CN-122001236-A - Multilevel inverter system including X-type multilevel converter with mutual inductance cancellation

CN122001236ACN 122001236 ACN122001236 ACN 122001236ACN-122001236-A

Abstract

A multiphase power inverter for an electric propulsion system includes a plurality of X-type multi-level power converters arranged as solid state integrated circuits. Each X-type multi-level power converter includes a positive Direct Current (DC) power bus, a negative DC power bus, a first Alternating Current (AC) bus, a second AC power bus, a first clamp diode, a second clamp diode, a power module substrate disposed on an insulating substrate, and a heat sink adjacent a first side of the insulating substrate. The power module substrate includes a plurality of semiconductor switches, each semiconductor switch including a plurality of lateral semiconductor die, each lateral semiconductor die having a gate control terminal. The plurality of semiconductor switches, the first clamping diode, and the second clamping diode are coplanar with the DC power supply terminal on one side of the X-type multi-level power converter and the auxiliary and output terminals disposed on the opposite side.

Inventors

B.S.Wu
C.S. Namuduri
LUO YILUN
K. M. Alam
R. PRASAD
R. M. Nichols III

Assignees

通用汽车环球科技运作有限责任公司

Dates

Publication Date: 20260508
Application Date: 20250103
Priority Date: 20241106

Claims (10)

1. A multiphase power inverter for an electric propulsion system, the multiphase power inverter comprising: A plurality of X-type multi-level power converters arranged to transfer power between a high voltage Direct Current (DC) power source and a motor, wherein each of the plurality of X-type multi-level power converters is a solid state Integrated Circuit (IC), comprising: A positive DC power bus; a negative DC power bus; A first Alternating Current (AC) bus; A second AC power bus; A first clamping diode; A second clamping diode; A power module substrate disposed on the insulating substrate; A heat spreader adjacent the first side of the insulating substrate, and Wherein, the power module substrate includes: A plurality of semiconductor switches including a first semiconductor switch, a second semiconductor switch, a third semiconductor switch, a fourth semiconductor switch, a fifth semiconductor switch, a sixth semiconductor switch, a seventh semiconductor switch, and an eighth semiconductor switch; Wherein the first, second, third and fourth semiconductor switches are connected in series between the positive and negative DC power buses; Wherein the first semiconductor switch is connected to the second semiconductor switch at a first node, wherein the second semiconductor switch is connected to the third semiconductor switch at a second node, and wherein the third semiconductor switch is connected to the fourth semiconductor switch at a third node; wherein the fifth semiconductor switch, the sixth semiconductor switch, the seventh semiconductor switch, and the eighth semiconductor switch are connected in series between the positive DC power bus and the negative DC power bus; Wherein the fifth semiconductor switch is connected to the sixth semiconductor switch at a fourth node, wherein the sixth semiconductor switch is connected to the seventh semiconductor switch at a fifth node, and wherein the seventh semiconductor switch is connected to the eighth semiconductor switch at a sixth node; Wherein the first clamping diode is connected between the third node and the fourth node; wherein the second clamp diode is connected between the first node and the sixth node; wherein the second node is connected to the first AC power bus; Wherein the fifth node is connected to the second AC power bus; Wherein each of the plurality of semiconductor switches comprises a plurality of lateral semiconductor die, and wherein each of the plurality of lateral semiconductor die comprises a gate control terminal, and Wherein the plurality of semiconductor switches, the first clamp diode, and the second clamp diode are coplanar.
2. The multiphase power inverter of claim 1, wherein the first AC power bus and the second AC power bus are coplanar.
3. The multiphase power inverter of claim 1, wherein the first AC power bus and the second AC power bus are parallel to each other.
4. The multiphase power inverter of claim 1, wherein the first AC power bus and the second AC power bus are stacked.
5. The multiphase power inverter of claim 1, wherein the positive DC power bus and the negative DC power bus are parallel to each other.
6. The multiphase power inverter of claim 1, wherein each of the first AC power bus, the second AC power bus, the positive DC power bus, and the negative DC power bus extends beyond a top edge of the X-type multi-level power converter.
7. The multiphase power inverter of claim 1, wherein the positive DC power bus and the negative DC power bus extend beyond a top edge of the X-type multi-level power converter, and wherein the first AC power bus and the second AC power bus extend beyond a bottom edge of the X-type multi-level power converter.
8. The multiphase power inverter of claim 1, wherein the positive DC power bus and the negative DC power bus extend beyond a top edge of the X-type multi-level power converter, and wherein the first AC power bus and the second AC power bus extend perpendicular to the X-type multi-level power converter from a middle portion of the X-type multi-level power converter.
9. The multiphase power inverter of claim 1, wherein the interconnections comprise one or more of wire bonds, ribbon bonds, clip bonds, and direct copper bus bonds.
10. A multiphase power inverter for an electric propulsion system, the multiphase power inverter comprising: A plurality of X-type multi-level power converters arranged to transfer power between a high voltage Direct Current (DC) power source and a motor, wherein each of the plurality of X-type multi-level power converters is a solid state Integrated Circuit (IC), comprising: A positive DC power bus; a negative DC power bus; A first Alternating Current (AC) bus; A first auxiliary bus; a second auxiliary bus; a plurality of semiconductor switches disposed on the insulating substrate, the plurality of semiconductor switches including a first semiconductor switch, a second semiconductor switch, a third semiconductor switch, and a fourth semiconductor switch; a heat sink adjacent to the insulating substrate via a thermally conductive interface material; Wherein the first, second, third and fourth semiconductor switches are connected in series between the positive and negative DC power buses; Wherein the first semiconductor switch is connected to the second semiconductor switch at a first node, wherein the second semiconductor switch is connected to the third semiconductor switch at a second node, and wherein the third semiconductor switch is connected to the fourth semiconductor switch at a third node; Wherein the first node is connected to the first auxiliary bus; Wherein the second node is connected to the first AC power bus, and Wherein the third node is connected to the second auxiliary bus.

