CN-122000701-A - Wave absorbing device

Abstract

A wave-absorbing device is arranged outside an antenna clearance area in the interior of an electronic device and comprises a wave-absorbing pattern part, a wave-absorbing circuit and a grounding part. The length of the wave-absorbing pattern corresponds to the resonable length of the wave-absorbing frequency. The wave absorbing circuit at least comprises an attenuator. The grounding part is connected with the wave-absorbing pattern part and the wave-absorbing circuit. The wave-absorbing pattern part absorbs electromagnetic wave frequency bands possibly causing antenna interference, and the wave-absorbing circuit converts the electromagnetic wave frequency bands into heat energy, so that the effect of improving the signal-to-noise ratio can be achieved.

Inventors

• ZENG GUANXUE
• YANG ZHENKUN
• CHEN ZHAOYU
• Xie Jiadai
• LIN YONGQI
• CAI KEJUN

Assignees

• 微星科技股份有限公司
• 微盟电子(昆山)有限公司

Dates

Publication Date

20260508

Application Date

20241205

Priority Date

20241101

Claims (15)

1. 1. A wave absorbing device disposed outside an antenna clearance area within an electronic device, comprising: A wave-absorbing pattern portion, wherein the length of the wave-absorbing pattern portion corresponds to a resonance-able length of a wave-absorbing frequency; a wave-absorbing circuit at least comprising an attenuator, and A grounding part connected with the wave-absorbing pattern part and the wave-absorbing circuit.
2. 2. The device of claim 1, wherein the absorbing circuit further comprises a transmission line connecting the absorbing pattern and the attenuator.
3. 3. The device of claim 2, wherein the snubber circuit further comprises a load impedance, wherein the load impedance is coupled to the attenuator.
4. 4. The device of claim 1, wherein the snubber circuit further comprises a load impedance, wherein the load impedance is coupled to the attenuator.
5. 5. The wave absorbing device of claim 1, wherein the attenuator is coupled to the ground.
6. 6. The wave absorbing device of claim 1, wherein the attenuator is a Pi-type attenuator.
7. 7. The wave absorbing device of claim 1, wherein the attenuator is a T-shaped attenuator.
8. 8. The device of claim 1, wherein the absorbing pattern is selected from the group consisting of an inverted-F antenna pattern, a dipole antenna pattern, a monopole antenna pattern, a slot antenna pattern, a chip antenna pattern, a loop antenna, and a patch antenna.
9. 9. The device of claim 2, wherein the wave-absorbing pattern portion comprises a first wave-absorbing pattern and a second wave-absorbing pattern, wherein the first wave-absorbing pattern is connected to the attenuator, the second wave-absorbing pattern is connected to the grounding portion, and the lengths of the first wave-absorbing pattern and the second wave-absorbing pattern respectively correspond to the resonating lengths of different wave-absorbing frequencies.
10. 10. The device of claim 9, wherein the first and second absorbing patterns have a coupling gap therebetween.
11. 11. The wave absorbing device of claim 9, wherein the first wave absorbing pattern is connected to the transmission line.
12. 12. The device of claim 1, further comprising a substrate, wherein the wave-absorbing pattern and the wave-absorbing circuit are disposed on the substrate.
13. 13. The wave absorbing device of claim 12, wherein the substrate is a printed circuit board, a flexible printed circuit board, a glass substrate, a ceramic substrate, or a liquid crystal polymer.
14. 14. The device of claim 3, further comprising a second snubber circuit and a switching element, wherein the second snubber circuit comprises a second attenuator, and the snubber circuit and the second snubber circuit are connected to the ground part through the switching element.
15. 15. The device of claim 14, wherein the second absorbing circuit further comprises a second load impedance and a second transmission line, wherein the second transmission line is connected to the absorbing pattern portion, the second attenuator is connected to the second transmission line and the second load impedance, and the second load impedance and the load impedance are connected to the grounding portion through the switching element.

