CN-121999427-A - Automatic scanning device for conveying container slot of glass substrate semiconductor package

CN121999427ACN 121999427 ACN121999427 ACN 121999427ACN-121999427-A

Abstract

Embodiments relate to a transfer container slot auto-scanning apparatus for a glass substrate semiconductor package factory automation, and more particularly, to a transfer container slot auto-scanning apparatus for a glass substrate semiconductor package capable of achieving synchronization by automatically scanning a position and number of glass substrates according to a transfer container slot and comparing with related information in a manufacturing execution service system.

Inventors

YIN XIANGMIN
JIN YANJUN
Jin Zhien

Assignees

爱玻索立克公司

Dates

Publication Date: 20260508
Application Date: 20251104
Priority Date: 20241105

Claims (6)

1. An automatic scanning device for a transport container slot for a glass substrate semiconductor package, which is used in a glass substrate semiconductor packaging factory, scans the positions and the number of glass substrates allocated in a packing unit to each of slots of transport containers to which identification codes are respectively attached, and compares the positions and the number with slot information of a manufacturing execution service system, the device comprising: a list creation unit for creating a list of each transport container stored in each stacker; a scanning job preparing section for searching for a process device capable of executing a scanning job to prepare the scanning job; A scanning operation execution part for selecting any one of the conveying containers contained in the list and loading the conveying containers to the process equipment so as to automatically scan the positions and the number of the glass substrates corresponding to the slots of the conveying containers; A scan information comparing part for comparing the scan information of the positions and the number of the glass substrates of the slots of the transport container outputted according to the automatic scan with the slot information stored in the manufacturing execution service system in advance to judge whether the scan information is consistent with the slot information, and And an error occurrence notification unit configured to change the transport container to a holding state and store the transport container in a stacker, and then transmit an error occurrence signal to an administrator terminal, when the scan information and the slot information do not match, based on a result of the determination.
2. The automated container slot scanning apparatus for glass substrate semiconductor packages of claim 1, wherein, The scan job preparing section includes: a process equipment searching section for searching for a process equipment currently in a usable state among a plurality of process equipment existing in the glass substrate semiconductor packaging factory; a process equipment state changing unit for changing the searched state of the process equipment from the available state to the in-use state, and And a scan job reservation section for reserving a scan job to the manufacturing execution service system so that the scan job can be executed by using the process equipment changed to the in-use state.
3. The automated container slot scanning apparatus for glass substrate semiconductor packages of claim 1, wherein, The scanning job execution unit includes: A transport container selecting unit configured to select any one of the transport containers included in the list; A transport container discharging unit for discharging the transport container selected from the stacker via a storage manager; A conveying container conveying section for conveying the conveying container discharged from the stacker to a dispensing apparatus by a conveying apparatus; a transfer container loading unit for loading the transfer container transferred to the dispensing apparatus into the process apparatus; A slot scanning part for scanning the positions and the number of the glass substrates loaded in the slots of the conveying container of the process equipment; a scan information transmitting part for transmitting the scan information of the position and the number of the scanned glass substrates of the slots of the transport container to a manufacturing execution service system, and And a transfer container unloading section for unloading the scanned transfer container from the process equipment.
4. The automated container slot scanning apparatus for glass substrate semiconductor packages of claim 1, wherein, The scan information comparing unit includes: an information receiving unit configured to receive the scan information and the slot information from the manufacturing execution service system, respectively; a position number comparing part for judging whether the positions and the number of the glass substrates of the slots based on the scanning information are consistent with the positions and the number of the glass substrates of the slots based on the slot information, and And a comparison result output unit for outputting a comparison result according to whether the comparison result is consistent.
5. The automated inspection apparatus for a transport container socket for a glass substrate semiconductor package according to claim 4, wherein, The error occurrence notification unit includes: A first error determination unit configured to determine that an error exists in the process of dispensing the transport container in the unit of bale when the scan information does not coincide with the slot information and the transport container is in the state of dispensing the transport container in the unit of bale, based on the comparison result, and to output first error information; A second error determination unit configured to determine that an error exists in the transport container itself and output second error information when the scan information does not match the slot information and the transport container is not in a state of being distributed in a packaging unit, based on the comparison result; A transport container returning unit configured to return the transport container determined to have an error by the first error determination unit and the second error determination unit to a stacker by a transport device; a conveying container warehouse-in part for warehousing the conveying container returned to the stacker by a warehouse manager, and And an error information transmission unit configured to transmit the first error information or the second error information output from the first error determination unit and the second error determination unit to an administrator terminal, so as to notify the administrator of the correction of the error.
6. The automated container slot scanning apparatus for glass substrate semiconductor packages as recited in claim 3, wherein, And a scanning job ending part for releasing the scanning job reserved by the process management server when the scanning job executing part completes the scanning job of all the conveying containers contained in the list so as to end the scanning job using the process equipment.