Description

Multilevel inverter system including X-type multilevel converter with mutual inductance cancellation Introduction to the invention The concepts described herein relate generally to vehicles employing an electrified powertrain or propulsion system that is comprised of a Direct Current (DC) power source that provides DC power that is converted to Alternating Current (AC) power via a multi-phase power inverter to control operation of one or more electric machines. As the trend of traffic electrification of consumer and commercial vehicles rapidly expands toward high capacity public transportation systems such as electric aircrafts, trains and ships, high voltage and high power multilevel inverters (MLIs) have received attention. MLIs such as Neutral Point Clamps (NPCs) and T-inverters provide high voltage and high power operation capability, but include stacked DC link capacitors with neutral point connections for zero voltage vectors. This neutral point connection to the stacked DC link capacitor may generate a neutral current oscillating at three times the fundamental frequency, which may cause capacitor voltage imbalance and overvoltage stress on the capacitor and switching devices. The multiphase inverter circuit may generate an inherent power supply loop in which high current flows from the DC link capacitor to the high side of the multi-level power inverter, then to the low side of the multi-level power inverter and back. The power supply loop may generate a magnetic field, which forms parasitic inductance. Because multiphase power inverters can operate at higher switching frequencies, even low levels of parasitic inductance can cause problems such as, but not limited to, ringing and/or electromagnetic interference (EMI). The current path determines the size of the power supply loop, which determines the size of the generated magnetic field and thus the size of the parasitic inductance. The current path is defined by the topology of the circuit and thus the topology of the circuit may affect the magnitude of the parasitic inductance. Because an X-type multilevel inverter may include a current path through a pair of external X-diodes, the length of the power supply loop increases, resulting in increased parasitic inductance. Disclosure of Invention In view of the above discussion, it would be useful to develop a system of integrated power semiconductor devices that includes selectively active and passive vertical and/or lateral semiconductor die to achieve mutual inductance cancellation of a multi-phase power inverter that includes a plurality of X-type multi-level power converters having a topology that reduces parasitic inductance within the multi-phase power inverter and/or within each X-type multi-level power converter. The concepts disclosed herein relate to a system for a multiphase power inverter including a plurality of X-type multi-level power converters that achieve mutual inductance cancellation. Such a system may be used in a vehicle having an electrified propulsion system, such as, but not limited to, a motor vehicle having an electrified powertrain or propulsion system, such as an Electric Vehicle (EV) or a plug-in hybrid electric vehicle (PHEV), or another mobile platform that may be driven by the electric propulsion system to reduce parasitic inductance within the multiphase power inverter. Each multiphase power inverter may include a plurality of X-type multi-level power converters disposed between a high voltage Direct Current (DC) power source and the motor. The number of X-type multi-level power converters required is application specific. Each X-type multi-level power converter may be configured as a solid state Integrated Circuit (IC) that includes a plurality of circuit components, such as, but not limited to, semiconductor switches and bus bars, that are connected to form an interconnected network through which current may flow. This form of network of interconnected circuits is referred to as a circuit topology. The concepts described herein provide a multiphase power inverter advantageously arranged to employ magnetic field cancellation to minimize stray inductance and loop inductance. This includes using the cancellation field by arranging positive, neutral and negative buses and a plurality of X-type multi-level power converters arranged in a solid state integrated circuit with lateral segmented elements. The arrangement of the X-type multi-level power converter with transverse sectioning elements enables single-sided or double-sided cooling to reduce thermal impedance. This configuration may be used to reduce stray inductance, resulting in lower switching losses, less ringing, less electromagnetic interference (EMI), and lower device thermal stress. A multiphase power inverter may include a plurality of X-type multi-level power converters arranged to transfer power between a high voltage Direct Current (DC) power source and a motor. Each of the plurality of X-type multi-level