CN-121997645-A - Adhesion prediction method considering temperature influence

CN121997645ACN 121997645 ACN121997645 ACN 121997645ACN-121997645-A

Abstract

The invention provides an adhesion prediction method considering temperature influence, which comprises the steps of establishing a calculation model comprising a rigid sphere and a deformable substrate, applying an adhesion force field and a temperature field at a contact interface, driving the rigid sphere to complete the contact and friction process with the deformable substrate, calculating differential point directional force of the contact interface, integrating to obtain temperature related adhesion performance data, judging the interface contact state according to a calculated force signal and a stress state, dynamically updating the adhesion force field, taking thermal strain as a variable, obtaining temperature related adhesion performance data based on different thermal strain conditions, and establishing a quantitative association relation between the thermal strain and the temperature related adhesion performance data. The method has the beneficial effects of realizing the prediction of the influence of the thermal expansion coefficient on the interfacial adhesion and the peeling force, making up the blank of lacking a temperature field in the existing prediction method, improving the photoelectric conversion efficiency of the photovoltaic system in lunar exploration/fire engineering, reducing the research and development period and reducing the economic loss.

Inventors

SUN XINHAO
XU WEI
LI JIANPING
LU WEI
CHEN XINGNA
YANG ZHE
HUANG XIAO
YANG LUMING

Assignees

中电科蓝天科技股份有限公司

Dates

Publication Date: 20260508
Application Date: 20251231

Claims (10)

1. A method of predicting adhesion in consideration of temperature influence, comprising the steps of: step one, establishing a calculation model comprising a rigid sphere and a deformable substrate, and applying an adhesion force field and a temperature field at a contact interface of the rigid sphere and the deformable substrate; Setting boundary conditions of the calculation model, restraining the degree of freedom of the bottom edge of the deformable substrate, and driving the rigid sphere to complete the contact and friction process with the deformable substrate in a displacement control mode; step three, running the calculation model, calculating differential point directional force of the contact interface, integrating to obtain temperature-related adhesion performance data, judging interface contact state and dynamically updating the adhesion force field according to the calculated force signal and stress state, wherein the temperature-related adhesion performance data comprises adhesion force, pull-off force, friction force and normal force; and step four, repeatedly executing the step three by taking the thermal strain as a variable, and establishing a quantitative association relation between the thermal strain and the temperature-related adhesive performance data based on the temperature-related adhesive performance data obtained under different thermal strain conditions.
2. The method for predicting adhesion taking into consideration temperature effects according to claim 1, wherein said adhesion force By equation (d) Calculated, wherein In terms of the adhesion per unit area, In order to provide a contact area for the contact area, In the case of a discrete number of the particles, Is the direction vector of the adhesion force per unit contact area.
3. The method for predicting adhesion taking into consideration temperature effects according to claim 2, wherein said adhesion per unit area By equation (d) Calculated, wherein For the distance of the surface to be the distance, In order to balance the spacing between the two, The work of the adhesion is performed in such a way that, Is the relative displacement.
4. The method for predicting adhesion taking into consideration temperature effects according to claim 1, wherein said thermal strain is used as a reference By equation (d) Calculating the temperature-dependent stress Wherein In order to have a temperature-dependent modulus of elasticity, As a function of the total strain associated with temperature, In order to be the amount of change in temperature, Is the temperature dependent coefficient of thermal expansion.
5. The method for predicting sticking in consideration of temperature influence as set forth in claim 4, wherein said frictional force is an integral of shear stress in a frictional path, and a tangential component of said temperature-dependent stress is said shear stress.
6. The method of predicting adhesion taking into account temperature effects of claim 4, wherein said normal force is an integral of a normal component of said temperature dependent stress at a contact area.
7. The method for predicting adhesion taking into consideration temperature effects according to claim 1, wherein said interfacial contact state is determined by an equation Make a judgment when When the current stress state does not reach the yield limit, the material keeps elastic Representing that the current stress state exceeds the yield limit, said interfacial contact state being such that plastic deformation occurs, said adhesive force field needs to be updated, wherein, For the Mises equivalent stress, the stress is, As a function of the deflection stress tensor, Is a temperature dependent yield stress.
8. The method for predicting adhesion taking into account temperature effects of claim 7, wherein said temperature dependent yield stress By equation (d) Calculated, wherein As a temperature-dependent initial yield stress, In order to provide a temperature-dependent hardening index, In order to harden the modulus of the material, Is equivalent plastic strain.
9. The method for predicting adhesion taking into consideration temperature effects as set forth in claim 8, wherein when said interfacial contact state is plastic deformation, an evolution equation of said equivalent plastic strain is Wherein In order to be an equivalent plastic strain increment, Is the shear modulus.
10. The method for predicting adhesion taking into account temperature effects as set forth in claim 9, wherein the equivalent plastic strain increase By equation (d) Calculation of wherein Is the incremental tensor of plastic strain.