Description

Automatic scanning device for conveying container slot of glass substrate semiconductor package Technical Field Embodiments relate to a transport container slot auto-scanning apparatus for glass substrate semiconductor packages for glass substrate semiconductor package factory automation. Background In recent years, in place of a plastic Substrate used in the field of semiconductor packaging, a Glass Substrate (Glass Substrate) made of Glass has been developed and used. The glass substrate is considered as an innovative substrate material capable of changing the pattern in the field of semiconductor packaging. That is, the glass substrate has a smooth surface and excellent workability in processing into a large square panel, and is suitable for realizing a semiconductor package of an ultrafine linewidth, and since an intermediate substrate is not required, the substrate thickness can be reduced and the power consumption can be reduced. The glass substrates are assembled in a package of a predetermined number of units (Lot) in a glass substrate semiconductor packaging factory, and then processed in the glass substrate semiconductor packaging factory in a state of being individually put into a plurality of slots (slots) provided at predetermined intervals inside a transport container (Cassette). In other words, the glass substrate is transferred by the transfer device in the form of being put into the slot of the transfer container, and is put into the process device for processing after being taken out from the slot of the transfer container by the transfer device according to the processing process flow, and is put into the slot of the transfer container after the processing is completed. On the other hand, in order to operate a glass substrate semiconductor packaging factory in an automated manner, it is necessary to accurately grasp the positions and the number of glass substrates corresponding to the conveyance container slots. That is, it is necessary to accurately grasp which slot of the transfer container the glass substrate is positioned in and what the number of glass substrates are put into the slot of the transfer container, and to make it coincide with slot information of a manufacturing execution service system (WFS) so that the glass substrate semiconductor packaging factory can be operated in an automated manner. However, in the glass substrate semiconductor packaging factory at present, the stock arrangement work of confirming the positions and the number of the glass substrates according to the conveyance container slots is performed manually, so that it is not easy to achieve accurate synchronization with the slot information of the manufacturing execution service system. Therefore, it is necessary to study a technology capable of automatically scanning the positions and the number of glass substrates corresponding to the slots of the transfer container and comparing them with the slot information of the manufacturing execution service system to achieve synchronization. The above background art is technical information provided by the inventor for leading out the present application or obtained in the process of leading out the present application, and is not necessarily known to the public prior to the present application. As related prior arts, there are korean laid-open patent publication No. 10-2005-0067603 (publication date: 2005, 07, 05), korean laid-open patent publication No. 10-2008-0024375 (publication date: 2008, 03, 18), and korean authorized patent publication No. 10-0828972 (publication date: 2008, 05, 13). Disclosure of Invention Problems to be solved by the invention The present invention has been made to solve the above-described problems, and an object thereof is to provide a transfer container slot automatic scanning apparatus for a glass substrate semiconductor package, which is capable of automatically scanning the positions and the number of glass substrates corresponding to the transfer container slots and comparing with slot information of a manufacturing execution service system to achieve synchronization, thereby enabling an automated operation of a glass substrate semiconductor package factory. The object of the present invention is not limited to the above-described object, and other objects not mentioned can be clearly understood from the following description and are fully included in the object of the present invention. Means for solving the problems In order to achieve the above object, a transfer container slot auto-scan apparatus for a glass substrate semiconductor package according to an embodiment is used in a glass substrate semiconductor packaging factory, and is configured to scan the positions and the numbers of glass substrates allocated in a packing unit to slots of respective transfer containers to which identification codes are attached, and compare the scanned positions and the numbers with slot information of a manufacturing execution service sy