CN-122000781-A - Carrier-based laser assembly for high capacity integration onto a substrate

CN122000781ACN 122000781 ACN122000781 ACN 122000781ACN-122000781-A

Abstract

A carrier-based laser assembly for high capacity integration to a substrate is provided. In particular, an apparatus is provided that includes a semiconductor laser including a laser body including a laser end, a laser output at the laser end, and one or more first mating surfaces along the laser body, and a carrier including a carrier body, and one or more second mating surfaces along the carrier body. The one or more first mating surfaces and the one or more second mating surfaces are configured to slidably mate with one another. The laser body and the carrier body are configured such that the laser output at the laser end is exposed when the one or more first mating surfaces and the one or more second mating surfaces are slidably mated.

Inventors

Richard. Hryhovsky
Alex Befal
Mohammed Greta

Assignees

拉诺沃斯公司

Dates

Publication Date: 20260508
Application Date: 20251202
Priority Date: 20241107

Claims (9)

1. An apparatus, the apparatus comprising: A semiconductor laser, the semiconductor laser comprising: a laser body including a laser end; a laser output at the laser end; and one or more first mating surfaces along the laser body; and A carrier comprising a carrier body; and one or more second mating surfaces, the one or more second mating surfaces are along the carrier body, The one or more first mating surfaces and the one or more second mating surfaces are configured to slidably mate with one another, and The laser body and the carrier body are configured such that the laser output at the laser end is exposed when the one or more first mating surfaces and the one or more second mating surfaces are slidably mated.
2. The apparatus of claim 1, wherein the laser end overhangs an adjacent end of the carrier body.
3. The apparatus of claim 1, wherein the one or more first mating surfaces along the laser body are located at an end opposite the laser end and the one or more second mating surfaces along the carrier body are located at respective adjacent ends of the carrier body.
4. The apparatus of claim 1 wherein the one or more first mating surfaces along the laser body comprise one or more recesses in the laser body, Wherein the one or more second mating surfaces along the carrier body include one or more protrusions extending from the carrier body, and Wherein respective surfaces of the one or more recesses and the one or more protrusions are configured to slidably mate, the respective surfaces being perpendicular to the respective bodies.
5. The apparatus of claim 1, wherein at least one facet of the semiconductor laser comprises an etched facet.
6. The apparatus of claim 1 wherein the carrier body is wider than the laser body, the apparatus further comprising a substrate comprising a cavity that receives the laser body, the cavity comprising a respective laser end and an opposite end, a laser input at the respective laser end, and one or more carrier mating surfaces, Wherein the carrier further comprises one or more substrate mating surfaces, Wherein the one or more substrate mating surfaces and the one or more carrier mating surfaces are configured to slidably mate with each other as a combination of the semiconductor laser and the carrier, upon mating, slide in the cavity toward the laser input to align the laser output with the laser input.
7. The apparatus of claim 6, wherein the one or more substrate mating surfaces of the substrate are located at the respective laser ends of the cavity and the one or more substrate mating surfaces of the carrier are located near the laser ends.
8. The apparatus of claim 6, wherein the one or more carrier mating surfaces of the substrate comprise one or more protrusions extending from the substrate, and Wherein the one or more substrate mating surfaces of the carrier comprise one or more recesses in the carrier body.
9. The apparatus of claim 6, wherein the substrate comprises a plurality of cavities including the cavity to receive a plurality of respective mating semiconductor lasers and carriers.

Description

Carrier-based laser assembly for high capacity integration onto a substrate Background Increasingly, photonic and/or silicon photonic based optical engines require multiple laser sources to support multiple data tracks. In general, the need for a greater number of lasers is due to higher optical reflection tolerances, which generally requires lower output power, and thus supports fewer channels. Such a large number of lasers necessitates a very high yield of single device lasers in the integrated optical engine and the cumulative yield is multiplexed with the number of devices used. Furthermore, the lowest loss and most cost effective assembly method requires that the laser light source be directly attached to the silicon photonic device, for example, using pick and place techniques. However, yields from pick and place techniques that may rely on fiducial marks on a laser light source for accurate assembly, for example, may still be lower than desired. Drawings For a better understanding of the various examples described herein, and to show more clearly how they may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings in which: Fig. 1A depicts a side view of a laser device assembly including a semiconductor laser and a carrier, according to a non-limiting example. Fig. 1B depicts a top view of a laser device assembly according to a non-limiting example. Fig. 1C depicts a laser end view of a laser device assembly according to a non-limiting example. Fig. 2A depicts a top view of a carrier facing side of a laser device assembly according to a non-limiting example. Fig. 2B depicts a top view of a portion of a carrier facing side of a laser device assembly showing a first mating surface according to a non-limiting example. Fig. 3A depicts a top view of a laser facing side of a carrier of a laser device assembly according to a non-limiting example. Fig. 3B depicts a top view of a portion of a laser facing side of a carrier of a laser device assembly showing a second mating surface according to a non-limiting example. Fig. 4 depicts a perspective view of a pre-assembly laser and carrier according to a non-limiting example. Fig. 5 depicts a perspective view of a laser and carrier during assembly according to a non-limiting example. Fig. 6 depicts a perspective view of the laser and carrier as the assembly process advances further, and shows the beginning of the slip fit process, according to a non-limiting example. Fig. 7 depicts a detailed perspective view of a portion of the laser and carrier as the assembly process advances further, and shows the continuation of the slip fit process, focusing on the proximity of the first and second mating surfaces, according to a non-limiting example. Fig. 8 depicts a detailed perspective view of a portion of the laser and carrier with the first mating surface and the second mating surface mated and/or engaged as the assembly process is further advanced after the slip-fit process is completed, according to a non-limiting example. Fig. 9 depicts a bottom view of the substrate facing side of the laser device assembly and shows the substrate mating surface, according to a non-limiting example. Fig. 10 depicts a perspective view of a pre-assembly laser device assembly and substrate, and shows a carrier mating surface of a cavity of the substrate, according to a non-limiting example. Fig. 11 depicts a detailed perspective view of a portion of a substrate and a laser device assembly showing the laser device assembly inserted into a cavity of the substrate, a carrier resting on a surface of the cavity, and including the beginning of the assembly of another slip fit process, according to a non-limiting example. Fig. 12 depicts a detailed perspective view of a portion of the laser device assembly and the substrate as the assembly process is advanced further, after the slip fit process is completed, the substrate is mated and/or engaged with the carrier mating surface, according to a non-limiting example. Fig. 13 depicts a perspective view of a laser device assembly and a substrate in an assembled state, according to a non-limiting example. Fig. 14 depicts a perspective view of a device illustrating an array of laser device assemblies mated with a substrate that includes a plurality of cavities and waveguides, according to a non-limiting example. Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve the understanding of the embodiments of the present invention. The apparatus and method components have been represented where appropriate by conventional symbols in the drawings, showing only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the di