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CN-122000144-A - Copper wire with surface provided with antioxidant protective film and preparation method thereof

CN122000144ACN 122000144 ACN122000144 ACN 122000144ACN-122000144-A

Abstract

The invention discloses a copper wire with an anti-oxidation protective film on the surface and a preparation method thereof, belonging to the technical field of copper wire surface protection treatment. The preparation method comprises the steps of carrying out acid treatment, water washing and drying on a copper wire to obtain a pretreated copper wire, soaking the pretreated copper wire in polyamic acid solution to obtain a pre-coated copper wire, carrying out water spraying or water vapor treatment on the pre-coated copper wire, and drying to obtain the copper wire with the surface provided with the oxidation-resistant protective film. The method has the advantages of simple process and low cost, the obtained protective film is easy to remove, the oxidation resistance of the copper wire can be obviously improved, meanwhile, the film has the characteristic of reversible dissolution, the film can be rapidly and thoroughly removed by adopting absolute ethyl alcohol for short-time soaking, the removal process is mild, the copper wire matrix is not damaged, and the method is particularly suitable for the temporary oxidation resistance protection requirements of the copper wire in links such as production flow, storage and transportation.

Inventors

  • XING SHOUJIANG
  • LI WEI
  • WANG SHUJUAN
  • LI JIAHAO
  • DONG YUHAO

Assignees

  • 特变电工山东鲁能泰山电缆有限公司

Dates

Publication Date
20260508
Application Date
20260316

Claims (10)

  1. 1. The preparation method of the copper wire with the surface provided with the oxidation-resistant protective film is characterized by comprising the following steps: The copper wire is subjected to acid treatment, water washing and drying to obtain a pretreated copper wire; Soaking the pretreated copper wire in polyamic acid solution to obtain a pre-coated copper wire; And (3) treating the pre-coated copper wire by water spraying or water vapor, and drying to obtain the copper wire with the surface provided with the antioxidant protective film.
  2. 2. The method according to claim 1, wherein the acid treatment is performed by spraying a dilute nitric acid solution or an acetic acid-hydrogen peroxide mixed solution, wherein the mass concentration of the dilute nitric acid solution is 3% -20%, the mass concentration of acetic acid in the acetic acid-hydrogen peroxide mixed solution is 5% -30%, and the mass concentration of hydrogen peroxide is 1% -5%.
  3. 3. The method of claim 2, wherein the spraying is performed with a dilute nitric acid solution or an acetic acid-hydrogen peroxide mixed solution for 10-180 seconds.
  4. 4. The method according to claim 1, wherein the solvent of the polyamic acid solution is at least one of N, N-dimethylformamide, N-methylpyrrolidone, N-dimethylacetamide, and dimethylsulfoxide.
  5. 5. The method according to claim 1, wherein the concentration of the polyamic acid solution is 1 to 30% by weight.
  6. 6. The method according to claim 1, wherein the polyamic acid is obtained by polycondensation of a dianhydride monomer selected from at least one of pyromellitic dianhydride, 3', 4' -biphenyl tetracarboxylic dianhydride, 3', 4' -benzophenone tetracarboxylic dianhydride, and 3,3', 4' -diphenyl ether tetracarboxylic dianhydride, and a diamine monomer selected from at least one of 4,4 '-diaminodiphenyl ether, p-phenylenediamine, m-phenylenediamine, and 4,4' -diaminodicyclohexylmethane.
  7. 7. The method of claim 1, wherein the soaking time is 1 to 1000 seconds.
  8. 8. The method according to claim 1, wherein the water used in the water spraying step is at a temperature of 10 to 40 ℃ and the water vapor treatment is at a temperature of 100 to 150 ℃.
  9. 9. The method of claim 1, wherein the water spray or water vapor treatment is performed for a period of 1 to 600 seconds.
  10. 10. A copper wire having an oxidation-resistant protective film on a surface thereof, characterized by being produced by the production method according to any one of claims 1 to 9.

Description

Copper wire with surface provided with antioxidant protective film and preparation method thereof Technical Field The embodiment of the invention belongs to the technical field of copper wire surface protection treatment, and particularly relates to a copper wire with an anti-oxidation protective film on the surface and a preparation method thereof. Background Copper wires are widely applied to the industrial fields of power transmission, electronic devices, communication cables, automobile wire harnesses and the like by virtue of excellent electric conductivity and heat conductivity, and are an indispensable basic material in modern electrical systems. However, copper is susceptible to oxidation and corrosion in natural environments, and particularly under the conditions of high humidity and corrosive media such as sulfides or salt mist, corrosion products such as copper oxide, basic copper carbonate and the like can be rapidly generated on the surface of copper. The corrosion layer not only causes darkening of the surface color of the copper wire and deterioration of the appearance, but also obviously increases the contact resistance, thereby causing a series of problems such as reduction of the power transmission efficiency, local overheating, reduction of the connection reliability, signal transmission distortion and the like. Under the working conditions of marine environment, chemical sites or high temperature and high humidity, the corrosion rate of the copper wire is further accelerated, the service life of the copper wire is seriously restricted, and the operation safety and stability of the whole electrical system are threatened. In order to inhibit oxidation and corrosion of copper wires, various surface protection methods have been developed in the prior art, including metal plating protection, organic coating protection, chemical passivation treatment, and the like. Although the metal plating layer such as tin plating, silver plating, nickel plating and the like can provide better protection effect, the technological process involves electroplating or chemical plating, equipment investment is large, energy consumption is high, the plating layer thickness is difficult to control, and the subsequent welding or drawing and other processing technologies can be adversely affected. The protection of the organic coating generally adopts dip coating, spray coating and other modes to form a polymer protective film on the copper surface, but most of the existing organic coating materials are thermosetting resins, and high-temperature curing treatment is needed, so that the process period is long, the energy consumption is high, and the high-temperature treatment process can cause softening or oxidation of a copper matrix to influence the mechanical property and the electric conductivity of the copper matrix. In addition, the adhesion force between part of the organic protective coating and the copper matrix is insufficient, the defects of falling off, foaming and the like are easy to occur in the storage or transportation process, and the protective effect is unstable. In addition, there are staged differences in the antioxidant protection requirements of copper wires. In a long-term service environment, the protective layer is required to have durability and weather resistance, and in short-term processes such as production, storage, transportation and the like, the protective layer only needs to play a role within a plurality of weeks to a plurality of months, and the protective layer needs to be removed conveniently and thoroughly before subsequent processing. However, it is often difficult to combine the short-term protection effect with easy removability in the existing protection technology. For example, although the partial coating has good protective performance, the removal needs to adopt modes such as strong acid, strong alkali or pyrolysis, and the like, has severe operation conditions, is easy to cause secondary damage to a copper matrix, and brings about environmental burdens such as waste liquid treatment. Other methods have difficulty in providing adequate protection under conditions of damp heat, salt fog, and the like due to too thin protective layer or insufficient adhesive force. In summary, the existing copper wire surface antioxidation protection technology still has many defects in terms of process complexity, production cost, protection performance, coating removability and the like, and development of a short-term antioxidation protection method which has the advantages of simple process, low energy consumption, good protection effect and no influence on subsequent processing is needed to meet the actual application requirements of the copper wire in the production and circulation process. Disclosure of Invention In view of the above, the invention provides a copper wire with an anti-oxidation protective film on the surface and a preparation method thereof, wherein the invention a