CN-121999507-A - Electronic component packaging automatic generation method and system based on intelligent information extraction

CN121999507ACN 121999507 ACN121999507 ACN 121999507ACN-121999507-A

Abstract

The application discloses an electronic component packaging automatic generation method and system based on intelligent information extraction, comprising the steps of obtaining an electronic component design document uploaded by a user and a processing mode instruction appointed by the user; calling an optical character recognition service to recognize a designated page of the design document to obtain a recognition result containing text content and layout information; inputting the recognition result and the processing mode instruction into a pre-trained large language model so that the large language model outputs a key design parameter set related to the creation package, submitting the key design parameter set to a user for interactive verification and correction to obtain a final design parameter confirmed by the user, and carrying out logic conversion processing on the final design parameter according to the processing mode instruction to generate a target package parameter conforming to the design specification of the printed circuit board. The method and the system realize the full-flow automation from unstructured documents to standardized package design, and improve the design efficiency and accuracy.

Inventors

LI HUI
LI JIGUO
YU JIE
DING KE

Assignees

安徽星弘烨智能科技有限公司

Dates

Publication Date: 20260508
Application Date: 20260127

Claims (10)

1. The electronic component packaging automatic generation method based on intelligent information extraction is characterized by comprising the following steps of: S1, acquiring an electronic component design document uploaded by a user and a processing mode instruction appointed by the user; s2, calling an optical character recognition service to recognize a designated page of the design document, and obtaining a recognition result containing text content and layout information; s3, inputting the identification result and the processing mode instruction into a pre-trained large language model so that the large language model outputs a key design parameter set related to the creation package; s4, submitting the key design parameter set to a user for interactive verification and correction to obtain a final design parameter confirmed by the user; s5, performing logic conversion processing on the final design parameters according to the processing mode instruction to generate target packaging parameters which accord with the design specification of the printed circuit board; S6, matching or newly establishing a corresponding pad design file in the pad library according to the target packaging parameters; s7, calling an electronic design automation tool, and automatically generating an electronic component packaging file based on the target packaging parameters and the bonding pad design file.
2. The method for automatically generating electronic component packages based on intelligent information extraction according to claim 1, wherein the processing mode instruction includes a package mode for printed circuit board layout design and a physical mode for three-dimensional modeling or assembly analysis.
3. The method for automatically generating electronic component packages based on intelligent information extraction according to claim 2, wherein in step S3: When the processing mode instruction is a packaging mode, the key design parameter set at least comprises parameters related to the geometric shape and layout of the bonding pads; when the processing mode instruction is a physical mode, the key design parameter set at least comprises parameters related to physical entity size and mechanical structure of the device.
4. The method for automatically generating the electronic component package based on intelligent information extraction according to claim 1, wherein in the step S3, the large language model is a pre-training model based on a transducer architecture, and the training method of the large language model comprises the following steps: acquiring a historical electronic component design document and key design parameters of labels thereof to form a training sample set; Dividing the training sample set into a training set, a verification set and a test set according to a preset proportion; The method comprises the steps of taking a design document identification result and a corresponding mode in a training set as input, taking marked key design parameters as supervision targets, and carrying out fine tuning training on the large language model; performing performance evaluation and super-parameter tuning on the trimmed large language model by using a verification set; And performing final performance test on the optimized large language model by using the test set to obtain a pre-trained large language model.
5. The method for automatically generating the electronic component package based on intelligent information extraction according to claim 1, wherein step S2 specifically comprises: converting a designated page of the design document into image data to be identified; the optical character recognition service is called to process the image data to be recognized, and character information, table structure information and graphic labeling information in the page are recognized; and acquiring an identification result returned by the optical character identification service, wherein the identification result comprises text content, position information of the text content in a page, and optional table structure and graphic labeling information.
6. The method for automatically generating electronic component packages based on intelligent information extraction according to claim 1, wherein step S4 specifically comprises: S41, formatting the key design parameter set into a parameter table, and displaying the parameter table to a user; s42, receiving a natural language correction instruction input by a user based on the parameter table; S43, re-inputting the identification result, the processing mode instruction and the natural language correction instruction into the large language model according to the natural language correction instruction so as to obtain an updated key design parameter set; s44, repeating the steps S41 to S43 based on the updated key design parameter set until a confirmation instruction of a user is received; S45, the key design parameter set which is obtained last time and confirmed by the user is used as a final design parameter.
7. The method for automatically generating electronic component packages based on intelligent information extraction according to claim 6, wherein step S5 specifically comprises: Judging whether the processing mode instruction is a packaging mode or a real mode; If the package mode is adopted, the final design parameters are directly mapped into target package parameters; If the design parameters are in a real mode, converting the physical size parameters of the device contained in the final design parameters according to preset process conversion rules to generate target packaging parameters for designing the printed circuit board, wherein the preset process conversion rules are as follows: Pad design length = device physical pin length x k1+Δ1; pad design width = device physical pin width x k2+Δ2; wherein, K1 and K2 are expansion coefficients determined according to the packaging form of the device, and delta 1 and delta 2 are compensation values determined according to the welding process requirements.
8. The method for automatically generating electronic component packages based on intelligent information extraction according to claim 1, wherein step S6 specifically comprises: Generating a corresponding standard pad identifier according to the pad size information in the target packaging parameters; performing a search operation in the pad library according to the standard pad identifier; if the existing pad design file which is completely matched with the standard pad identifier is retrieved from the pad library, calling the existing pad design file; If the completely matched pad design file is not retrieved in the pad library, automatically calling a pad creation function of an electronic design automation tool according to the pad size information, generating a new pad design file, and storing the new pad design file in the pad library.
9. The method for automatically generating electronic component packages based on intelligent information extraction according to claim 1, wherein step S7 specifically comprises: according to the layout information of the bonding pad array in the target packaging parameters, automatically calculating the accurate placement coordinates of each bonding pad in a packaging coordinate system; In an electronic design automation tool, sequentially placing pad patterns corresponding to a pad design file at the accurate placement coordinates to form a pad array; Automatically drawing a packaging silk-screen layer graph and an assembly layer graph in a corresponding graph layer of an electronic design automation tool based on device outline and identification information in target packaging parameters; and storing the complete design data comprising the pad array, the silk-screen layer graph and the assembly layer graph into an electronic component packaging file in a standard format, and storing the electronic component packaging file into a specified library path.
10. The electronic component packaging automatic generation system based on intelligent information extraction is characterized by comprising: the document acquisition module is used for acquiring the electronic component design document uploaded by the user and the processing mode instruction appointed by the user; the text recognition module is used for calling the optical character recognition service to recognize the designated page of the design document to obtain a recognition result containing text content and layout information; The parameter extraction module is used for inputting the identification result and the processing mode instruction into a pre-trained large language model so that the large language model outputs a key design parameter set related to the creation package; The interactive correction module is used for submitting the key design parameter set to a user for interactive verification and correction to obtain the final design parameter confirmed by the user; The parameter conversion module is used for carrying out logic conversion processing on the final design parameters according to the processing mode instruction to generate target packaging parameters which accord with the design specification of the printed circuit board; The bonding pad management module is used for matching or newly building a corresponding bonding pad design file in the bonding pad library according to the target packaging parameters; and the package generating module is used for calling an electronic design automation tool and automatically generating an electronic component package file based on the target package parameters and the bonding pad design file.

