CN-121998115-A - Quantum chip

CN121998115ACN 121998115 ACN121998115 ACN 121998115ACN-121998115-A

Abstract

The present disclosure provides a quantum chip including a quantum bit configured to generate an electrical signal, and an electro-optic modulator electrically connected between the electro-optic modulator and the quantum bit and configured to modulate an optical signal transmitted in the electro-optic modulator based on the electrical signal input by the quantum bit, such that the optical signal has quantum bit information generated by the quantum bit. The quantum chip combines the quantum bit with the electro-optic modulator, utilizes the high-speed response characteristic of the electro-optic modulator, timely utilizes the electric signal generated by the quantum bit to modulate the optical signal in the electro-optic modulator, and enables the electric signal generated by the quantum bit to be transmitted in the form of the optical signal.

Inventors

AN ZHAO
WANG GUANGYUE
CHEN JIE
ZHANG XIANG

Assignees

量子科技长三角产业创新中心

Dates

Publication Date: 20260508
Application Date: 20241104

Claims (10)

1. A quantum chip, comprising: A qubit configured to generate an electrical signal; And the electro-optic modulator is electrically connected with the quantum bit and is configured to modulate an optical signal transmitted in the electro-optic modulator based on an electric signal input by the quantum bit so that the optical signal has quantum bit information generated by the quantum bit.
2. The quantum chip of claim 1, further comprising a base plate having a first region, a second region, and a first pad disposed on an edge of the base plate, the first pad surrounding the first region and the second region, the first region configured to secure the qubit, the second region configured to secure the electro-optic modulator, the first pad configured to electrically connect the qubit and a microwave cable.
3. The quantum chip of claim 1, wherein a ceramic shell is further provided outside the electro-optic modulator, the ceramic shell configured to cover and seal the electro-optic modulator to avoid interference of the electro-optic modulator with the qubit.
4. The quantum chip of claim 2, wherein the electro-optic modulator comprises: an input optical fiber configured to input the optical signal; a beam splitter connected to the input optical fiber and configured to split the optical signal; An electro-optic modulation structure coupled to the beam splitter and configured to modulate a phase of an optical signal from the beam splitter; A beam combiner connected to the electro-optical modulation structure, the beam combiner interfering an optical signal from the electro-optical modulation structure; and an output optical fiber connected to the beam combiner and outputting an optical signal from the beam combiner.
5. The quantum chip of claim 4, wherein the electro-optic modulation structure comprises at least 1 pair of modulation arms, which may be connected in parallel or cascaded.
6. The quantum chip of claim 4, wherein the electro-optic modulator is a plurality of the electro-optic modulators surrounding the qubit on the backplane.
7. The quantum chip of claim 4 or 5, wherein each pair of modulation arms is provided with a pair of signal electrodes and ground electrodes having opposite electric field directions.
8. The quantum chip of claim 4, wherein the electro-optic modulator comprises: A substrate; An optical waveguide layer disposed on the substrate; an electro-optic modulation layer disposed on the optical waveguide layer.
9. The quantum chip of claim 8, wherein the coupling between the electro-optic modulation layer and the input optical fiber and/or the coupling between the electro-optic modulation layer and the output optical fiber comprises any one of end-face coupling, optical fiber beveling, micro-mirrors, focused-grating coupling, lensed optical fiber, flip-chip, photonic interposer.
10. The quantum chip of claim 4, wherein the output fiber and the input fiber are capable of transmitting the optical signal at a temperature of 4K.

Description

Quantum chip Technical Field The present disclosure relates to the field of quantum computing, and in particular, to a quantum chip. Background In the field of quantum computing, superconducting quantum chips have a crucial role. Superconducting quantum chips typically operate in very low temperature environments. However, this extreme environment presents a significant challenge for the transmission of signals. Currently, signal transmission is mainly achieved through microwave cables. The combination of dilution refrigerator and microwave cable is used in testing superconducting quantum chip. The dilution refrigerator provides an extremely low temperature test environment, and the extremely low temperature test environment is realized through a multi-stage refrigeration structure. Microwave cables arranged at the input end, the control end and the reading end of the signal all need to pass through different temperature intervals. Wherein at the signal input, the electrical signal passes through the cable and the attenuator at room temperature to reduce interference, but there is signal attenuation. At the signal output, the cable also causes signal attenuation. In order to reduce the signal attenuation generated in different temperature intervals, different types of signal amplifiers are arranged in different temperature intervals, so that the signal is enhanced and the signal to noise ratio is improved. However, this approach increases the complexity of the system and may also introduce noise. In contrast, the optical fiber is used as a carrier for transmitting optical signals, has the advantages of low attenuation loss, strong anti-interference capability and the like, but the optical fiber and the signal modulator are generally suitable for working at room temperature (-40 ℃ to 80 ℃) at present and are not suitable for the extremely low temperature environment where the superconducting quantum chip is located. How to overcome the problem that the prior photoelectric device can not be used for a quantum chip is faced with. Disclosure of Invention The quantum chip utilizes the characteristics of low loss, strong anti-interference capability, large data flux, large bandwidth and the like of the optical fiber, and the electro-optical modulator can work at extremely low temperature, so that the power consumption is low, and the efficiency and the quality of signal transmission in the quantum chip are improved. To achieve the above object, the present disclosure provides a quantum chip, comprising: A qubit configured to generate an electrical signal; And the electro-optic modulator is electrically connected with the quantum bit and is configured to modulate an optical signal transmitted in the electro-optic modulator based on an electric signal input by the quantum bit so that the optical signal has quantum bit information generated by the quantum bit. Optionally, the quantum chip further includes a bottom plate, a first area, a second area and a first bonding pad are disposed on the bottom plate, the first bonding pad is disposed on an edge of the bottom plate, the first bonding pad surrounds the first area and the second area, the first area is configured to fix the qubit, the second area is configured to fix the electro-optical modulator, and the first bonding pad is configured to electrically connect the qubit and the microwave cable. Optionally, a ceramic shell is further disposed outside the electro-optic modulator, and the ceramic shell is configured to cover and seal the electro-optic modulator so as to avoid interference of the electro-optic modulator on the qubit. Optionally, the electro-optic modulator includes: an input optical fiber configured to input the optical signal; a beam splitter connected to the input optical fiber and configured to split the optical signal; An electro-optic modulation structure coupled to the beam splitter and configured to modulate a phase of an optical signal from the beam splitter; A beam combiner connected to the electro-optical modulation structure, the beam combiner interfering an optical signal from the electro-optical modulation structure; and an output optical fiber connected to the beam combiner and outputting an optical signal from the beam combiner. Alternatively, the electro-optic modulation structure comprises at least 1 pair of modulation arms, which may be connected in parallel or cascaded. Optionally, the electro-optic modulator is a plurality of the electro-optic modulators, and the plurality of the electro-optic modulators surrounds the qubit on the bottom plate. Optionally, each pair of modulation arms is provided with a pair of signal electrodes and ground electrodes with opposite electric field directions. Optionally, the electro-optic modulator includes: A substrate; An optical waveguide layer disposed on the substrate; an electro-optic modulation layer disposed on the optical waveguide layer. Optionally, the coupling mode between the electro-opt