CN-121998218-A - Detection path planning method, device, equipment and storage medium

CN121998218ACN 121998218 ACN121998218 ACN 121998218ACN-121998218-A

Abstract

The invention discloses a method, a device, equipment and a storage medium for planning a detection path, wherein the method comprises the steps of determining the coordinate positions of all measurement points, starting points and ending points required to be detected by semiconductor equipment, initializing a non-access point set containing all the measurement points, adding the starting points as current points into a planned path, calculating the total time consumption of moving from the current points to each measurement point in the non-access point set, selecting the measurement point with the minimum total time consumption as a next target point, removing the next target point from the non-access point set, adding the planned path, updating the next target point to be a new current point, circularly executing the steps until the non-access point set is empty, adding the ending points into the planned path, and outputting the optimal path. The method breaks through the limitation of the shortest traditional path by taking time optimization as a target, screens the optimal path with the shortest total time consumption, and remarkably improves the yield of the semiconductor quantity detection equipment.

Inventors

WANG NANSHUO
WU CONGYI
CHEN LIJUN
MA YANZHONG
CHEN LU

Assignees

广州中科飞测科技有限公司

Dates

Publication Date: 20260508
Application Date: 20260226

Claims (11)

1. A method of detection path planning, comprising: S1, determining coordinate positions of all measurement points, starting points and ending points required to be detected by semiconductor equipment; S2, initializing a non-access point set containing all measurement points, and adding a starting point serving as a current point into the planned path; S3, in the non-access point set, calculating total time consumption for moving from the current point to each measurement point; S4, selecting the measurement point with the minimum total consumption as a next target point; s5, removing the next target point from the non-access point set, adding the planned path, and simultaneously updating the next target point to be a new current point; And (3) circularly executing the steps S3 to S5 until the set of non-access points is empty, and finally adding the ending point into the planned path to output an optimal path.
2. The method of claim 1, wherein the total time elapsed includes a movement time and an integration time required to measure each measurement point.
3. The inspection path planning method according to claim 2, wherein the movement time includes a path movement time of the semiconductor inspection apparatus and/or a rotating motor synchronization compensation time of the semiconductor inspection apparatus.
4. A test path planning method according to claim 3, wherein the calculation process of the path movement time of the semiconductor test device comprises: and calculating the time consumption of the semiconductor detection equipment from the current point to each measuring point in the non-access point set by adopting a trapezoidal acceleration and deceleration algorithm according to the maximum speed, the maximum acceleration and the maximum jerk of the semiconductor detection equipment.
5. The method of claim 4, wherein the phase-consuming calculation is expressed as: ; Wherein, the The current point is indicated and the current point is indicated, Representing the first of a set of non-access points The number of measurement points is chosen to be the same, Representing the current point to the first The phase of the individual measuring points is time-consuming, Indicating the maximum speed at which the vehicle will be traveling, The maximum acceleration is indicated to be the maximum acceleration, The maximum jerk is indicated to be the maximum, Representing the current point to the first The distance between the points of measurement is determined, Representing a trapezoidal acceleration function.
6. A detection path planning method according to claim 3, wherein the calculation process of the rotating electrical machine synchronization compensation time of the semiconductor detection apparatus includes: Confirming a measuring angle of the semiconductor detection device corresponding to each measuring point; Calculating a target angle required to rotate the motor-driven semiconductor detection device based on the measured angle of the current point and the measured angle of each measured point in the set of non-access points; and calculating the angle adjustment time required from the current point to each measuring point according to the preset rotation angular velocity of the motor and the target angle corresponding to each measuring point.
7. The method of claim 6, wherein the calculation of the angle adjustment time is expressed as: ; Wherein, the Represent the first The angle adjustment time of the individual measuring points, Represent the first The measurement angle of the individual measurement points is, Representing the measured angle of the current point, Representing a preset rotational angular velocity of the motor.
8. The method according to claim 2, wherein the integration time required for measuring each measurement point is obtained by querying a preset integration time corresponding to each measurement point.
9. A greedy algorithm-based path planning apparatus, comprising: The determining module is used for determining the coordinate positions of all the measuring points, the starting points and the ending points required to be detected by the semiconductor equipment; The initialization module is used for initializing an unaccessed point set containing all the measurement points and adding a starting point serving as a current point into the planned path; A calculation module for calculating a total time taken to move from the current point to each measurement point in the set of non-access points; The selecting module is used for selecting the measuring point with the minimum total consumption as the next target point; A path updating module, configured to remove the next target point from the set of non-access points, add the planned path, and update the next target point to a new current point; And the calculation module, the selection module and the path updating module circularly run until the set of non-access points is empty, and finally the end point is added into the planned path to output an optimal path.
10. A computer device comprising a processor, a memory coupled to the processor, the memory having stored therein program instructions that, when executed by the processor, cause the processor to perform the steps of the detection path planning method of any of claims 1-8.
11. A storage medium storing program instructions capable of implementing the detection path planning method according to any one of claims 1 to 8.

