CN-122001391-A - High-frequency module and communication device

CN122001391ACN 122001391 ACN122001391 ACN 122001391ACN-122001391-A

Abstract

Provided are a high-frequency module and a communication device capable of reducing interference between adjacent first and second communication frequency bands and reducing degradation of communication quality. The high-frequency module includes a first filter, a second filter, a first switch, a second switch, and a first variable circuit element, wherein the first filter has a first passband including a first communication band. The second filter has a second passband including a second communications band. The first switch is used for selecting the connection destination of each of the plurality of antenna terminals from the first end of each of the first filter and the second filter. The second switch is used for selecting a connection destination of the second end portion of the second filter from the first power amplifier and the first low noise amplifier. The first variable circuit element is connected between the second filter and the second switch for shifting an attenuation band on the first passband side of the second filter.

Inventors

NAKAMURA TAKASHI
Nakagawa Akemi
Ikegami Koya

Assignees

株式会社村田制作所

Dates

Publication Date: 20260508
Application Date: 20251103
Priority Date: 20241105

Claims (9)

1. A high frequency module that processes a first TDD signal of a first communication band and a second TDD signal of a second communication band adjacent to the first communication band, the passband of the first communication band being wider than the passband of the second communication band, the high frequency module comprising: a first filter having a first passband including the first communications band; A second filter having a second passband including the second communications band; A first switch for selecting a connection destination of each of a plurality of antenna terminals from a first end of each of the first and second filters; A second switch for selecting a connection destination of the second end of the second filter from the first power amplifier and the first low noise amplifier, and And a first variable circuit element connected to the inside of the second filter, the inside of the second switch, or between the second filter and the second switch, for shifting an attenuation band on the first passband side of the second filter.
2. The high-frequency module according to claim 1, wherein, Also provided is a variable matching circuit connected between the second filter and the second switch, The first variable circuit element is disposed inside the variable matching circuit.
3. The high frequency module according to claim 1 or 2, wherein, A second variable circuit element is also provided, The second variable circuit element constitutes a variable circuit element included in the second filter as a variable filter.
4. The high-frequency module according to any one of claims 1 to 3, comprising: a plurality of third filters including at least one low pass filter and one high pass filter; A plurality of fourth filters including at least one low pass filter and at least one high pass filter; a plurality of low noise amplifiers including the first low noise amplifier, and A plurality of power amplifiers, the plurality of power amplifiers including the first power amplifier, The plurality of low noise amplifiers are respectively connected with corresponding fourth filters of the plurality of fourth filters, The plurality of power amplifiers are respectively connected with corresponding fourth filters in the plurality of fourth filters, The first switch is used for selecting the connection destination of each of the plurality of antenna terminals from the plurality of third filters, The second switch is used for selecting the connection destination of the third filter selected by the first switch from the plurality of fourth filters, When the second communication band is used for reception, the second filter is constituted by one third filter selected by the first switch from among the plurality of third filters and a fourth filter connected to the first low noise amplifier selected by the second switch from among the plurality of fourth filters, When the second communication band is used for transmission, the second filter is constituted by the one of the plurality of third filters selected by the first switch and the fourth filter connected to the first power amplifier selected by the second switch, The first filter is configured by another third filter selected by the first switch among the plurality of third filters and a fourth filter connected to a power amplifier different from the first power amplifier or a low noise amplifier different from the first low noise amplifier selected by the second switch among the plurality of fourth filters at the time of transmission or reception using the first communication band.
5. The high-frequency module according to claim 4, wherein, The first variable circuit element includes a plurality of sets of first filters, a plurality of second filters, and a plurality of third filters.
6. The high-frequency module according to any one of claims 1 to 5, wherein, Further provided with a mounting substrate having a first main surface and a second main surface which face each other, The first switch is disposed on the first main surface of the mounting board, The second switch is disposed on the second main surface of the mounting board, and overlaps at least a part of the first switch when the mounting board is seen in a plan view from a thickness direction of the mounting board, The first variable circuit element is disposed on the mounting substrate.
7. The high-frequency module according to claim 6, wherein, The first variable circuit element is disposed inside the mounting substrate, and overlaps at least a portion of the first switch and at least a portion of the second switch when viewed from above in a thickness direction of the mounting substrate.
8. The high-frequency module according to claim 6, wherein, The first variable circuit element is disposed on the first main surface or the second main surface of the mounting substrate.
9. A communication device is provided with: a high-frequency module according to any one of claims 1 to 8, and And a signal processing circuit connected to the high frequency module for performing signal processing on the high frequency signal.

