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CN-121995989-A - Array type semiconductor refrigeration sheet temperature control device and control method thereof

CN121995989ACN 121995989 ACN121995989 ACN 121995989ACN-121995989-A

Abstract

The invention relates to an array type semiconductor refrigerating sheet temperature control device which comprises a power supply module, a voltage output module, an infrared thermal imaging module, an MCU main control module, a refrigerating sheet array and an upper computer, wherein the MCU main control module is used for controlling multi-path voltage output of the voltage output module, receiving multi-path current signals acquired by the voltage output module, receiving temperature signals acquired by the infrared thermal imaging module, performing double-loop PID calculation and communicating with the upper computer. The invention also discloses a control method of the array type semiconductor refrigeration sheet temperature control device. The invention adopts a mode of outputting the output voltage of the analog voltage control voltage output module by the DAC to replace a PWM control mode, has lower design cost than a high-frequency PWM circuit, and can realize the temperature control of different refrigerating sheets by outputting multiple paths of voltage control refrigerating sheets and monitoring the temperatures of different refrigerating sheets by the infrared thermal imaging module, thereby outputting different temperature fields.

Inventors

  • ZENG WEI
  • Kong Zhilong
  • Wang Faniu
  • ZENG YE

Assignees

  • 安徽大学

Dates

Publication Date
20260508
Application Date
20260211

Claims (9)

