Search

CN-121996043-A - Embedded liquid cooling system for computing equipment and control method

CN121996043ACN 121996043 ACN121996043 ACN 121996043ACN-121996043-A

Abstract

The application belongs to the field of temperature control of computing equipment, and relates to an embedded liquid cooling system for the computing equipment and a control method thereof, wherein a heat dissipation circulation loop for circulating flow of cooling liquid in an immersion cavity is constructed through a liquid inlet component, a liquid inlet pipe group, a liquid outlet component, a liquid outlet pipe group and external refrigeration equipment, and then the heat dissipation circulation loop is matched with a circulation fan group arranged in an air duct between the immersion cavity and a server box body, so that effective heat dissipation of a main board can be realized; the target temperature data of the immersion cavity are divided into a plurality of grades, the connection relation among the first liquid inlet connector, the second liquid inlet connector, the first liquid outlet connector, the second liquid outlet connector and external refrigeration equipment with different height differences is controlled according to the temperature grades, and then the height deviation of each liquid inlet connector and each liquid outlet connector can be utilized to effectively adjust the heat exchange efficiency of cooling liquid in the immersion cavity, so that the power consumption of the external refrigeration equipment can be reduced while the main board temperature is effectively radiated.

Inventors

  • LI CAN
  • ZHANG HUAI
  • DONG QINGPING
  • ZHANG QI

Assignees

  • 中国船舶集团有限公司第七〇九研究所

Dates

Publication Date
20260508
Application Date
20260130

Claims (10)

  1. 1. The embedded liquid cooling system for the computing equipment is characterized by comprising an immersion cavity (102), a liquid inlet component (2) and a liquid outlet component (3), wherein the immersion cavity (102) is arranged in a server box body (1), cooling liquid used for coating a main board (101) of the server box body (1) and a plurality of uniformly distributed temperature sensors are arranged in the immersion cavity (102), an air duct (103) is arranged between the immersion cavity (102) and the server box body (1), and a circulating fan group (104) is arranged in the air duct (103); The liquid inlet assembly (2) is communicated with the liquid outlet assembly (3) through the side end face of the immersion cavity (102), a liquid inlet pipe group (23) communicated with the liquid inlet assembly (2) is arranged in the immersion cavity (102), a liquid outlet pipe group (33) communicated with the liquid outlet assembly (3), and an external refrigeration device is connected to one end, far away from the immersion cavity (102), of the liquid inlet assembly (2) and the liquid outlet assembly (3).
  2. 2. The in-line liquid cooling system according to claim 1, characterized in that the liquid inlet assembly (2) comprises at least a first liquid inlet connector (21) and a second liquid inlet connector (22), the first liquid inlet connector (21) being arranged at a lower level than the second liquid inlet connector (22).
  3. 3. An in-line liquid cooling system according to claim 2, characterized in that the liquid outlet assembly (3) comprises at least a first liquid outlet connector (31) and a second liquid outlet connector (32), the first liquid outlet connector (31) being arranged at a lower level than the second liquid outlet connector (32).
  4. 4. The in-line liquid cooling system according to claim 3, wherein the liquid inlet pipe group (23) comprises a first liquid inlet pipe (231) connected with the first liquid inlet connector (21), a second liquid inlet pipe (232) connected with the second liquid inlet connector (22), the liquid outlet pipe group (33) comprises a first liquid outlet pipe (331) connected with the first liquid outlet connector (31), a second liquid outlet pipe (332) connected with the second liquid outlet connector (32), and flow rate sensors are arranged in the liquid inlet pipe group (23) and the liquid outlet pipe group (33).
  5. 5. The embedded liquid cooling system according to claim 4, wherein the first liquid outlet pipe (331), the second liquid outlet pipe (332), the first liquid inlet pipe (231) and the second liquid inlet pipe (232) are all provided with a plurality of liquid guiding through holes.
  6. 6. A control method for an in-line liquid cooling system of a computing device, for controlling the in-line liquid cooling system according to any one of claims 1 to 5, comprising: acquiring temperature data of each temperature sensor in the immersion cavity (102), and preprocessing the temperature data to obtain target temperature data; Judging the temperature grade of the target temperature data based on a preset temperature grade dividing standard, wherein the preset temperature at least comprises five grades; and controlling the opening and closing of the first liquid outlet connector (31), the second liquid outlet connector (32), the first liquid inlet connector (21), the second liquid inlet connector (22) and the circulating fan group (104) based on the temperature grade of the target temperature data.
  7. 7. The method of claim 6, wherein the preprocessing the temperature data comprises performing outlier stripping, interpolation filling and averaging on the temperature data of each temperature sensor to obtain target temperature data.
  8. 8. The method for controlling an in-line liquid cooling system according to claim 7, wherein controlling the opening and closing of the first liquid outlet connector (31), the second liquid outlet connector (32), the first liquid inlet connector (21), the second liquid inlet connector (22) and the circulation fan group (104) based on the temperature level at which the target temperature data is located comprises: When the temperature grade of the target temperature data is the first grade, the first liquid inlet connector (21), the first liquid outlet connector (31) and the external refrigeration equipment are connected; When the temperature grade of the target temperature data is a second grade, the connection between the second liquid inlet connector (22), the second liquid outlet connector (32) and external refrigeration equipment is opened; When the temperature grade of the target temperature data is a third grade, the first liquid inlet connector (21), the first liquid outlet connector (31), the second liquid outlet connector (32) and external refrigeration equipment are connected; And when the temperature grade of the target temperature data is the fourth grade, opening the connection among the second liquid inlet connector (22), the first liquid outlet connector (31), the second liquid outlet connector (32) and external refrigeration equipment.
  9. 9. The control method of an in-line liquid cooling system according to claim 8, wherein when the temperature level of the target temperature data is a fifth level, the connection between the first liquid inlet connector (21), the second liquid inlet connector (22), the first liquid outlet connector (31), the second liquid outlet connector (32) and the external refrigeration equipment is opened, and the circulation fan group (104) is opened.
  10. 10. An electronic device, comprising: At least one memory for storing a computer program; at least one processor for executing a memory-stored program, which processor is adapted to perform the method according to any of claims 6-9 when the memory-stored program is executed.

