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CN-122001315-A - Radio frequency front end module packaging structure and process method thereof

CN122001315ACN 122001315 ACN122001315 ACN 122001315ACN-122001315-A

Abstract

The invention relates to the technical field of chip packaging, in particular to a radio frequency front end module packaging structure and a process method thereof, comprising a packaging substrate; the packaging structure comprises a packaging substrate, a module chip, a fixing frame, a positioning glue filling groove, a positioning plate and a T-shaped slide plate, wherein bonding pads are arranged on the packaging substrate at equal intervals, welding bumps are arranged on the bottom wall of the module chip at equal intervals, the welding bumps are welded with the bonding pads, the fixing frame is arranged on the packaging substrate in a connecting mode, four corner positions of the protecting film are connected with the fixing frame, the protecting film covers the top end of the module chip, the embedding groove of the fixing frame is in embedding connection with the embedding ring of the protecting film, the positioning glue filling groove is in embedding connection with the positioning plate, the positioning structure of the T-shaped slide plate and the T-shaped clamp plate is combined, the problems that the bonding area of the protecting film and the substrate lacks high-precision matching and is prone to lamination dislocation in the traditional technology are solved, meanwhile glue in the positioning glue filling groove and glue column in the through hole are formed, bubble residues and uneven tension caused by manual placement are avoided, the protecting film is ensured to be spread smoothly, and packaging reliability is remarkably improved.

Inventors

  • Mao Junbin
  • YAN QIQI
  • ZHANG NING

Assignees

  • 江苏凯嘉电子科技有限公司

Dates

Publication Date
20260508
Application Date
20251212

Claims (10)