  1. 1. The array type semiconductor refrigeration sheet temperature control device is characterized by comprising: the power supply module is used for providing initial input voltage and supplying power to the voltage output module, the MCU main control module and the refrigerating sheet array; The voltage output module is used for converting the initial input voltage into multiple 400mV to 6.6V voltages and outputting the multiple 400mV to the refrigerating sheet array; The infrared thermal imaging module is used for acquiring temperature signals of the refrigerating sheets at different positions of the refrigerating sheet array or objects carried on the refrigerating sheets; The MCU main control module is used for controlling the multi-path voltage output of the voltage output module, receiving multi-path current signals acquired by the voltage output module, receiving temperature signals acquired by the infrared thermal imaging module, performing double-loop PID calculation and communicating with the upper computer; the refrigerating sheet array is used for receiving the multipath adjustable voltages output by the voltage output module and realizing temperature control of the refrigerating sheets in different areas or objects borne on the refrigerating sheets; the upper computer is used for communicating with the MCU main control module and setting the temperatures of different areas of the refrigerating sheet array.
  2. 2. The array type semiconductor refrigerating sheet temperature control device of claim 1, wherein the power supply module adopts a switching power supply with the model number of YX5603, the MCU main control module adopts an STM32F104ZET6 controller, the infrared thermal imaging module adopts an MLX90642BAC, and the refrigerating sheet array adopts an HT064304 and 6X 6 array.
  3. 3. The temperature control device for the array type semiconductor refrigerating plate of claim 1, wherein the voltage output module comprises a DAC circuit, a plurality of adjustable voltage reduction circuits and a current sampling circuit, the DAC circuit is connected with the plurality of adjustable voltage reduction circuits, the plurality of adjustable voltage reduction circuits are connected with the current sampling circuit, meanwhile, the DAC circuit and the current sampling circuit are connected with the MCU main control module, and the plurality of adjustable voltage reduction circuits are connected with the power module and the refrigerating plate array. The DAC circuit comprises a DAC chip U2, a capacitor C8 and a capacitor C9, wherein the DAC chip U2 adopts a BH2221FV chip, a power supply end VCC of the BH2221FV chip is connected with a 3V3 power supply provided by an MCU main control module through the capacitor C8, an analog power supply input end VDD of the BH2221FV chip is connected with the 3V3 power supply provided by the MCU main control module through the capacitor C9, the DAC chip provides multiple paths of analog voltage output ends, namely VO1 to VO12, and is connected to a multiple paths of adjustable voltage reduction circuits of a voltage output module and is used for outputting multiple paths of voltages, and a communication port of the DAC chip U2 is connected to a second communication port of the MCU control module and is used for communicating with the MCU control module so as to control the output voltage value of the DAC circuit; The multi-path adjustable voltage reduction circuit consists of a multi-path adjustable voltage reduction circuit with the same structure, the single adjustable voltage reduction circuit comprises a DCDC power supply chip U1, capacitors C1, C2, C3, C4, C5, C6 and C7, resistors R1, R2 and R3, diodes D1 and D2, an inductor L1 and a current sampling resistor R4, the DCDC power supply chip U1 adopts a YX5603 chip, the initial input voltage of a power supply module is connected to a power supply input pin VIN of the DCDC power supply chip U1 through a parallel capacitor C1, a capacitor C2 and a capacitor C3, an output pin SW of the DCDC power supply chip U1 is connected in series with the inductor L1, the capacitors C4, C5 and C6 are connected in parallel as anodes of voltage output ends, one end of the current sampling resistor R4 is grounded, the other end of the current sampling resistor R4 is used as cathodes of the voltage output ends, a feedback pin FB of the DCDC power supply chip U1 is respectively connected with the resistors R1 and R2 and R3, the other ends of the capacitors R1 and C1 are respectively connected with the anodes of the capacitors C1 and C6, and the other ends of the capacitors C1 and C6 are respectively connected with the anodes of the diodes D1 and C6 are connected with the anodes of the diodes.
  4. 4. The array type semiconductor refrigerating plate temperature control device of claim 1, wherein the refrigerating plate array comprises an alumina ceramic plate, a plurality of semiconductor refrigerating plates, a radiator fan, a transfer circuit board and a supporting die, the semiconductor refrigerating plates are adhered to the alumina ceramic plate through silicone grease to form an array, two wires of the semiconductor refrigerating plates are connected with the transfer circuit board through holes in the alumina ceramic plate, and the supporting die is used for assembling the transfer circuit board, the radiator fan and the alumina ceramic plate.
  5. 5. The temperature control device for the array type semiconductor refrigerating chip of claim 3, wherein the output voltage range of the adjustable voltage reduction circuit is realized by controlling the resistance values of the resistors R1, R2 and R3, and the output voltage of the DAC circuit is obtained by At 0, to ensure maximum output value The following formula needs to be satisfied: ; Wherein, the Feeding back pin reference voltage value for DCDC power supply chip U1 in the following steps At a maximum of 3.3V, to ensure that the minimum output value is The following formula needs to be satisfied: 。
  6. 6. The array type semiconductor refrigerating sheet temperature control device according to claim 3, wherein the current sampling circuit comprises an analog switch U3, a current sensing amplifier U4, a capacitor C10 and a capacitor C11, wherein the analog switch U3 adopts a 74HC4067PW chip, the current sensing amplifier U4 adopts an INA226 chip, a power input pin VCC of the analog switch U3 is connected with a 3V3 power supply provided by an MCU control module through the capacitor C10, and a power input pin VCC of the current sensing amplifier U4 is connected with the 3V3 power supply provided by the MCU control module through the capacitor C11; The multiple switch input pins Y1 to Y9 of the analog switch U3 are respectively connected with the negative electrode of the voltage output end of each path in the multipath adjustable voltage reduction circuit of the voltage output module, the switch output pin Z is connected with the input pin VIN+ of the current sense amplifier U4, the gating signal pins S0 to S3 are connected to the analog switch control output end of the MCU control module, the communication ports SDA and SCL of the current sense amplifier U4 are connected with the third communication port of the MCU control module and are used for communicating with the MCU control module, and therefore collected current signals are transmitted.
  7. 7. The method for controlling an arrayed semiconductor refrigeration sheet temperature control device according to any one of claims 1 to 6, characterized in that the method comprises the following sequential steps: (1) Setting a target area and a target temperature which need to be controlled in an upper computer, and transmitting the target area and the target temperature to an MCU main control module; (2) The infrared thermal imaging module collects the temperature of the refrigerating sheet or the articles carried on the sheet in the target area and transmits the temperature to the MCU main control module; (3) The MCU main control module calculates an outer ring temperature ring by adopting a double-ring PID algorithm to obtain a target output current ; (4) The MCU main control module collects the current flowing through the refrigerating sheet of the target area; (5) MCU main control module calculates steady-state feedforward current Calculating an inner loop current loop by adopting a double loop PID algorithm to obtain the output voltage required by the DAC circuit And controls the DAC circuit output of the voltage output module ; (6) Every time an elapsed time Repeating the steps (2) to (5).
  8. 8. The method of controlling an array type semiconductor refrigeration sheet temperature control device according to claim 7, wherein in the step (3), the target output current is obtained The calculation formula of (2) is as follows: ; Wherein, the Indicating the instant at which the current PID is calculated, Indicating the time of the last PID calculation, Is the ratio coefficient of the temperature loop, For the temperature error calculated for the current time instant, In order to make the temperature error at the previous moment, Is the integral coefficient of the temperature loop, Is the integral coefficient of the temperature loop, For sampling period, temperature error The calculation formula of (2) is as follows: ; Wherein, the The temperature acquired at the time is calculated for the current PID, The required temperature is set for the upper computer.
  9. 9. The method of controlling an array type semiconductor refrigeration sheet temperature control device according to claim 7, wherein in the step (5), the steady-state feedforward current is supplied The calculation formula of (2) is as follows: ; Wherein, the For the seebeck coefficient of the crystal, For the resistance of the cooling plate, Is used for the heat conduction of the refrigerating sheet, The temperature of the hot surface of the refrigerating sheet; setting the required temperature for the upper computer; calculating an inner loop current loop: ; Wherein, the Is the ratio coefficient of the current loop, As the current error at the present moment, In order to make the current error at the previous moment, Is the integral coefficient of the current loop, Is the differential coefficient of the current loop, In order to sample the period of time, An output voltage required for the DAC circuit; Current error at the present time The calculation formula of (2) is as follows: ; Wherein, the The actual current acquired at the present moment.

