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CN-122000738-A - Electronic equipment

CN122000738ACN 122000738 ACN122000738 ACN 122000738ACN-122000738-A

Abstract

The heat sink is made to be in almost non-sliding contact with the plug housing by a simple structure. In an electronic device (10), a heat sink (51) is supported so as to be movable in a first direction relative to a socket housing (61), a contact surface (25) of a plug housing (21) and a heat release surface of the heat sink (51) are formed as inclined surfaces, a pressing means (63) is disposed between the heat sink (51) and the socket housing (61), a guide portion (cam groove (62)) is formed in the socket housing (61), the guide portion restricts movement of the heat sink (51) in a negative second direction when the heat sink (51) is positioned in the positive first direction relative to the socket housing (61), and movement of the heat sink (51) in the positive second direction is restricted when the heat sink (51) is positioned in the negative first direction relative to the socket housing (61), and the heat sink (51) has a guided portion (cylindrical protrusion (57)) that is guided by the guide portion (cam groove (62)) formed in the socket housing (61).

Inventors

  • Minakuguchi

Assignees

  • 日本航空电子工业株式会社

Dates

Publication Date
20260508
Application Date
20250730
Priority Date
20241108

Claims (8)

  1. 1. An electronic device, comprising: A plug connector comprising a plug housing and a plug shell; a socket housing having an opening portion for enabling the plug connector to be inserted and removed, and A heat sink provided via a socket housing mounted to the socket housing so as to be movable with respect to the socket housing, When the plug connector is inserted into the opening of the socket housing and is in a fitted state, the heat radiator radiates heat generated from the plug connector by the contact surface of the plug housing contacting the heat radiation surface of the heat radiator, Wherein, when the plug connector is inserted into the opening of the socket housing in a first direction, the plug connector is pulled out of the opening in a positive first direction, and the plug connector is inserted into the opening in a negative first direction, At the same time, when a direction orthogonal to the first direction is defined as a second direction, and a direction in which the heat release surface of the heat sink is arranged with respect to the plug housing in the fitted state is defined as a positive second direction, a direction in which the plug housing is arranged with respect to the heat release surface of the heat sink is defined as a negative second direction, The heat sink is supported to be movable in a first direction relative to the socket housing, The contact surface of the plug housing and the heat discharging surface of the heat sink are both formed as inclined surfaces having inclination with respect to a first direction, A pressing unit is disposed between the heat sink and the socket housing, the pressing unit pressing the heat sink in a positive first direction with respect to the socket housing, A guide portion is formed in the socket housing, the guide portion restricting movement of the heat sink in a negative second direction when the heat sink is in a positive first direction with respect to the socket housing, restricting movement in a positive second direction when the heat sink is in a negative first direction with respect to the socket housing, The heat sink has a guided portion that is guided by the guide portion formed in the receptacle housing.
  2. 2. The electronic device of claim 1, wherein the electronic device comprises a memory device, The guide portion is formed as a cam groove constituted by a groove shape, The guided portion is formed as a cylindrical projection portion formed in a cylindrical projection shape of a groove shape fitted into the cam groove, The second direction dimension between the negative second direction portion of the cam groove on the positive first direction side and the positive second direction portion of the cam groove on the negative first direction side is set to alpha, Assuming that the diameter dimension of the cylindrical projection shape constituting the cylindrical projection is β, the following expression is established, α.about.β.
  3. 3. The electronic device according to claim 1 or 2, characterized in that, A locking portion as a fixing unit is formed at the plug housing, A locked portion as a fixed unit is formed at the socket housing, When the plug connector is inserted into the opening of the receptacle housing and is in a fitted state, the locking portion is engaged with the locked portion, so that the fitted state of the plug connector with respect to the receptacle housing is maintained against the pressing force applied by the pressing means.
  4. 4. The electronic device according to claim 1 or 2, characterized in that, The pressing unit is configured as an integral part of the socket housing.
  5. 5. The electronic device according to claim 1 or 2, characterized in that, The pressing unit is configured as a member separate from the socket housing.
  6. 6. The electronic device according to claim 1 or 2, characterized in that, The pressing unit is formed as a cantilever spring formed in a cantilever beam shape or a double support spring formed in a double support beam shape.
  7. 7. The electronic device according to claim 1 or 2, characterized in that, A heat-conducting sheet is provided on the heat release surface of the heat sink.
  8. 8. The electronic device of claim 2, wherein the electronic device comprises a memory device, The groove of the guide portion formed as the cam groove is formed in a substantially L-shape.

