CN-122000214-A - Preparation method of encapsulated pulse capacitor module

CN122000214ACN 122000214 ACN122000214 ACN 122000214ACN-122000214-A

Abstract

The application belongs to the field of preparation of potting capacitors, and particularly relates to a preparation method of a potting pulse capacitor module, wherein the potting pulse capacitor module comprises a potting shell, a capacitor module arranged in the potting shell and a potting adhesive layer filled in the potting shell for fixing the capacitor module, the inner wall of the potting shell is provided with a plurality of grooves, and the grooves are arranged on the inner wall of the potting shell at intervals along the vertical direction; the preparation method comprises the following steps: the application ensures that the inside of the encapsulated product is compact without pore generation by limiting the structural composition and the preparation method of the encapsulated pulse capacitor module, ensures the structural strength of the prepared product, can be used in higher impact and vibration environments and meets the use requirement of the encapsulated pulse capacitor module.

Inventors

WU YUDONG
ZHANG ZISHAN
RAO WEI
CHEN LONGBO
ZHU JIANGBIN
LIU LIHAO
TANG CHANGMING
ZHENG HUIRU
CHEN YONGHONG
LIN ZHISHENG

Assignees

福建火炬电子科技股份有限公司

Dates

Publication Date: 20260508
Application Date: 20260408

Claims (10)

1. The preparation method of the encapsulating pulse capacitor module is characterized in that the encapsulating pulse capacitor module comprises an encapsulating shell, a capacitor module arranged in the encapsulating shell and an encapsulating adhesive layer filled in the encapsulating shell for fixing the capacitor module, wherein a plurality of grooves are formed in the inner wall of the encapsulating shell, and the grooves are arranged on the inner wall of the encapsulating shell at intervals along the vertical direction; the preparation method of the encapsulated pulse capacitor module specifically comprises the following steps: step 1, cleaning the inner wall of the encapsulation shell and the welded capacitor module by using an air gun; step 2, sending the cleaned encapsulation shell and the capacitor module into a cavity of plasma treatment equipment, vacuumizing the plasma treatment equipment to 50pa, adjusting the power of the plasma treatment equipment to be 200-400W, forming luminous plasma glow by mixed gas of oxygen and argon, and treating the encapsulation shell and the capacitor module for 3-8min; Step 3, after the treatment is completed, removing the encapsulation shell and the capacitor module from the plasma equipment, and coating a priming paint on the inner wall of the encapsulation shell within 2 hours, wherein the priming paint is filled in the plastic encapsulation shell, and is poured out after standing for 8-15min, and then the inner wall of the encapsulation shell is uniformly smeared by using a hairbrush; Step 4, conveying the encapsulated shell coated with the encapsulating primer paint into an oven, and curing for 10-20min at 70-90 ℃; Step 5, filling the capacitor module subjected to plasma treatment into a potting shell, firstly filling one third of potting adhesive, then integrally placing the capacitor module into vacuum equipment and vacuumizing for 4-6min, secondly filling one third of potting adhesive, integrally placing the capacitor module into the vacuum equipment and vacuumizing for 4-6min, and repeating the steps until the potting adhesive is filled; And 6, placing the potting shell filled with the potting glue at 25 ℃ for 2-4 hours to finish primary curing, and then sending the primary curing shell into an oven to cure for 1-3 hours at 75-85 ℃ to obtain the potting pulse capacitor module.
2. The method of claim 1, wherein the capacitor module comprises two lead frames arranged oppositely, a plurality of capacitor chip sets arranged between the two lead frames at intervals, and two solder layers respectively arranged on the inner sides of the two lead frames, the capacitor chip sets comprise a plurality of capacitor chips stacked in sequence along the vertical direction, and the end parts of the capacitor chips are connected with the opposite solder layers.
3. The method of claim 2 wherein the lead frame includes a frame body, two connection pins disposed opposite to the upper end of the frame body, and a plurality of vent holes disposed on the frame body at intervals, the connection pins extending outward to the outside of the potting adhesive layer, the plurality of vent holes being opposite to the ends of the capacitor chip.
4. The method of claim 3, wherein the top of the housing has a downwardly extending positioning slot for the insertion of the opposing connection pins.
5. The method of claim 4 wherein the connecting pins comprise a connecting section connected to the upper end of the frame body and a pin section perpendicular to the connecting section, and the pin section is embedded in the opposite positioning groove.
6. The method of claim 5, wherein the pin segment is provided with a connecting hole.
7. The method of claim 2, wherein the top of the capacitor chip set is lower than the top of the encapsulation housing.
8. The method of claim 1, wherein the notch extends from the inner wall of the housing to a depth of 1-2mm.
9. The method of claim 1, wherein in step5, the vacuum equipment is evacuated to 0.1Mpa.
10. The method of claim 1, wherein in the step 2, the mixing ratio of oxygen and argon is 6:4 by volume.