Description

Adhesion prediction method considering temperature influence Technical Field The invention belongs to the technical field of adhesion, and particularly relates to an adhesion prediction method considering temperature influence. Background When the contact scale reaches the micrometer or nanometer level, the adhesion effect becomes a dominant factor of interface interaction, and the effect is particularly prominent in a photovoltaic system of deep space detection tasks such as lunar exploration, fire exploration and the like, and becomes a key problem affecting the reliability and performance of the system. For example, the deposition and adhesion of Mars dust on the surface of a solar panel greatly reduce the performance of the solar panel of a Mars vehicle with the opportunity, while it is speculated that Mars wind can remove part of dust but can not fundamentally avoid the adhesion risk, the accumulation of dust on the wing of the solar cell can reduce the conversion efficiency of the battery, and when serious, the dust can cause the partial shielding of a photovoltaic component to generate a hot spot effect and cause partial high temperature, finally cause irreversible damage of the photovoltaic system, and the adhesion prediction of the visible micro/nano-scale contact surface is important for the photovoltaic system and deep space exploration engineering. The existing adhesion prediction model has core defects, and the influence of temperature on the adhesion process is not considered. In the lunar exploration/fire exploration task, the lunar environment temperature range is-143 ℃ to 117 ℃, the Mars environment average temperature range is-125 ℃ to 35 ℃, the extreme temperature can obviously change the mechanical property and thermal deformation state of the material, the material is easy to harden and embrittle at low temperature, softening or thermal degradation can occur at high temperature, and the thermal stress (generated by the thermal expansion and contraction of the material) caused by temperature change can directly influence the interface contact state and the adhesion. The complex influence of the temperature on the adhesion performance makes the existing model lacking the consideration of the temperature field unable to accurately predict the adhesion behavior under the extreme environment, and is difficult to meet the actual demands of engineering scenes such as deep space exploration photovoltaic systems, etc., so that it is highly desirable to provide an adhesion prediction method considering the temperature effect. Disclosure of Invention In order to solve the technical problems, the invention provides a method for predicting adhesion by considering temperature influence, which is particularly suitable for predicting adhesion by considering temperature influence in micrometer or nanometer scale. The technical scheme adopted by the invention is that the adhesion prediction method considering the temperature influence comprises the following steps: step one, establishing a calculation model comprising a rigid sphere and a deformable substrate, and applying an adhesion force field and a temperature field at a contact interface of the rigid sphere and the deformable substrate; Setting boundary conditions of the calculation model, restraining the degree of freedom of the bottom edge of the deformable substrate, and driving the rigid sphere to complete the contact and friction process with the deformable substrate in a displacement control mode; step three, running the calculation model, calculating differential point directional force of the contact interface, integrating to obtain temperature-related adhesion performance data, judging interface contact state and dynamically updating the adhesion force field according to the calculated force signal and stress state, wherein the temperature-related adhesion performance data comprises adhesion force, pull-off force, friction force and normal force; and step four, repeatedly executing the step three by taking the thermal strain as a variable, and establishing a quantitative association relation between the thermal strain and the temperature-related adhesive performance data based on the temperature-related adhesive performance data obtained under different thermal strain conditions. Further, the adhesion forceBy equation (d)Calculated, whereinIn terms of the adhesion per unit area,In order to provide a contact area for the contact area,In the case of a discrete number of the particles,Is the direction vector of the adhesion force per unit contact area. Further, the adhesion per unit areaBy equation (d)Calculated, whereinFor the distance of the surface to be the distance,In order to balance the spacing between the two,The work of the adhesion is performed in such a way that,Is the relative displacement. Further, according to the thermal strainBy equation (d)Calculating the temperature-dependent stressWhereinIn order to have a temperature-depend