Description

Electronic equipment Technical Field The present disclosure relates to an electronic device. Background In recent years, electronic devices have been required to have higher heat dissipation efficiency because of increased power consumption of mounted electronic devices due to demands such as increased communication speed and increased processing power. Accordingly, there is a demand for an electronic device that can reasonably obtain a high heat dissipation effect only by contact of solids, such as an optical transceiver having a heat sink. Such a structure of an electronic device is disclosed in, for example, patent document 1 below. As shown in fig. 31 and 32, in an optical transceiver (10) as a conventional electronic device disclosed in patent document 1 below, contact surfaces (15 a, 14 a) between a heat sink (15) and a transceiver housing (14) are inclined surfaces, and a soft heat conductive sheet (18) is adhered to the contact surfaces (15 a, 14 a) of either the heat sink (15) or the transceiver housing (14). The heat sink (15) is supported so as to be movable within a predetermined range in the front-rear direction and the up-down direction with respect to the holder (12) in accordance with the insertion of the transceiver housing (14), the transceiver housing (14) is inserted without rubbing the contact surface of the heat conductive sheet (18), and the contact surface of the heat sink (15) and the transceiver housing (14) are pressed against each other with the heat conductive sheet (18) interposed therebetween at the final insertion position of the transceiver housing (14). In addition, reference numerals related to descriptions of prior art documents are distinguished from the embodiments of the present disclosure by brackets. Prior art literature Patent literature Patent document 1 Japanese patent laid-open publication No. 2009-152427 Disclosure of Invention First, the technical problem to be solved However, in the optical transceiver (10) disclosed in patent document 1, since the heat sink (15) is supported so as to be movable within a predetermined range in the front-rear direction and the up-down direction with respect to the holder (12) according to the insertion position of the transceiver housing (14), the structure such as the engaging protrusion (19) and the engaging hole (20) is required to be complicated so as not to rub the heat conductive sheet (18) by the pressing springs (17 a, 17 b). Accordingly, an object of the present invention is to provide an electronic device capable of bringing a heat sink (a thermally conductive sheet in the case where the thermally conductive sheet is mounted) into contact with a plug housing with little sliding by a simple structure. (II) technical scheme The electronic device is characterized by comprising a plug connector including a plug housing and a plug housing, a socket housing having an opening portion into which the plug connector can be inserted and removed, and a heat sink provided so as to be movable with respect to the socket housing via the socket housing attached to the socket housing, wherein when the plug connector is inserted into the opening portion of the socket housing and brought into a fitted state, the electronic device is brought into contact with a heat release surface of the heat sink through a contact surface of the plug housing, so that the heat sink dissipates heat generated from the plug connector, wherein when an insertion/removal direction of the plug connector with respect to the opening portion of the socket housing is defined as a first direction, and an insertion direction is defined as a negative first direction, and at the same time, a direction orthogonal to the first direction is defined as a second direction, and when the heat sink is placed in a fitted state with respect to the plug housing, a contact surface of the heat sink is defined as a contact surface of the heat sink, the heat sink is pushed against the socket housing, and when the plug connector is pressed against the socket housing, the heat sink is placed against the socket housing is defined as a contact surface of the heat sink, and when the heat sink is placed against the socket housing is pressed against the first direction, and the heat sink is placed against the socket housing is formed in a contact surface of the heat sink unit, the guide portion restricts movement of the heat sink in a negative second direction when the heat sink is in a positive first direction with respect to the receptacle housing, and restricts movement in a positive second direction when the heat sink is in a negative first direction with respect to the receptacle housing, the heat sink having a guided portion that is guided by the guide portion formed in the receptacle housing. In the electronic device of the present disclosure, the guide portion may be formed as a cam groove formed of a groove shape, the guided portion may be formed as a cylindrical protrusion formed