Description

Preparation method of encapsulated pulse capacitor module Technical Field The invention belongs to the field of preparation of encapsulated capacitors, and particularly relates to a preparation method of an encapsulated pulse capacitor module. Background The pulse capacitor module is generally applied to the field of high-voltage discharge, and the assembled capacitor module is usually encapsulated, so that air in a cavity can be isolated through potting adhesive, the phenomenon of flying foxes of a high-voltage chip is prevented, and the pulse capacitor module has the additional advantage that the structural strength of the whole product can be enhanced, and therefore the pulse capacitor module can be used in high impact and vibration environments. However, the quality of pouring sealant is greatly influenced on the performance of products, the pouring sealant is required to be compact generally, no pore is generated, pores are easy to generate at the contact position of the pouring sealant and the shell at present, the problem is consistent and plagues various large manufacturers, and the pouring sealant needs to be further improved. Disclosure of Invention The invention aims to overcome the defects of the prior art and provides a preparation method of a potting pulse capacitor module. The invention adopts the following technical scheme: The preparation method of the encapsulation pulse capacitor module comprises an encapsulation shell, a capacitor module arranged in the encapsulation shell and an encapsulation adhesive layer filled in the encapsulation shell for fixing the capacitor module, wherein the inner wall of the encapsulation shell is provided with a plurality of notch grooves which are arranged on the inner wall of the encapsulation shell at intervals along the vertical direction; the preparation method of the encapsulated pulse capacitor module specifically comprises the following steps: step 1, cleaning the inner wall of the encapsulation shell and the welded capacitor module by using an air gun; step 2, sending the cleaned encapsulation shell and the capacitor module into a cavity of plasma treatment equipment, vacuumizing the plasma treatment equipment to 50pa, adjusting the power of the plasma treatment equipment to be 200-400W, forming luminous plasma glow by mixed gas of oxygen and argon, and treating the encapsulation shell and the capacitor module for 3-8min; Step 3, after the treatment is completed, removing the encapsulation shell and the capacitor module from the plasma equipment, and coating a priming paint on the inner wall of the encapsulation shell within 2 hours, wherein the priming paint is filled in the plastic encapsulation shell, and is poured out after standing for 8-15min, and then the inner wall of the encapsulation shell is uniformly smeared by using a hairbrush; Step 4, conveying the encapsulated shell coated with the encapsulating primer paint into an oven, and curing for 10-20min at 70-90 ℃; Step 5, filling the capacitor module subjected to plasma treatment into a potting shell, firstly filling one third of potting adhesive, then integrally placing the capacitor module into vacuum equipment and vacuumizing for 4-6min, secondly filling one third of potting adhesive, integrally placing the capacitor module into the vacuum equipment and vacuumizing for 4-6min, and repeating the steps until the potting adhesive is filled; And 6, placing the potting shell filled with the potting glue at 25 ℃ for 2-4 hours to finish primary curing, and then sending the primary curing shell into an oven to cure for 1-3 hours at 75-85 ℃ to obtain the potting pulse capacitor module. Further, the capacitor module comprises two lead frames which are oppositely arranged, a plurality of capacitor chip sets which are arranged between the two lead frames at intervals and two solder layers which are respectively arranged on the inner sides of the two lead frames, wherein each capacitor chip set comprises a plurality of capacitor chips which are sequentially stacked along the vertical direction, and the end parts of the capacitor chips are connected with the corresponding solder layers. Further, the lead frame comprises a frame body, two connecting pins oppositely arranged at the upper end of the frame body and a plurality of exhaust holes arranged on the frame body at intervals, wherein the connecting pins outwards extend to the outer side of the pouring sealant layer, and the exhaust holes are opposite to the end parts of the capacitor chip. Further, a positioning groove which extends downwards for embedding the opposite connecting pins is formed in the top of the encapsulating shell. Further, the connecting pin comprises a connecting section connected with the upper end of the frame body and a pin section which is perpendicular to the connecting section and is embedded into the opposite positioning groove. Further, the pin section is provided with a connecting hole. Further, the top of the capacito