Search

CN-122000198-A - Multilayer electronic component

CN122000198ACN 122000198 ACN122000198 ACN 122000198ACN-122000198-A

Abstract

The present disclosure provides a multilayer electronic assembly. The multilayer electronic component includes a main body including a capacitance forming portion including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, and a cover portion provided on both surfaces of the capacitance forming portion in the first direction, and an external electrode provided on the main body, wherein the cover portion includes titanium (Ti), gallium (Ga), and magnesium (Mg), and satisfies 0.2 < CG/CM <1.0 when a number of moles of gallium (Ga) of the cover portion with respect to 100 moles of titanium (Ti) is CG and a number of moles of magnesium (Mg) of the cover portion with respect to 100 moles of titanium (Ti) is CM.

Inventors

  • Shen Dazhen
  • JIN ZAIYUAN
  • Pu Zhengzhen
  • Pu Tingzhen
  • LI ZHONGHAO

Assignees

  • 三星电机株式会社

Dates

Publication Date
20260508
Application Date
20251014
Priority Date
20241101

Claims (11)

  1. 1. A multilayer electronic assembly comprising: A main body including a capacitance forming portion including a dielectric layer and an internal electrode alternately arranged with the dielectric layer in a first direction, and a cover portion arranged on both surfaces of the capacitance forming portion in the first direction, and An external electrode disposed on the main body, Wherein the cover portion includes Ti, ga and Mg, and when the mole number of Ga of the cover portion with respect to 100 moles of Ti is CG and the mole number of Mg of the cover portion with respect to 100 moles of Ti is CM, Satisfies CG/CM of 0.2-1.0.
  2. 2. The multilayer electronic component of claim 1, wherein CG satisfies 0.3 mol≤cg≤1.0 mol.
  3. 3. The multilayer electronic component of claim 1, wherein CM satisfies 1.0 mol≤cm≤2.0 mol.
  4. 4. The multilayer electronic assembly of claim 1, wherein the cover has a composition different from a composition of the dielectric layer.
  5. 5. The multilayer electronic assembly of claim 1, wherein the dielectric layer comprises Ti, and When the mole number of Ga of the dielectric layer relative to 100 moles of Ti is DG, DG < CG is satisfied.
  6. 6. The multilayer electronic component of claim 5, wherein DG satisfies 0 mol≤dg <0.1mol.
  7. 7. The multilayer electronic assembly of claim 1, wherein the cover comprises a plurality of dielectric dies, and The average size of the dielectric grains is 150nm or more and 250nm or less.
  8. 8. The multilayer electronic assembly of claim 1, wherein the cover comprises a plurality of dielectric dies, and The dimensional deviation of the dielectric grains is less than or equal to 80nm.
  9. 9. The multilayer electronic component of claim 1, wherein the cover comprises a plurality of dielectric grains, grain boundaries disposed between adjacent ones of the plurality of dielectric grains, and an n-center disposed at a point where three or more of the grain boundaries contact each other, and At least one of the grain boundaries and/or at least one of the n-centers comprises a second phase comprising at least one selected from Ga, mg, and Ti.
  10. 10. The multilayer electronic component of claim 9, wherein the second phase comprises Ga and Ti, and wherein an atomic percentage of Ga of the second phase with respect to 100at% of Ti is equal to or greater than 2at% and equal to or less than 5at%.
  11. 11. The multilayer electronic component of claim 9, wherein the second phase comprises Mg and Ti, and an atomic percentage of Mg of the second phase relative to 100at% Ti is 5at% or more and 15at% or less.

Description

Multilayer electronic component The present application claims the benefit of priority of korean patent application No. 10-2024-0153643 filed on 1 month 2024 at 11 in korean intellectual property office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates to a multilayer electronic assembly. Background A multilayer ceramic capacitor (MLCC, a type of multilayer electronic component) is a chip capacitor that can be mounted on a printed circuit board of various electronic products such as an imaging device including a Liquid Crystal Display (LCD) or a Plasma Display Panel (PDP), a computer, a smart phone, or a mobile phone for charging or discharging thereof. Such a multilayer ceramic capacitor has a small size, can realize high capacitance, and is easily mounted on a printed circuit board, and thus can be used as a component of various electronic devices. As various electronic devices such as computers and mobile devices have reduced size and higher output, the demand for multilayer ceramic capacitors having reduced size and higher capacitance has increased. With the development of miniaturization and high capacitance, the need for protecting the region for forming the capacitance is increasing, and generally, the region for forming the capacitance is protected by adding an edge region around the region for forming the capacitance. However, as structural designs are continuously changed to achieve miniaturization and high capacitance, there may be problems in that the moisture-proof reliability and strength of the multilayer ceramic capacitor are reduced due to the increase in size of the region for forming the capacitance and the decrease in size of the edge region protecting the region for forming the capacitance. In order to solve the above-mentioned problems, the grain size of the covering portion may be designed to be small and uniform, and when the grain size is reduced, breakdown voltage characteristics may be improved, but there may be a problem in that an increase in the number of voids due to a decrease in density may cause a side effect of a decrease in reliability. Disclosure of Invention An aspect of the present disclosure is to provide a multilayer electronic component having improved moisture-proof reliability by improving the density of a cover to suppress the formation of voids. An aspect of the present disclosure is to provide a multilayer electronic component having improved breakdown voltage characteristics. However, various problems to be solved by the present disclosure are not limited to the above, and may be more easily understood in explaining specific embodiments of the present disclosure. According to an aspect of the present disclosure, a multi-layered electronic component may include a body including a capacitance forming part including a dielectric layer and inner electrodes alternately disposed with the dielectric layer in a first direction, and a cover part disposed on both surfaces of the capacitance forming part in the first direction, and an external electrode disposed on the body, wherein the cover part may include titanium (Ti), gallium (Ga), and magnesium (Mg), and may satisfy 0.2 < CG/CM <1.0 when a mole number of gallium (Ga) of the cover part with respect to 100 moles of titanium (Ti) is CG and a mole number of magnesium (Mg) of the cover part with respect to 100 moles of titanium (Ti) is CM. Drawings The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which: Fig. 1 schematically illustrates a perspective view of a multilayer electronic assembly according to an embodiment of the disclosure; Fig. 2 schematically illustrates an exploded perspective view of a stacked structure of a body according to an embodiment of the present disclosure; FIG. 3 schematically illustrates a cross-sectional view taken along line I-I' of FIG. 1; FIG. 4 schematically illustrates a cross-sectional view taken along line II-II' of FIG. 1; FIG. 5 schematically illustrates a cross-sectional view taken along line II-II' of FIG. 1, in accordance with another embodiment of the present disclosure; fig. 6A is an image of a cross section of a cover section taken using a Transmission Electron Microscope (TEM); FIG. 6B is an image of the same cross-section of a cover obtained by scanning magnesium (Mg) in TEM-energy dispersive X-ray spectroscopy (EDS) mode; fig. 6C is an image of the same cross section of the cover obtained by scanning gallium (Ga) in TEM-EDS mode; Fig. 7A is an image of the aperture observed in the cross section of the covering portion of comparative example 1; Fig. 7B is an image of the aperture observed in the cross section of the cover of example 1; fig. 8A is a graph showing the number of voids (ea) observed in the cross section of the covering portions of comp