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CN-122000657-A - High-heat-conductivity phase-change integrated heat dissipation assembly for phased array antenna and manufacturing method thereof

CN122000657ACN 122000657 ACN122000657 ACN 122000657ACN-122000657-A

Abstract

The utility model provides a be used for phased array antenna high heat conduction phase transition integration radiating element and preparation method thereof, this subassembly comprises the high heat conduction phase transition integration samming board of polylith different passageway numbers, each samming board structure divide into cavity and side cap, the cavity divide into hot junction and cold junction, the hot junction has solid-state high heat conduction core material to run through to the cold junction, the cold junction is provided with the kidney-shaped hole that runs through the base member, be used for with phased array antenna subassembly circuit interconnection, the phase change material of high volume enthalpy variable is filled to the cold junction serves as the heat sink, by the side cap through welding encapsulation, phase change material and high heat conduction core material direct contact in the cold junction cavity. The temperature equalization plate adopts an integrated processing mode, improves the cavity forming mode, enables the cold end and the hot end to be processed into a whole, solves the problem that the stress concentration point is coincident with the mechanical weak point, reduces the mechanical risk, and can be well applied to missile-borne environment conditions.

Inventors

  • HE YUN

Assignees

  • 西安聚变材料科技有限公司

Dates

Publication Date
20260508
Application Date
20241105

Claims (8)

  1. 1. The utility model provides a be used for phased array antenna high heat conduction phase transition integration radiating assembly, this subassembly comprises the high heat conduction phase transition integration samming board of polylith different passageway numbers, samming inboard is equipped with the phase transition chamber, and the phase transition chamber fills all around has the phase transition material of high volume enthalpy variable and acts as the heat sink, and the phase transition chamber center has the solid-state high heat conduction core material from the hot junction to run through and with phase transition material direct contact.
  2. 2. The heat dissipating assembly of claim 1 wherein the temperature equalizing plate is divided into a cavity and a side cover, the cavity is divided into a hot end and a cold end, and the temperature equalizing plate is integrally made of a metal material including aluminum alloy and its composite material, copper alloy and its composite material.
  3. 3. The heat dissipating assembly of claim 1 wherein the cold end phase change chamber is provided with kidney-shaped holes therethrough on either side for line interconnection with the phased array antenna assembly.
  4. 4. The heat dissipating assembly of claim 1, wherein the phase change material comprises an organic phase change material (paraffin-based phase change material, sugar alcohol-based phase change material, ester-based phase change material) and an inorganic phase change material (crystalline hydrated salt-based phase change material, molten salt-based phase change material, metal or alloy-based phase change material).
  5. 5. The heat dissipating assembly of claim 1, wherein the high thermal conductivity core material is a graphene pressed article, pyrolytic graphite or diamond article (bulk diamond article, particle bonded diamond article) modified by Z-direction thermal conductivity.
  6. 6. A preparation method for a phased array antenna high-heat-conductivity phase-change integrated radiating assembly is characterized by comprising the steps of integrally processing and forming a temperature equalization plate, placing a modified high-heat-conductivity core material into a cavity after processing, then welding the cavity, drawing out a phase-change cavity at a cold end, brushing a protective material in the phase-change cavity, filling the phase-change cavity with the phase-change material from an opening of the cold end, and then welding and sealing an end cover and the cavity.
  7. 7. The method of claim 6, wherein the phase change material filling comprises lid opening and filling.
  8. 8. The method of claim 6, wherein the cold end and the hot end of the temperature equalization plate are integrally formed and are integrally formed.

Description

High-heat-conductivity phase-change integrated heat dissipation assembly for phased array antenna and manufacturing method thereof Technical Field The invention belongs to the field of thermal management, and particularly relates to a phase change integrated heat dissipation assembly with high heat conduction for a phased array antenna. Background The heat dissipation of the high-power chip on the TR module in the phased array antenna is a key factor in the development process of weaponry, in order to adapt to the requirements of modern combat, weaponry such as aircrafts, missiles and the like are developing towards the direction of miniaturization and light weight, and meanwhile, more accurate positioning and longer guidance time are considered, so that the power of the chip on the TR module in the phased array antenna is greatly increased, and larger power inevitably brings larger heating value. The invention patent with publication number CN117638448A provides a heat dissipation assembly for thermal management of a phased array antenna TR and a manufacturing method thereof, adopts a mode of sharing a cavity between a high heat conduction core material and a phase change high heat conduction integrated structure, reduces contact thermal resistance, improves phase change reaction rate, and leads the connection part of the hot end and the cold end of a substrate to be connected in a welding mode, so that the mechanical property of a temperature equalization plate is poor, long-time impact and vibration cannot be dealt with, and the threat of resonance is more serious for non-ground fixed equipment. In order to meet the working requirements in a missile-borne environment, the phase-change high-heat-conductivity heat-equalizing plate heat dissipation assembly with the functions of heat rapid transfer and heat rapid absorption is provided, can be widely applied to modern combat systems and weapons, and meets the following conditions: (1) The heat dissipation assembly should have smaller conduction thermal resistance and temperature gradient, which is helpful for realizing chip temperature control; (2) The cavity forming mode is changed, certain structural stability can be maintained under the conditions of impact and vibration, the overall mechanical property is good, and the device can adapt to the mechanical environment of various weaponry; (3) In a limited space, the phase change reaction speed is improved, so that the phase change material can be fully utilized in unit combat time, and the temperature rise caused by the reaction delay of the phase change material is avoided. Disclosure of Invention The invention aims to solve the problems in the background art, and provides a phase-change integrated heat dissipation assembly with high heat conduction for a phased array antenna. The phase-change high-heat-conductivity integrated temperature equalization plate in the heat radiation assembly not only can realize quick heat transfer, quick absorption and quick reaction, but also greatly reduces the contact thermal resistance in the heat transfer process, and meanwhile, the phase-change materials with high volume enthalpy change are selected to act together, so that the heat radiation assembly is more miniaturized and lighter. The temperature equalizing plate adopts integrated processing, thereby improving the matrix forming method and leading the mechanical property of the component to be more stable. In order to solve the problems, the technical scheme of the invention is as follows: The phased array antenna high heat conduction phase change integrated heat dissipation assembly comprises a plurality of high heat conduction phase change integrated temperature equalization plates with different channel numbers, wherein each temperature equalization plate structure is divided into a cavity and a side cover, the cavity is divided into a hot end and a cold end, and the hot end and the cold end are integrally formed. The invention relates to a technical solution of a temperature equalization plate, which comprises the following steps: 1. Selecting a base seat blank 2 and a top cover blank 1, and finely machining in place to form two inner cavities 3 through CNC (computer numerical control), wherein the inner cavities are divided into a hot end 4 and a cold end 5, the hot end is mainly used for fixing a graphene core material, and the cold end is used for machining a curved surface of a kidney-shaped hole 8; 2. Selecting one or more carbon-based heat conducting sheets according to the size of the cavity, and forming a carbon-based heat conducting core layer with a certain thickness through hot pressing, wherein the hot pressing temperature is not lower than 500 ℃, and the pressure is not lower than 20MPa; 3, sequentially placing the graphene core layer into a boiled NaOH solution for degreasing and cleaning, placing the cleaned heat-conducting core layer into a prepared electroplating solution, and performing therma