Description

Detection path planning method, device, equipment and storage medium Technical Field The present application relates to the field of semiconductor manufacturing technologies, and in particular, to a method, an apparatus, a device, and a storage medium for detecting path planning. Background In the field of semiconductor manufacturing, wafer quantity detection is a key link for ensuring the yield of chips. The inspection equipment needs to be quickly and accurately moved to hundreds of measurement points on the surface of the wafer to complete the inspection, and the advantages and disadvantages of the path planning directly affect the inspection time of the single wafer and the comprehensive productivity (WPH) of the equipment. Traditional path planning algorithms, such as nearest neighbor methods, genetic algorithms and the like, mostly take the "shortest geometric path" as an optimization target, i.e. find a moving sequence with the minimum sum of Euclidean distances. However, during actual semiconductor inspection equipment operation, the "shortest path" is not equivalent to the "shortest inspection time". The motion process of the motion platform of the equipment is subject to complex physical constraints including the acceleration limit of a mechanical system, the motion stability requirement (jerk limit), the motor response characteristics and the like. These factors result in that path planning based on pure geometric distances often fails to achieve the desired time efficiency when actually performed. For example, for a path that includes multiple measurement points, one path that is a short geometric distance may contain a large number of short segments that require frequent acceleration and deceleration, while another path that is a longer distance may have a shorter actual execution time if the motion is smoother. The prior art lacks a path planning scheme capable of directly taking the actual execution time as a core optimization target. Most optimization algorithms remain an improvement at the spatial geometry level and fail to build an accurate mapping model from path sequence to real time consumption. This results in insufficient throughput potential of the semiconductor quantity inspection apparatus, which is not sufficient for the critical pursuit of efficiency in the advanced process. Disclosure of Invention In view of the above, the present application provides a method, apparatus, device and storage medium for detecting path planning, so as to solve the problem that the existing path planning only considers the shortest distance and does not consider the actual detecting time. In order to solve the technical problems, the technical scheme adopted by the application is that a detection path planning method is provided, which comprises the steps of S1, determining the coordinate positions of all measurement points, starting points and ending points required to be detected by semiconductor equipment, S2, initializing an unaccessed point set containing all the measurement points, adding the starting points as current points into a planned path, S3, calculating the total time consumption of moving from the current points to each measurement point in the unaccessed point set, S4, selecting the measurement point with the minimum total time consumption as a next target point, S5, removing the next target point from the unaccessed point set, adding the planned path, updating the next target point into a new current point, and circularly executing the steps S3 to S5 until the unaccessed point set is empty, finally adding the ending points into the planned path, and outputting the optimal path. As a further development of the application, the total time consumption includes the movement time and the integration time required for measuring each measuring point. As a further improvement of the application, the movement time includes a path movement time of the semiconductor inspection apparatus and/or a rotating motor synchronization compensation time of the semiconductor inspection apparatus. The calculation process of the path movement time of the semiconductor detection device comprises the step of calculating the time consumption of the semiconductor detection device from the current point to each measuring point in the non-access point set according to the maximum speed, the maximum acceleration and the maximum jerk of the semiconductor detection device by adopting a trapezoid acceleration and deceleration algorithm. As a further improvement of the application, the phase-time consuming calculation process is expressed as: ; Wherein, the The current point is indicated and the current point is indicated,Representing the first of a set of non-access pointsThe number of measurement points is chosen to be the same,Representing the current point to the firstThe phase of the individual measuring points is time-consuming,Indicating the maximum speed at which the vehicle will be traveling,The maximum ac