CN-121998220-A - Assembly path planning device and method for flexible sensing chip for textile auxiliary materials

CN121998220ACN 121998220 ACN121998220 ACN 121998220ACN-121998220-A

Abstract

The application discloses an assembly path planning device and method of a flexible sensing chip for textile auxiliary materials, which relate to the technical field of path planning, wherein path curvature change influence analysis in each path planning scheme is performed based on textile path bending condition data in each path planning scheme, chip sensing yarn damage condition analysis is performed based on chip sensing yarn movement condition data and textile needle movement condition data during spinning in each path planning scheme, path planning scheme optimization index analysis is performed based on path curvature change influence analysis results and chip sensing yarn damage condition analysis results in each path planning scheme, an optimal assembly path is selected for chip sensing yarns according to the path planning scheme optimization index analysis results, objectivity and accuracy of damage prediction are improved through integrating path geometry, yarn movement, needle posture and other data, and meanwhile, optimization indexes are introduced to provide decision support for path automatic optimization.

Inventors

YANG CHEN
LIN YANPING

Assignees

江西服装学院

Dates

Publication Date: 20260508
Application Date: 20260410

Claims (9)

1. The method for planning the assembly path of the flexible sensing chip for the textile auxiliary is characterized by comprising the following steps of: S1, acquiring bending condition data of a spinning path, sensing yarn movement condition data of a chip and movement condition data of a spinning needle in each path planning scheme; s2, carrying out influence analysis on the path curvature change in each path planning scheme based on the textile path bending condition data in each path planning scheme; s3, analyzing the damage condition of the chip sensing yarn based on the movement condition data of the chip sensing yarn and the movement condition data of the spinning needle head during spinning in each path planning scheme; S4, carrying out optimization index analysis on each path planning scheme based on the path curvature change influence analysis result and the chip sensing yarn damage condition analysis result in each path planning scheme; S5, selecting an optimal assembly path for the chip sensing yarn according to the optimal index analysis result of each path planning scheme.
2. The flexible sensing chip assembly path planning method for textile auxiliary materials is characterized in that S2 comprises the specific steps of conducting path curvature change influence analysis in each path planning scheme according to textile path curvature data, length data and chip sensing yarn maximum curvature permission data in each path planning scheme, conducting difference value comparison between a maximum value of curvature in a textile path in each path planning scheme and the chip sensing yarn maximum curvature permission data, conducting absolute value processing, recording the result as a comparison result of the difference value of each path planning scheme, judging an overrun value of the textile path curvature in each path planning scheme through a Heaiside step function, dividing the overrun value of the textile path curvature in each path planning scheme by the chip sensing yarn maximum curvature permission data, obtaining an overall textile path curvature influence index in each path planning scheme, conducting integral on a change rate absolute value of the textile path curvature in each path planning scheme along the path length, obtaining an overall textile path smoothness index in each path planning scheme, and adding the overall curvature smoothness index in each path planning scheme, and obtaining the overall path smoothness analysis result after the overall curvature smoothness index in each path planning scheme is obtained.
3. The method for planning the assembly path of the flexible sensor chip for textile auxiliary according to claim 2, wherein the specific step of S3 is as follows: S31, obtaining analysis results of the stretch damage indexes of the chip sensing yarns in each path planning scheme from the instantaneous stretch length data, the original length data and the critical strain data of the chip sensing yarns during spinning in each path planning scheme; S32, obtaining a chip sensing yarn winding risk index analysis result in each path planning scheme from instantaneous yaw angle data, critical angle data, movement track curvature data of the spinning needle and relative angular velocity data of the chip sensing yarn in each path planning scheme; s33, obtaining the analysis result of the damage condition of the chip sensing yarn in each path planning scheme according to the analysis result of the tensile damage index and the winding risk index of the chip sensing yarn in each path planning scheme.
4. The flexible sensor chip assembly path planning method for the textile auxiliary materials is characterized in that the step S31 comprises the specific steps of conducting chip sensor yarn stretching damage index analysis in each path planning scheme according to chip sensor yarn stretching length data, original length data and critical strain data during spinning in each path planning scheme, wherein the chip sensor yarn stretching damage index analysis process in each path planning scheme comprises the steps of conducting difference comparison on chip sensor yarn stretching length data and original length data during spinning in each path planning scheme, dividing the difference comparison result by the original length data to obtain chip sensor yarn stretching strain during spinning in each path planning scheme, comparing the chip sensor yarn stretching strain with the critical strain to obtain chip sensor yarn stretching damage rate, integrating the chip sensor yarn stretching damage rate during spinning time and dividing the chip sensor yarn stretching damage rate by the spinning time to obtain chip sensor yarn stretching damage index analysis results in each path planning scheme.
5. The method for planning the assembly path of the flexible sensing chip for the textile auxiliary according to claim 4, wherein the step S32 is characterized in that chip sensing yarn winding risk index analysis in each path planning scheme is carried out according to instantaneous yaw angle data, critical angle data, motion track curvature data of a textile needle and relative angular velocity data of a chip sensing yarn in each path planning scheme, wherein the chip sensing yarn winding risk index analysis process in each path planning scheme is that in the textile time, the product of the instantaneous yaw angle data of the textile needle exceeding the critical angle data in each path planning scheme is calculated, the integral result is divided by the textile time, and the chip sensing yarn winding risk index analysis result in each path planning scheme is obtained.
6. The method for planning the assembly path of the flexible sensing chip for the textile auxiliary according to claim 5, wherein the step S33 comprises the specific steps of obtaining a chip sensing yarn tensile damage index analysis result and a winding risk index analysis result in each path planning scheme, weighting and adding the chip sensing yarn tensile damage index analysis result and the winding risk index analysis result in each path planning scheme to obtain a chip sensing yarn damage condition analysis result in each path planning scheme.
7. The method for planning the assembly path of the flexible sensing chip for the textile auxiliary according to claim 6, wherein the step S4 comprises the specific steps of obtaining a path curvature change influence analysis result and a chip sensing yarn damage condition analysis result in each path planning scheme, and multiplying the path curvature change influence analysis result and the chip sensing yarn damage condition analysis result in each path planning scheme to obtain a path planning scheme preference index analysis result.
8. The method for planning the assembly path of the flexible sensing chip for the textile auxiliary according to claim 7, wherein the step S5 comprises the specific steps of obtaining the optimal index analysis results of each path planning scheme, arranging the optimal index analysis results of each path planning scheme in an ascending order, and taking the path planning scheme corresponding to the optimal index analysis result of the smallest path planning scheme as the optimal assembly path of the chip sensing yarn, so that the optimal assembly path is selected for the chip sensing yarn.
9. An assembly path planning device of a flexible sensing chip for textile auxiliary, which is realized by an assembly path planning method of the flexible sensing chip for textile auxiliary based on any one of claims 1-8, is characterized by comprising an assembly path planning data acquisition module, a path curvature change influence analysis module, a chip sensing yarn damage analysis module, a path planning scheme optimization analysis module and an optimal assembly path judgment module, The assembly path planning data acquisition module is used for acquiring textile path bending condition data, chip sensing yarn movement condition data and textile needle movement condition data in each path planning scheme; the path curvature change influence analysis module is used for carrying out path curvature change influence analysis in each path planning scheme based on the textile path bending condition data in each path planning scheme; The chip sensing yarn damage analysis module is used for analyzing chip sensing yarn damage conditions based on chip sensing yarn movement condition data and textile needle movement condition data during spinning in each path planning scheme; the path planning scheme optimization analysis module is used for carrying out path planning scheme optimization index analysis based on path curvature change influence analysis results and chip sensing yarn damage condition analysis results in the path planning schemes; the optimal assembly path judging module is used for selecting an optimal assembly path for the chip sensing yarn according to the optimal index analysis result of each path planning scheme.