Description

Array type semiconductor refrigeration sheet temperature control device and control method thereof Technical Field The invention relates to the technical field of refrigeration sheet arrays, in particular to an array type semiconductor refrigeration sheet temperature control device and a control method thereof. Background The traditional semiconductor refrigeration sheet driving scheme is mainly controlled by adopting a mode of PWM (pulse width modulation) to adjust the duty ratio of output voltage, and is particularly divided into two modes of PWM duty ratio adjustment under a fixed voltage and PWM duty ratio adjustment under a constant current mode. Under the regulation PWM mode of fixed voltage and fixed current, when the PWM signal is at high level, the semiconductor refrigerating sheet normally refrigerates, the temperature of the cold face is reduced, and the temperature of the hot face is increased, when the PWM signal is at low level, the semiconductor refrigerating sheet stops refrigerating, and the temperature of the cold face is influenced by the temperature from the environment and the temperature of the hot face to cause temperature rise due to the existence of temperature difference. The working mode of the PWM shows that the refrigerating sheet is always in a working and non-working circulation state, obvious periodical temperature fluctuation is caused, and when the temperature of the cold surface is controlled in a range which is smaller than the ambient temperature, the duty ratio of the PWM is larger, the non-working state of the refrigerating sheet is longer than that in the working state, the upward fluctuation range of the cold surface temperature is increased compared with the set constant temperature, otherwise, when the temperature is controlled in a range which is larger than the ambient temperature, the duty ratio of the PWM is smaller, the downward fluctuation range of the cold surface temperature is increased compared with the set constant temperature, and the switching frequency of the PWM needs to be increased to reduce the fluctuation range, the larger the switching frequency of the PWM is, the smaller the temperature fluctuation range is, and the higher-frequency PWM is used for greatly improving the design cost and complexity of the circuit. In addition, the PWM operation mode easily causes the problem of local thermal stress of the semiconductor refrigeration sheet, and because of frequent on-off current, the semiconductor crystal grain inside the refrigeration sheet repeatedly undergoes thermal expansion and contraction, and this thermal cycle can generate mechanical stress, which can reduce the reliability and lifetime of the refrigeration sheet for a long time, and even cause failure of internal welding points or crystal grain breakage, so that the refrigeration sheet cannot work normally. In the aspect of temperature output, many refrigerating sheet array devices only allow a plurality of refrigerating sheets to input the same driving voltage, which means that different temperature controls cannot be output to each refrigerating sheet of the refrigerating sheet array, only a single temperature field can be formed, and the refrigerating sheet array device is not beneficial to use in some scenes requiring part of different temperature controls. Disclosure of Invention In order to solve the problems that the service life of a refrigerating sheet is reduced due to the fact that the refrigerating sheet crystal particles repeatedly undergo thermal expansion and cold contraction under the conditions of frequent on-off current of a PWN control refrigerating sheet under low frequency and high duty ratio and the design cost of a high-frequency PWM circuit is high, the primary aim of the invention is to provide an array type semiconductor refrigerating sheet temperature control device which adopts an output voltage mode of a DAC output analog voltage control voltage output module to replace PWM control, has low design cost and realizes temperature control of different refrigerating sheets, and accordingly outputs different temperature fields. In order to achieve the purpose, the invention adopts the following technical scheme that the temperature control device of the array type semiconductor refrigerating sheet comprises: the power supply module is used for providing initial input voltage and supplying power to the voltage output module, the MCU main control module and the refrigerating sheet array; The voltage output module is used for converting the initial input voltage into multiple 400mV to 6.6V voltages and outputting the multiple 400mV to the refrigerating sheet array; The infrared thermal imaging module is used for acquiring temperature signals of the refrigerating sheets at different positions of the refrigerating sheet array or objects carried on the refrigerating sheets; The MCU main control module is used for controlling the multi-path voltage output of the voltage o