  1. 1. Radio frequency front end module packaging structure includes: The packaging substrate (1) is provided with bonding pads (101) at equal intervals; The module chip (2) is provided with welding lugs (201) at equal intervals on the bottom wall of the module chip (2), and the welding lugs (201) are welded with the bonding pads (101); The packaging structure comprises a fixing frame (3), wherein the fixing frame (3) is connected to a packaging substrate (1), embedded grooves (301) are formed in the fixing frame (3) at equal intervals, bonding pads (101) are located on the inner side of the fixing frame (3), and a module chip (2) is connected with the inner frame of the fixing frame (3) in an inserting mode. A solder bump (201), a solder mask layer (4) is arranged on the packaging substrate (1), the solder mask layer (4) wraps the fixed frame (3), a plastic sealing layer (5) is arranged on the solder mask layer (4), and the plastic sealing layer (5) covers the fixed frame (3); The protection film (6) is provided with embedded rings (601) in a connecting mode at four corner positions of the protection film (6), and the protection film (6) covers the top end of the module chip (2).
  2. 2. The radio frequency front end module packaging structure of claim 1, wherein four caulking grooves (301) are arranged in a matrix, positioning glue filling grooves (302) are arranged on the end wall of the fixed frame (3) in a matrix, one positioning glue filling groove (302) is arranged between two adjacent caulking grooves (301), the bottom wall of each positioning glue filling groove (302) is arranged in a V shape, and a glue injection pipe (303) is arranged at the center of the end wall of each caulking groove (301).
  3. 3. The radio frequency front end module packaging structure of claim 2, wherein the matrix of the glue injection pipes (303) is provided with four, the inner wall of the glue injection pipe (303) is communicated with the positioning glue filling groove (302) through a glue injection port (304), the bottom wall of the glue injection port (304) is arranged in an inclined plane, and glue is injected into the positioning glue filling groove (302) through the glue injection port (304) through the glue injection pipe (303).
  4. 4. The radio frequency front end module packaging structure of claim 3, wherein the rubber injection pipe (303) is inserted into the embedded ring (601), the bottom wall of the protective film (6) is attached to the top end of the fixed frame (3), the embedded ring (601) is embedded into the embedded ring groove (301), four positioning plates (602) are connected and arranged on the bottom wall matrix of the protective film (6), and two ends of each positioning plate (602) are connected with the embedded ring (601).
  5. 5. The radio frequency front end module packaging structure of claim 4, wherein the positioning plate (602) is embedded with the positioning glue filling groove (302), a convex plate (603) is arranged on the bottom wall of the positioning plate (602) in a connecting mode, and the convex plate (603) is movably arranged in the positioning glue filling groove (302).
  6. 6. The radio frequency front end module packaging structure of claim 5, wherein through holes (604) are formed in the side wall of the convex plate (603) at equal intervals, the glue injected into the positioning glue filling groove (302) is solidified and then is adhered to the positioning plate (602) and the convex plate (603), the glue injected into the positioning glue filling groove (302) fills the through holes (604) and is solidified to form a glue column, and the glue injection pipe (303) is sleeved with a sleeve (7).
  7. 7. The radio frequency front end module packaging structure of claim 6, wherein four sleeves (7) are arranged, bottom walls of the sleeves (7) are abutted against the caulking ring (601), lower rubber hoppers (701) are connected to the top ends of the sleeves (7), bottom wall openings of the lower rubber hoppers (701) extend into the inner wall of the rubber injection pipe (303), T-shaped sliding plates (702) are connected to the side walls of the sleeves (7), guide inclined planes (703) are arranged at the top ends of the T-shaped sliding plates (702), and T-shaped clamping grooves (704) are symmetrically formed in the two side walls of the fixing frame (3).
  8. 8. The radio frequency front end module packaging structure of claim 7, wherein the T-shaped clamping groove (704) is located at four corner positions of the fixed frame (3), a T-shaped clamping plate (705) is arranged in the T-shaped clamping groove (704) in a clamping manner, a T-shaped sliding groove (706) is formed in the end wall of the T-shaped clamping plate (705), and the T-shaped sliding plate (702) is movably clamped in the T-shaped sliding groove (706).
  9. 9. The radio frequency front end module packaging structure of claim 8, wherein a receiving groove (707) is formed in the side wall of the T-shaped sliding groove (706), a hand screw (708) is arranged on the side wall of the T-shaped clamping plate (705) in a threaded connection mode, a guide top block (709) is arranged at the end portion of the hand screw (708) in a connected mode, the guide top block (709) is movably arranged in the receiving groove (707), the end portion of the guide top block (709) is arranged in an arc surface mode, and the arc surface of the guide top block (709) abuts against the guide inclined surface (703).
  10. 10. The radio frequency front end module packaging process method according to any one of claims 1-9, wherein the process method is as follows: The method comprises the steps of correspondingly placing a module chip (2) on a bonding pad (101) of a packaging substrate (1), enabling the module chip (2) to be inserted into an inner frame of a fixed frame (3), enabling a welding lug (201) to be aligned with the bonding pad (101), fixing the module chip (2) and the bonding pad by adopting a welding process to form stable electric connection, covering a protective film (6) on the top end of the module chip (2), enabling an embedded ring (601) of the protective film (6) to be embedded with an embedded ring groove (301) of the fixed frame (3), enabling a positioning plate (602) to be embedded with a positioning glue filling groove (302), achieving initial positioning of the protective film (6), sleeving a sleeve (7) outside a glue filling pipe (303), enabling the bottom wall of the sleeve (7) to abut against the embedded ring (601), enabling a bottom wall opening of a lower glue hopper (701) to extend into the inner wall of the glue filling pipe (303), adjusting a screwing screw (708) to push a guide top block (709), fixing a T-shaped sliding plate (702) through matching an arc surface of the guide top block (709) with a guide inclined plane (703), injecting glue into the glue (303) through the lower glue hopper (701), enabling the glue to flow into the glue filling groove (304) through the embedded groove (302) to form a positioning post (602) after the glue filling groove (602) and forming a positioning post (602) to be firmly filled with the positioning post (603, and then preparing a solder mask layer (4) and a plastic sealing layer (5) to finish the preparation of the whole packaging structure.

