CN-122000176-A - Coil electronic assembly

Abstract

The present disclosure provides a coil electronic assembly. The coil electronic assembly includes a body including a magnetic material, a coil embedded within the body and having a plating layer, and an insulating member including glass covering the coil. The plating layer includes a first plating layer and a second plating layer disposed on the first plating layer. The insulating member includes an inner insulating member between the first coil pattern and the second coil pattern and insulating walls extending between adjacent turns of the coil to enhance electrical insulation and structural integrity. First and second external electrodes are located outside the body and electrically connected to the coil. The insulating member improves mechanical stability and electrical performance, reducing deformation and potential shorting.

Inventors

• PU TINGMIN
• JIN FANXI

Assignees

• 三星电机株式会社

Dates

Publication Date

20260508

Application Date

20250604

Priority Date

20241105

Claims (18)

1. 1. A coil electronics assembly comprising: a body comprising a magnetic material; a coil embedded in the body and including a plating layer, and An insulating member including glass and covering the coil, Wherein the plating layer comprises a first plating layer and a second plating layer covering the first plating layer.
2. 2. The coil electronic assembly of claim 1, wherein: a portion of the first plating layer is in contact with the second plating layer, and a remaining portion of the first plating layer is in contact with the insulating member.
3. 3. The coil electronic assembly of claim 1, wherein: the coil includes a first coil pattern and a second coil pattern, and The insulating member includes an inner insulating member between the first coil pattern and the second coil pattern.
4. 4. The coil electronic assembly of claim 3, wherein: the inner insulating member includes a first support surface and a second support surface opposite to each other, The first coil pattern is located on the first support surface, and The second coil pattern is located on the second support surface.
5. 5. The coil electronic assembly of claim 4, further comprising: And a first via hole penetrating the inner insulation member and connecting the first coil pattern and the second coil pattern.
6. 6. The coil electronic assembly of any of claims 1-5, wherein: the insulating member includes an outer insulating member between the coil and the body.
7. 7. The coil electronic assembly of claim 6, wherein: The outer insulating member is located on an outer surface of the coil.
8. 8. The coil electronic assembly of claim 6, wherein: The second plating layer is in contact with the outer insulating member.
9. 9. The coil electronic assembly of any of claims 1-5, wherein: the body includes a first surface and a second surface opposite each other in a first direction, The coil includes a plurality of turns wound around a winding axis in the first direction, and The insulating member includes an insulating wall between turns of the coil.
10. 10. The coil electronic assembly of claim 1, wherein: The insulating member includes a photosensitive glass material.
11. 11. The coil electronic assembly of claim 1, wherein: The insulating member includes at least one selected from the group consisting of SiO 2 -B 2 O 3 -based glass, siO 2 -B 2 O 3 -K 2 O-based glass, siO 2 -B 2 O 3 -Li 2 O-CaO-based glass, siO 2 -B 2 O 3 -Li 2 O-CaO-ZnO-based glass, and Bi 2 O 3 -B 2 O 3 -SiO 2 -Al 2 O 3 -based glass.
12. 12. The coil electronic assembly of claim 11, wherein: The insulating member further includes at least one selected from the group consisting of quartz, alumina, magnesia, silica, forsterite (Mg 2 SiO 4 ), talc (H 2 Mg 3 (SiO 3 ) 4 ), and zirconia.
13. 13. The coil electronic assembly of claim 1, wherein: the body includes a first surface and a second surface opposite each other in a first direction, The coil is wound around a winding axis in the first direction, and The coil includes a lead-out terminal exposed at the first surface or the second surface of the main body.
14. 14. The coil electronic assembly of claim 13, further comprising: an external electrode disposed outside the main body and connected to the lead-out terminal.
15. 15. The coil electronic assembly of claim 14, wherein: the external electrode is disposed on the first surface or the second surface of the body.
16. 16. The coil electronic assembly of claim 1, further comprising: And a surface insulating layer disposed on an outer surface of the body.
17. 17. A coil electronics assembly comprising: a body comprising a magnetic material; a coil embedded in the body and including a plating layer; an insulating member made of glass covering the coil, and First and second external electrodes disposed outside the body and connected to the coil, Wherein the insulating member includes an insulating wall extending in a thickness direction between adjacent turns of the coil.
18. 18. The coil electronic assembly of claim 17, wherein: The insulating wall is in direct contact with both the first coil pattern and the second coil pattern of the coil.