Description

Embedded liquid cooling system for computing equipment and control method Technical Field The application belongs to the field of temperature control of computing equipment, and particularly relates to an embedded liquid cooling system for the computing equipment and a control method. Background In the age of rapid development of intelligent computing, in order to better respond to the national localization construction task, more and more domestic server products are emerging which are designed and developed by taking domestic CPU as a core, but compared with more mature imported CPU, the domestic CPU has the defects in computing power performance and manufacturing process, which means that more CPU needs to be carried on a server main board, and more computing cards and memory strips are equipped to realize the expected performance requirements, and the working state is greatly influenced by heat generation. Compared with air cooling heat dissipation, the immersed liquid cooling heat dissipation device can effectively dissipate heat of all hardware devices in the computing device in time, and can effectively inhibit local overheating. However, a large number of elements such as GPU computing cards, CPUs and memory strips are arranged on the motherboard inside the computing device, and the heat generated by the elements in the full-speed working state and the partial board card working state is different, if the actual heat generation of the server motherboard is not distinguished, the heat is always dissipated at the highest heat dissipation rate, and a large amount of energy waste of the heat dissipation system can be caused. Disclosure of Invention Aiming at the defects in the prior art, the application provides an embedded liquid cooling system for a computing device and a control method, which aim to remarkably reduce the extra energy consumption of the heat dissipation system while keeping the heat dissipation efficiency of each component in the computing device. In a first aspect, the application provides an embedded liquid cooling system for a computing device, comprising an immersion cavity, a liquid inlet component and a liquid outlet component, wherein the immersion cavity is arranged in a server box body, cooling liquid for coating a main board of the server box body and a plurality of uniformly distributed temperature sensors are arranged in the immersion cavity, an air duct is arranged between the immersion cavity and the server box body, and a circulating fan group is arranged in the air duct; The liquid inlet component and the liquid outlet component are communicated with the side end face of the immersion cavity, a liquid inlet pipe group communicated with the liquid inlet component is arranged in the immersion cavity, a liquid outlet pipe group communicated with the liquid outlet component is arranged in the immersion cavity, and one ends, far away from the immersion cavity, of the liquid inlet component and the liquid outlet component are connected with external refrigeration equipment. The cooling liquid is transmitted to the liquid inlet component from the external refrigeration equipment through an external liquid cooling pipeline, enters the immersion cavity through a liquid inlet pipe group in the liquid inlet component, flows in the whole cavity to take away heat, flows to the liquid outlet component through the liquid outlet pipe group, passes through the liquid outlet component to the external refrigeration equipment, cools and dissipates heat through the cooling liquid, and a heat dissipation circulation loop is formed between the liquid cooling components. Further, the liquid inlet assembly comprises at least one first liquid inlet connector and at least one second liquid inlet connector, and the setting height of the first liquid inlet connector is lower than that of the second liquid inlet connector. Further, the liquid outlet assembly comprises at least one first liquid outlet connector and at least one second liquid outlet connector, and the setting height of the first liquid outlet connector is lower than that of the second liquid outlet connector. The setting height of the first liquid inlet connector is lower than that of the second liquid inlet connector, the setting height of the first liquid outlet connector is lower than that of the second liquid outlet connector, and the setting method has the advantage that liquid flows faster under the action of gravity, namely the heat exchange efficiency of cooling liquid in the immersion cavity can be effectively regulated through the height deviation of each liquid inlet connector and each liquid outlet connector. Because the external refrigeration equipment needs to cool the cooling liquid after heat exchange, and the opening of the liquid outlet connector and the liquid inlet connector with different heights can cause different temperature differences of the cooling liquid flowing into the external refrigeration equipment, a