Description

Radio frequency front end module packaging structure and process method thereof Technical Field The invention relates to the technical field of chip packaging, in particular to a radio frequency front end module packaging structure and a process method thereof. Background The radio frequency front end module package is a technology of integrating various active chips (such as a power amplifier, a low noise amplifier and the like) and passive devices (such as a filter, a capacitor, an inductor and the like) of a radio frequency front end into one package, in the radio frequency front end module package, a cavity structure between the filter chip and a package substrate is a key for guaranteeing core performances such as high-frequency signal selectivity and low insertion loss, the cavity needs to be kept clean in a subsequent plastic package process, if molten sealing resin permeates the cavity, key functional areas such as IDT (direct-contamination) of the chip can be caused, device performance is attenuated and even functions are disabled, and in order to solve the problem, the industry generally adopts a scheme of covering a protective film on the surface of the filter chip: For example, a chip package structure and a radio frequency front end module are disclosed in the chinese patent document CN 222441677U. The chip packaging structure comprises a packaging substrate, a filter chip, a protective film and a first insulating part, wherein the filter chip is connected with the packaging substrate, a gap is formed between the filter chip and the packaging substrate, the protective film at least covers the filter chip and part of the packaging substrate to form a cavity structure between the filter chip and the packaging substrate, and the first insulating part is arranged at a position on the protective film corresponding to the gap. The chip packaging structure can avoid the protection film from being broken at the gap. However, in the scheme and the prior art, after the radio frequency front end module chip is arranged on the substrate, the protective film is covered and combined with the packaging substrate in an adhesive mode to form a physical barrier to the cavity and block the resin invasion path, the laying and attaching of the protective film depend on manual or traditional mechanical operation, in the actual operation process, the adhesive area of the protective film and the substrate lacks high-precision die cutting matching, attaching dislocation is easy to occur, in addition, bubble residues or uneven tension are difficult to avoid in the manual placement process, the protective film cannot be spread smoothly, and the packaging reliability is seriously affected. Disclosure of Invention The invention aims to provide a radio frequency front end module packaging structure and a process method thereof, so as to solve the problems in the background technology. In order to achieve the above purpose, the invention provides a radio frequency front end module packaging structure, comprising: the packaging substrate is provided with bonding pads at equal intervals; The bottom wall of the module chip is equidistantly provided with welding convex blocks, and the welding convex blocks are welded with the bonding pads; A fixed frame; the fixed frame is connected and arranged on the packaging substrate, the fixed frame is equidistantly provided with embedded grooves, the bonding pads are positioned on the inner side of the fixed frame, and the module chip is spliced with the inner frame of the fixed frame. Welding the bump, arranging a solder mask layer on the packaging substrate, wrapping the fixed frame by the solder mask layer, arranging a plastic sealing layer on the solder mask layer, and covering the fixed frame by the plastic sealing layer; the four corner positions of the protective film are connected and provided with embedded rings, and the protective film covers the top end of the module chip. Preferably, the annular grooves are arranged in a matrix, the end wall of the fixed frame is provided with a positioning glue filling groove in a matrix, a positioning glue filling groove is arranged between two adjacent annular grooves, the bottom wall of the positioning glue filling groove is arranged in a V shape, and the center of the end wall of the annular groove is connected with a glue injection pipe. Preferably, the glue injection pipe matrix is provided with four, and the glue injection pipe inner wall is communicated with the positioning glue filling groove through the glue injection port, and the bottom wall of the glue injection port is arranged in an inclined plane, and glue is injected into the positioning glue filling groove through the glue injection port. Preferably, the glue injection pipe is inserted with the caulking ring, the bottom wall of the protective film is attached to the top end of the fixed frame, the caulking ring is in caulking connection with the caulking ring groove, four po