Description

Assembly path planning device and method for flexible sensing chip for textile auxiliary materials Technical Field The application belongs to the field of path planning, and particularly relates to an assembly path planning device and method of a flexible sensing chip for textile auxiliary materials. Background With the rapid development of intelligent textiles and wearable equipment, functional units such as chips, sensors and the like are integrated in the inside of the textile in the form of sensing yarns, so that the intelligent textile becomes a key technical path for realizing the front-edge application of human physiological signals such as continuous monitoring, man-machine interaction, environment perception and the like; At present, in the textile engineering field, production efficiency, fabric texture attractiveness and mechanical strength are mainly considered for path planning of common yarns, an optimization target is single, and when an object is upgraded into sensing yarns integrated with a precision chip and a circuit, the following serious defects are exposed in the prior art: the prior art lacks systematic quantitative evaluation of complex stress applied to the sensing yarn in the dynamic spinning process, only sets conservative technological parameters (such as uniformly reducing the spinning speed and increasing the path curvature radius) by experience or performs off-line detection after damage occurs, and cannot pre-judge and distinguish damage risks caused by excessive bending (curvature overrun), abnormal stretching (strain overrun), movement interference (needle winding) and the like under different path planning schemes in advance; In the prior art, a certain factor is often considered in isolation, for example, whether the geometric curvature of a path exceeds a certain experience threshold value or not is only checked, the damaged coupling characteristic is ignored, for example, a path with qualified geometric curvature is possibly damaged due to dynamic stretching or complex relative movement with a needle during high-speed spinning, and in order to solve the problems set forth in the background art, the application designs an assembly path planning device and method of a flexible sensing chip for spinning auxiliary materials. Disclosure of Invention Aiming at the technical defects, the application provides an assembly path planning device and method for a flexible sensing chip for textile auxiliary materials. In order to solve the technical problems, the application adopts the following technical scheme that the application provides an assembly path planning method of a flexible sensing chip for textile auxiliary materials, which comprises the following specific steps: S1, acquiring bending condition data of a spinning path, sensing yarn movement condition data of a chip and movement condition data of a spinning needle in each path planning scheme; s2, carrying out influence analysis on the path curvature change in each path planning scheme based on the textile path bending condition data in each path planning scheme; s3, analyzing the damage condition of the chip sensing yarn based on the movement condition data of the chip sensing yarn and the movement condition data of the spinning needle head during spinning in each path planning scheme; S4, carrying out optimization index analysis on each path planning scheme based on the path curvature change influence analysis result and the chip sensing yarn damage condition analysis result in each path planning scheme; S5, selecting an optimal assembly path for the chip sensing yarn according to the optimal index analysis result of each path planning scheme. The method for planning the assembly path of the flexible sensing chip for the textile auxiliary comprises the following specific steps: S11, obtaining textile path bending condition data through a path planning scheme and a chip sensing yarn manufacturing manual, wherein the textile path bending condition data comprises textile path curvature data, length data and chip sensing yarn allowable maximum curvature data; S12, acquiring movement condition data of the chip sensing yarn through a high-speed camera, a laser range finder and a chip sensing yarn manufacturing manual, wherein the movement condition data of the chip sensing yarn comprises relative angular velocity data of the chip sensing yarn, original length data of the chip sensing yarn, instantaneous stretching length data of the chip sensing yarn during spinning and critical strain data of the chip sensing yarn; S13, acquiring textile needle movement condition data including instantaneous yaw angle data of the needle, critical angle data and curvature data of a textile needle movement track through an inertia measurement unit and experimental statistics; And S14, storing the acquired data in a storage component for use in an analysis process. The method comprises the following specific steps of carrying out path curvatu