Description

Coil electronic assembly Technical Field The present disclosure relates to a coil electronic assembly. Background In recent years, as functions of mobile devices have been diversified, power consumption has increased, coil electronic components having small loss and excellent efficiency have been employed around Power Management Integrated Circuits (PMICs) to increase battery life in the mobile devices. There is an increasing demand for thin power inductors to make the product thinner and to increase the flexibility of component placement. Wherein the thin film inductor may be manufactured by forming a coil on the support member using sputtering or plating. During the process of manufacturing the thin film inductor, the support member may be deformed by heat or pressure. When the support member is deformed, the alignment of the coil may be disturbed, exposing the coil to the outside or causing a short circuit, which may reduce the reliability of the thin film inductor. Disclosure of Invention It is an aspect of the embodiments to provide a coil electronic assembly with enhanced reliability. However, the problems solved by the embodiments are not limited to the above-described problems, but may be variously expanded within the scope of the technical spirit included in the embodiments. An embodiment provides a coil electronic component including a main body including a magnetic material, a coil embedded in the main body and including a plating layer, and an insulating member made of glass covering the coil, wherein the plating layer includes a first plating layer and a second plating layer covering the first plating layer. A portion of the first plating layer may be in contact with the second plating layer, and the remaining portion of the first plating layer may be in contact with the insulating member. The coil may include a first coil pattern and a second coil pattern, and the insulating member may include an inner insulating member between the first coil pattern and the second coil pattern. The inner insulation member may include a first support surface and a second support surface opposite to each other, the first coil pattern may be disposed on the first support surface, and the second coil pattern may be disposed on the second support surface. The coil electronic assembly may further include a first via passing through the inner insulation member and connecting the first coil pattern and the second coil pattern. The insulating member may include an outer insulating member disposed between the coil and the body. The outer insulating member may be disposed on an outer surface of the coil. The second plating layer may be in contact with the outer insulating member. The body may include first and second surfaces opposite to each other in a first direction, the coil may include a plurality of turns wound around a winding axis in the first direction, and the insulating member may include an insulating wall between the turns of the coil. The insulating member may include photosensitive glass. The insulating member may include at least one of SiO 2-B2O3 -based glass, siO 2-B2O3-K2 O-based glass, siO 2-B2O3-Li2 O-CaO-based glass, siO 2-B2O3-Li2 O-CaO-ZnO-based glass, and Bi 2O3-B2O3-SiO2-Al2O3 -based glass. The insulating member may further include at least one of quartz, alumina, magnesia, silica, forsterite (Mg 2SiO4), talc (H 2Mg3(SiO3)4), and zirconia. The body may include a first surface and a second surface opposite to each other in a first direction, the coil may be wound around a winding axis in the first direction, and the coil may include a lead-out terminal exposed at the first surface or the second surface of the body. The coil electronic assembly may further include an external electrode disposed outside the main body and connected to the lead-out terminal. The external electrode may be disposed on the first surface or the second surface of the body. The coil electronic assembly may further include a surface insulation layer disposed on an outer surface of the body. An embodiment provides a coil electronic assembly including a main body including a magnetic material, a coil embedded in the main body and including a plating layer, an insulating member made of glass covering the coil, and first and second external electrodes disposed outside the main body and connected to the coil, wherein the insulating member includes an insulating wall extending in a thickness direction between adjacent turns of the coil. According to embodiments, a coil electronic assembly with enhanced reliability may be provided. Drawings Fig. 1 is a perspective view schematically showing a coil electronic assembly according to an embodiment. Fig. 2 is a schematic cross-sectional view taken along line II-II' of fig. 1. Fig. 3 is a schematic cross-sectional view taken along line III-III' of fig. 1. Fig. 4 is a sectional view schematically showing the coil of fig. 1. Fig. 5 to 19 are diagrams sequentially showing a manufacturing