Description

Electronic component packaging automatic generation method and system based on intelligent information extraction Technical Field The invention relates to the technical field of electronic design automation, in particular to an electronic component packaging automatic generation method and system based on intelligent information extraction. Background In the field of Printed Circuit Board (PCB) design, creating accurate packages (Footprint) for electronic components is a critical and highly repeatable basis. The packaging precisely defines the geometric mapping relation between the physical pins of the components and the copper foil bonding pads on the PCB, and the correctness directly determines whether the components can be welded successfully or not and the reliability of circuit functions. Currently, in Electronic Design Automation (EDA) software, which is the mainstream in the industry, creating packages is almost entirely dependent on the manual operation of the designer. The typical process is that the designer first needs to carefully read the specifications (usually in PDF format) provided by the component supplier, manually identify and extract key parameters such as pad shape, size, pitch and body contour from complex charts, tables and text descriptions, then perform necessary calculation conversion according to the process requirements, manually draw the pad pattern, arrange its position in EDA software, and add auxiliary information such as silk-screen layer, assembly layer, etc. The whole process is tedious and time-consuming, and highly depends on experience and careful degree of designers. The existing manual creation method has the obvious defects that firstly, the efficiency is low, the requirement of quick device updating or large-scale library establishment is difficult to meet, the method becomes a bottleneck in a design flow, secondly, mistakes are extremely easy to occur, each link from parameter extraction and numerical calculation to graphic drawing can possibly introduce human negligence, serious quality accidents and economic losses are caused once mistakes flow into subsequent manufacturing stages, thirdly, the consistency is poor, the design habit and understanding difference of different engineers can cause non-uniform package library standards, and team cooperation and design multiplexing are not facilitated. Although there have been some attempts to automate the processing of specifications, such as fixed template based parsing or underlying character recognition techniques, these methods are generally poorly adapted and have poor accuracy. Because the specification of the electronic component lacks unified standards in format and chart expression, a simple technical means cannot truly understand the semantic logic of the document and cannot reliably associate key parameters scattered in texts, tables and dimension marking graphs, so that the method is difficult to apply to practical high-reliability engineering design. Therefore, a solution capable of intelligently understanding unstructured documents, automatically extracting parameters with high precision and generating accurate packages is needed in the art to overcome the fundamental defects of low efficiency, easy error and insufficient automation degree in the prior art. Disclosure of Invention In order to solve the technical problems in the background art, the invention provides an electronic component packaging automatic generation method and system based on intelligent information extraction. The invention provides an electronic component packaging automatic generation method based on intelligent information extraction, which comprises the following steps: S1, acquiring an electronic component design document uploaded by a user and a processing mode instruction appointed by the user; s2, calling an optical character recognition service to recognize a designated page of the design document, and obtaining a recognition result containing text content and layout information; s3, inputting the identification result and the processing mode instruction into a pre-trained large language model so that the large language model outputs a key design parameter set related to the creation package; s4, submitting the key design parameter set to a user for interactive verification and correction to obtain a final design parameter confirmed by the user; s5, performing logic conversion processing on the final design parameters according to the processing mode instruction to generate target packaging parameters which accord with the design specification of the printed circuit board; S6, matching or newly establishing a corresponding pad design file in the pad library according to the target packaging parameters; s7, calling an electronic design automation tool, and automatically generating an electronic component packaging file based on the target packaging parameters and the bonding pad design file. Preferably, the processing mode i