Description

High-frequency module and communication device Technical Field The present invention relates generally to a high frequency module and a communication device, and more particularly to a high frequency module for processing a first TDD signal in a first communication band and a second TDD signal in a second communication band, and a communication device including the high frequency module. Background The multiplexer described in patent document 1 includes a plurality of switches, a plurality of filters, a plurality of power amplifiers, and a plurality of low noise amplifiers. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2023-65416 Disclosure of Invention Problems to be solved by the invention In a front-end module such as the multiplexer described in patent document 1, the plurality of filters generally include a filter for a frequency band 77 (n 77, first communication band) and a filter for a frequency band 79 (n 79, second communication band). The communication bands of n77 and n79 are adjacent to each other. Therefore, if transmission using n77 and reception using n79 are performed simultaneously, the transmission signal of n77 leaks to the reception path side for n79, and the sensitivity of reception of n79 deteriorates. In addition, when communication using n79 is performed alone, degradation of communication quality of n79 is sought to be reduced. The present invention has been made in view of the above-described problems, and an object thereof is to provide a high-frequency module and a communication device capable of reducing interference between adjacent first and second communication bands and reducing degradation of communication quality. Solution for solving the problem A high frequency module according to an embodiment of the present invention processes a first TDD signal in a first communication band and a second TDD signal in a second communication band adjacent to the first communication band. The communication frequency band of the first communication frequency band is wider than the communication frequency band of the second communication frequency band. The high-frequency module includes a first filter, a second filter, a first switch, a second switch, and a first variable circuit element, wherein the first filter has a first passband including the first communication band. The second filter has a second passband including the second communications band. The first switch is configured to select a connection destination of each of a plurality of antenna terminals from a first end of each of the first filter and the second filter. The second switch is used for selecting a connection destination of the second end of the second filter from the first power amplifier and the first low noise amplifier. The first variable circuit element is connected inside the second filter, inside the second switch, or between the second filter and the second switch, and is configured to shift an attenuation band on the first passband side of the second filter. A communication device according to an embodiment of the present invention includes the high-frequency module and a signal processing circuit. The signal processing circuit is connected with the high-frequency module and is used for processing signals of high-frequency signals. Effects of the invention According to the high-frequency module and the communication device of the present invention, there is an advantage that interference between adjacent first and second communication frequency bands can be reduced and degradation of communication quality can be reduced. Drawings Fig. 1 is a block diagram of a high-frequency module and a communication device according to embodiment 1. Fig. 2 is an explanatory diagram illustrating frequency characteristics of the second filter included in the high-frequency module. Fig. 3 is a block diagram of a high-frequency module and a communication device according to embodiment 2. Fig. 4 is a block diagram of a high-frequency module and a communication device according to embodiment 3. Fig. 5 is an enlarged view of the main part of the high frequency module. Fig. 6 is a block diagram of a high-frequency module and a communication device according to embodiment 4. Fig. 7 is a block diagram of a high-frequency module and a communication device according to a modification of embodiment 4. Fig. 8 is a cross-sectional view of a high-frequency module according to embodiment 5. Fig. 9 is a plan view of the first main surface of the high-frequency module mounting board, as viewed from a direction orthogonal to the first main surface. Detailed Description (1) Embodiment 1 The high-frequency module 1 according to embodiment 1 will be described in detail with reference to the drawings. (1-1) Summary As shown in fig. 1, the high frequency module 1 according to embodiment 1 processes a first TDD (Time Division Duplex: time division duplex) signal in a first communication band (e.g