leakage is easily caused by ageing, vibration loosening or improper assembly of materials in long-term operation, once the cooling liquid leaks to the surface of a main board or a CPU, serious faults such as short circuit, corrosion and the like are easily caused, and the maintenance cost is high and the risk is obvious. The thermoelectric refrigerator (TEC for short) realizes directional migration of heat through direct current drive based on Peltier effect, has the outstanding advantages of rapid response, accurate temperature control, no moving parts, high reliability, easy integration and the like, and is particularly suitable for electronic equipment sensitive to temperature fluctuation and limited in space. Meanwhile, the hot end of the TEC can continuously release heat in the refrigerating process, if the response of a heat dissipation system is delayed, the temperature of the hot end is easy to rise, the refrigerating efficiency is reduced, and even the performance of the thermoelectric module is reduced. In addition, the energy efficiency optimization and cooperative control strategy of the existing thermoelectric refrigeration system under the dynamic load condition is still single, and an intelligent temperature control mechanism which is deeply fused with the actual running state of the CPU is lacked. Therefore, the invention provides a temperature control system and a temperature control method for a cylindrical thermoelectric refrigerator based on the cooperation of partition independent regulation and dynamic heat dissipation, which aim to realize the fine management of CPU multi-core temperature, improve the overall energy efficiency and operation safety of the system, and particularly show excellent adaptability and reliability under high-load and high-variable-load working conditions. Disclosure of Invention Aiming at the defects of the existing air cooling, water cooling and other heat dissipation modes in terms of response speed, temperature control precision and system safety, and combining the characteristics and application bottlenecks of a thermoelectric refrigeration technology, the invention provides a temperature control system and a control method for controlling the temperature reduction of a CPU substrate by a cylindrical thermoelectric refrigerator in a partitioning way. The technical scheme adopted for solving the technical problems is as follows: A temperature control system for controlling CPU substrate cooling by a cylindrical thermoelectric refrigerator partition comprises a central control unit (10), a host communication interface (20), a power management module (30), driving units (41, 42,43, 44), cylindrical thermoelectric refrigerator partitions (51, 52,53, 54), cold end temperature sensors (6