CN-121998119-A - Superconducting quantum chip, packaging module and processor for realizing uniform reading parameters

CN121998119ACN 121998119 ACN121998119 ACN 121998119ACN-121998119-A

Abstract

The invention relates to the field of quantum chips, in particular to a superconducting quantum chip, a packaging module and a processor for realizing uniform reading parameters. The superconducting quantum chip comprises a glass-Seer filter, a reading cavity, at least one quantum bit, an output signal polar plate, an input signal polar plate, a first signal transmission line and a second signal transmission line, wherein the lengths of the first signal transmission line and the second signal transmission line are consistent and avoid odd multiples of a quarter wavelength corresponding to the working frequency of the glass-Seer filter. The invention fundamentally eliminates the standing wave resonance effect which leads to random drift of the reading performance of the superconducting quantum chip by introducing the creative design rule that the length of the transmission line avoids the specific multiple of lambda/4, realizes the certainty and predictability of the chip performance, and lays an indispensable physical foundation for realizing the uniformity of the large-scale multi-bit reading parameters, thereby thoroughly changing the research and development modes of the chip and greatly improving the research and development efficiency and success rate.

Inventors

LIU ZIXING
PANG HAO
CHU JI
ZHOU YUXUAN
LIU SONG

Assignees

深圳国际量子研究院

Dates

Publication Date: 20260508
Application Date: 20251224

Claims (10)

1. A superconducting quantum chip for achieving uniform read parameters, comprising: the glass sair filter (5) is of a half-wavelength resonant cavity structure with two ends grounded; A reading cavity (6) coupled with the Bossel filter (5) by mutual inductance; at least one qubit (8) coupled with the read cavity (6); The device comprises an output signal polar plate (3) and an input signal polar plate (10), wherein the output signal polar plate (3) is connected with the Bossel filter (5) through a first signal transmission line (4), and the input signal polar plate (10) is connected with the Bossel filter (5) through a second signal transmission line (9); The length of the first signal transmission line (4) is consistent and avoids the odd times of the quarter wavelength corresponding to the operating frequency of the glass filter (5), and/or the length of the second signal transmission line (9) is consistent and avoids the odd times of the quarter wavelength corresponding to the operating frequency of the glass filter (5).
2. The superconducting quantum chip for realizing uniform read parameters according to claim 1, wherein when the connection part of the first signal transmission line (4) and the glass sair filter (5) is positioned near the short-circuited end of the glass sair filter (5), the length of the first signal transmission line (4) avoids odd multiples of a quarter wavelength corresponding to the working frequency of the glass sair filter (5); And/or when the connection part of the second signal transmission line (9) and the glass filter (5) is positioned near the short-circuit end of the glass filter (5), the length of the second signal transmission line (9) avoids the odd times of the quarter wavelength corresponding to the working frequency of the glass filter (5).
3. A superconducting quantum chip for realizing uniform read parameters according to claim 2, characterized in that the characteristic bandwidth of the bosser filter (5) is 300MHz and the center frequency is 5-7GHz.
4. The superconducting quantum chip for realizing uniform read parameters according to claim 2, wherein the first signal transmission line (4) and the second signal transmission line (9) are both coplanar waveguide structures, have a characteristic impedance of 50Ω and a line width of 4-20 μm.
5. Superconducting quantum chip for realizing uniform read parameters according to claim 1, characterized in that the mutual inductance coupling strength between the read cavity (6) and the bosser filter (5) is 5-10pH.
6. A packaging module for a superconducting quantum chip for achieving uniform read parameters, comprising: A plurality of superconducting quantum chips for realizing uniform read parameters according to any one of claims 1 to 5, wherein the superconducting quantum chips for realizing uniform read parameters comprise an output signal polar plate (3) and an input signal polar plate (10); A printed circuit board electrode plate (1); A plurality of parallel leads (2) connecting the printed circuit board electrode plate (1) and the output signal electrode plate (3) or the input signal electrode plate (10); The length and the parallel number of the leads (2) connected with the printed circuit board polar plate (1) of each output signal polar plate (3) or the input signal polar plate (10) are kept consistent.
7. The packaging module of a superconducting quantum chip for realizing uniform read parameters according to claim 6, wherein the lead (2) is made of superconducting material, has a length of 1-3mm and a diameter of 25 μm.
8. The packaging module for superconducting quantum chips for realizing uniform read parameters according to claim 6, wherein the lead (2) is made of pure aluminum.
9. The packaging module for the superconducting quantum chip for realizing uniform read parameters according to claim 6, wherein the length of the output signal polar plate (3) or the input signal polar plate (10) is 0.2-0.4mm, the width is 0.1-0.3mm, and the length of the printed circuit board polar plate (1) is 0.6-1.5mm, and the width is 0.2-0.4mm.
10. A superconducting quantum processor, comprising: a packaging module of superconducting quantum chips for realizing uniform read parameters according to any one of claims 6 to 9; And the control and reading circuit is connected with the printed circuit board electrode plate.