Description

Wave absorbing device Technical Field The invention relates to the field of electronics, in particular to a wave absorbing device. Background With the miniaturization of various electronic devices, the internal space of the electronic device is reduced, but with the increase of the operation frequency of internal components such as chips and memories, the noise inside the electronic product is increased. In the present electronic products, along with the signal transmission and reception, the antenna is also an indispensable element, but the strength of the noise interference is increased, which may greatly reduce the signal-to-noise ratio, and further affect the wireless communication quality of the system. At present, a common mode is to attach conductive foam (gasset) or electromagnetic wave absorbing material (absorber), but only can passively absorb electromagnetic waves, and the thickness is thicker, so that the design margin of the electronic device is limited. In addition, the electronic device has numerous elements, disordered sources of noise and difficult confirmation of sources, and different electromagnetic wave absorbing materials are required to be matched with different frequency bands and arranged at specific positions, so that the difficulty of design layout is affected. Disclosure of Invention The present invention is directed to a wave absorbing device, which solves at least one of the above problems. In order to solve the foregoing problems, a wave absorbing device is provided herein. The wave absorbing device is arranged outside the antenna clearance area in the electronic device and comprises a wave absorbing pattern part, a wave absorbing circuit and a grounding part. The length of the wave-absorbing pattern corresponds to the resonable length of the wave-absorbing frequency. The wave absorbing circuit at least comprises an attenuator. The grounding part is connected with the wave-absorbing pattern part and the wave-absorbing circuit. In some embodiments, the wave absorbing circuit further comprises a transmission line, and the transmission line is connected to the wave absorbing pattern portion and the attenuator. Further, in some embodiments, the snubber circuit further comprises a load impedance, the load impedance being connected to the attenuator. In some embodiments, the snubber circuit further comprises a load impedance, the load impedance being connected to the attenuator. In some embodiments, the attenuator is a Pi-type attenuator. In some embodiments, the attenuator is a T-type attenuator. In some embodiments, the absorptive pattern portion is selected from the group consisting of an inverted-F antenna pattern, a dipole antenna pattern, a monopole antenna pattern, a slot antenna pattern, a chip antenna pattern, a loop antenna, and a patch antenna. Further, in some embodiments, the wave-absorbing pattern portion includes a first wave-absorbing pattern and a second wave-absorbing pattern. The first wave-absorbing pattern is connected with the attenuator, the second wave-absorbing pattern is connected with the grounding part, and the lengths of the first wave-absorbing pattern and the second wave-absorbing pattern respectively correspond to the resonable lengths of different wave-absorbing frequencies. In more detail, in some embodiments, there is a coupling gap between the first and second absorptive patterns. In more detail, in some embodiments, the first wave-absorbing pattern is connected to the transmission line. In some embodiments, the wave absorbing device further includes a substrate, and the wave absorbing pattern portion and the wave absorbing circuit are disposed on the substrate. Further, in some embodiments, the substrate is a printed circuit board, a flexible printed circuit board, a glass substrate, a ceramic substrate, or a liquid crystal polymer. In some embodiments, the wave-absorbing device further includes a second wave-absorbing circuit and a switching element, the second wave-absorbing circuit includes at least a second attenuator, and the wave-absorbing circuit and the second wave-absorbing circuit are connected to the ground portion through the switching element. Further, the second absorbing circuit further comprises a second load impedance and a second transmission line. The second transmission line is connected with the wave-absorbing pattern part, the second attenuator is connected with the second transmission line and the second load impedance, and the second load impedance and the load impedance are connected with the grounding part through the switching element. As in the previous embodiments, by the wave absorbing device like the antenna pattern, the electromagnetic wave can be received by the wave absorbing pattern portion, and then attenuated and converted into heat energy by the wave absorbing circuit. The wave absorbing device can be arranged outside the antenna clearance area in the electronic device, so that a larger design margin of layo