Description

Superconducting quantum chip, packaging module and processor for realizing uniform reading parameters Technical Field The invention relates to the field of quantum chips, in particular to a superconducting quantum chip, a packaging module and a processor for realizing uniform reading parameters. Background Superconducting quantum processors typically include a superconducting quantum chip, a sample pedestal, and a printed circuit board. The signal port of the quantum chip is connected with the corresponding port of the printed circuit board through a lead wire so as to realize the transmission of external signals. However, due to the higher characteristic impedance of the leads, impedance mismatch is likely to occur at the junctions, affecting the quality of the control signal and the coupling strength between the quantum device and the environment. In a common superconducting qubit reading scheme, a reading cavity and a broadband Bossel filter are coupled through capacitance or mutual inductance, and a reading port of the Bossel filter is connected to a bonding polar plate at the edge of a chip through a coplanar waveguide transmission line and then bonded to a corresponding port of a printed circuit board through a lead. The impedance matching state at the read port directly affects the effective bandwidth of the filter, thereby determining the effective linewidth of the read cavity. Because the impedance of the lead wire is higher, a standing wave mode is easy to form between the output port of the Bossel filter and the lead wire, and the actual line widths of the Bossel filter and the reading cavity are obviously deviated from design values. In a multi-bit superconducting quantum chip, the non-uniformity of reading parameters can reduce the reading quality of quantum bits, and restrict the improvement of the performance of the whole chip. Accordingly, the prior art is in need of improvement. Disclosure of Invention Aiming at the problems in the prior art, the invention provides a superconducting quantum chip, a packaging module and a processor for realizing uniform read parameters, and aims to solve the technical problem of non-uniformity of read parameters. In a first aspect of the present invention, there is provided a superconducting quantum chip for realizing uniform read parameters, comprising: The glass-fiber filter is of a half-wavelength resonant cavity structure with two ends grounded; the reading cavity is coupled with the glass Seer filter through mutual inductance; At least one qubit coupled with the read cavity; The device comprises an output signal polar plate, an input signal polar plate, a first signal transmission line, a second signal transmission line and a third signal transmission line, wherein the output signal polar plate is connected with the glass filter through the first signal transmission line; The length of the first signal transmission line is consistent and avoids odd times of a quarter wavelength corresponding to the operating frequency of the glass filter, and/or the length of the second signal transmission line is consistent and avoids odd times of the quarter wavelength corresponding to the operating frequency of the glass filter. Preferably, when the connection part of the first signal transmission line and the glass filter is located near the short-circuited end of the glass filter, the length of the first signal transmission line avoids odd times of a quarter wavelength corresponding to the working frequency of the glass filter; and/or when the connection part of the second signal transmission line and the glass filter is positioned near the short-circuited end of the glass filter, the length of the second signal transmission line avoids odd times of a quarter wavelength corresponding to the working frequency of the glass filter. Preferably, the characteristic bandwidth of the Bose filter is 300MHz, and the center frequency is 5-7GHz. The bandwidth is determined by the coupling position of the output port signal transmission line and the filter. Preferably, the first signal transmission line and the second signal transmission line are both coplanar waveguide structures, the characteristic impedance is 50Ω, and the line width is 4-20 μm. Preferably, the mutual inductance coupling strength between the reading cavity and the glass stopper filter is 5-10pH. In a second aspect, the present invention also provides a packaging module, including: The superconducting quantum chip for realizing uniform reading parameters comprises an output signal polar plate and an input signal polar plate; a printed circuit board plate; a plurality of parallel leads connected with the printed circuit board electrode plate and the output signal electrode plate or the input signal electrode plate; The length and the parallel number of leads for connecting each output signal polar plate or each input signal polar plate with the printed circuit board polar plate are kept consistent. Preferably,