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CN-122001398-A - Ultra-wideband radio frequency digital photoelectric integrated assembly and signal transmission system

CN122001398ACN 122001398 ACN122001398 ACN 122001398ACN-122001398-A

Abstract

The invention relates to an optoelectronic integrated component, in particular to an ultra-wideband radio frequency digital optoelectronic integrated component and a signal transmission system. The ultra-wideband radio frequency digital photoelectric integrated assembly comprises a radio frequency board, a digital board and a packaging substrate which are stacked, wherein the radio frequency board and the digital board are covered with a packaging shell, the packaging shell is arranged on the packaging substrate, chips on the radio frequency board and the digital board are connected with each other through signals and are connected with the packaging substrate through signals, a superheterodyne secondary frequency conversion radio frequency transceiver link built by a microwave chip is arranged on the radio frequency board, a digital-analog conversion chip, a digital chip and an optical chip are arranged on the digital board, an optical fiber is arranged at an optical fiber leading-out port of the packaging shell in a penetrating way, and the optical fiber is coupled with the optical chip. The signal transmission system comprises the ultra-wideband radio frequency digital photoelectric integrated component, a TR component and an array antenna. The invention obviously reduces the volume, reduces the interconnection loss and improves the reliability while maintaining the ultra-wideband performance, and provides a feasible technical path for future multifunctional and miniaturized communication systems.

Inventors

  • LU JIFU
  • WANG GANG
  • MENG SHUANGSHUANG
  • SONG YUNDONG
  • SUN YUNFEI
  • ZHANG JIN
  • Han Jiani
  • Zhai Wenxing

Assignees

  • 中航光电科技股份有限公司

Dates

Publication Date
20260508
Application Date
20260127

Claims (10)

  1. 1. The ultra-wideband radio frequency digital photoelectric integrated assembly is characterized by comprising a radio frequency board (14), a digital board (15) and a packaging substrate (11) which are stacked, wherein the radio frequency board (14) and the digital board (15) are covered with a packaging shell, the packaging shell is arranged on the packaging substrate (11), all chips on the radio frequency board (14), all chips on the digital board (15) and all chips on the radio frequency board (14) are in signal connection with each other, all chips on the radio frequency board (14) and all chips on the digital board (15) are in signal connection with the packaging substrate (11), a superheterodyne secondary frequency conversion radio frequency transceiver link which is built by a microwave chip (16) and used for converting between a radio frequency electric signal and an intermediate frequency signal is arranged on the radio frequency board (14), a digital chip (19) used for stabilizing and controlling a circuit and an optical chip (110) used for converting between the digital electric signal and the digital optical signal are arranged on the digital board (15), an optical fiber outlet (111) is arranged on the packaging shell, and the optical fiber (111) is coupled with the optical fiber (110) after passing through the optical fiber outlet and the optical fiber (110) to realize external coupling.
  2. 2. The ultra-wideband RF digital optoelectronic integrated assembly of claim 1, wherein the microwave chip (16) comprising the superheterodyne second conversion RF transceiver chain includes a wideband amplifier, a second attenuator, a switching filter, a first frequency converter, a third amplifier, a first filter, a second frequency converter, a second filter, and a fourth amplifier, all of which are sequentially connected.
  3. 3. The ultra-wideband RF digital optoelectronic integrated assembly of claim 1 wherein the RF pad (14) is an HTCC RF pad, the package substrate (11) is an HTCC package substrate, and the digital pad (15) is a silicon-based digital pad.
  4. 4. The ultra-wideband RF digital optoelectronic package as set forth in claim 1 wherein the digital board (15) is electrically connected to the digital-to-analog conversion chip (18), the optical chip (110), the digital chip (19) and to the RF board (14), the package substrate (11) by high density through silicon vias in the digital board (15).
  5. 5. The ultra-wideband radio frequency digital photoelectric integrated assembly of claim 1, wherein the packaging shell and the packaging substrate (11) form a complete airtight package through an adhesion process, and a BGA solder ball array is arranged on the bottom surface of the packaging substrate (11) to realize external electric interconnection.
  6. 6. The ultra-wideband RF digital optoelectronic integrated assembly of claim 1 wherein the top layer of the RF board (14) is bonded to the microwave chip (16) with conductive adhesive and the electrical connection of the microwave chip to the RF board (14) is achieved by gold wire bonding.
  7. 7. The ultra-wideband RF digital optoelectronic integrated assembly as set forth in claim 1, wherein the D/A conversion chip (18), the digital chip (19), and the optical chip (110) are disposed on the digital board (15) by conductive adhesive bonding and gold wire bonding processes.
  8. 8. A signal transmission system, which is characterized by comprising the ultra-wideband radio frequency digital photoelectric integrated assembly according to any one of claims 1-7, a TR assembly (2) in signal connection with the ultra-wideband radio frequency digital photoelectric integrated assembly, and an array antenna (3) in signal connection with the TR assembly (2).
  9. 9. A signal transmission system according to claim 8, wherein the array antenna (3) comprises a plurality of groups of receiving and transmitting antennas capable of transmitting and receiving signals, the receiving and transmitting antennas convert received wireless signals into electrical signals and transmit the electrical signals to the TR component (2), and receive electrical signals transmitted by the TR component (2) and convert the electrical signals into wireless signals and transmit the wireless signals.
  10. 10. The signal transmission system of claim 9, wherein the TR component (2) comprises a limiter, a first amplifier, a second amplifier, a switch, a first attenuator and a phase shifter, wherein the limiter, the first amplifier, the second amplifier, the switch, the first attenuator and the phase shifter correspond to the receiving and transmitting antenna, the receiving and transmitting antenna transmits signals sent by the receiving and transmitting antenna to the ultra-wideband radio frequency digital photoelectric integrated component after the signals are processed by the limiter, the first amplifier and the switch, and the phase shifter receives the signals from the ultra-wideband radio frequency digital photoelectric integrated component and sequentially transmits the signals to the receiving and transmitting antenna through the first attenuator, the switch and the second amplifier, and the direction of the signal transmission is switched through the switch.

Description

Ultra-wideband radio frequency digital photoelectric integrated assembly and signal transmission system Technical Field The invention relates to an optoelectronic integrated component, in particular to an ultra-wideband radio frequency digital optoelectronic integrated component and a signal transmission system. Background The digital form of modern universe intelligent linkage puts forward the severe demands of faster transmission, stronger resistance, more complete functions and smaller volume on a communication system, namely, the working frequency band is extended from ultra-low frequency to millimeter wave, and each subdivision frequency band corresponds to different service scenes such as tactical communication, electronic countermeasure, airborne data link, broadband satellite ground terminal and the like. Under the drive, the broadband technology is rapidly developed, and the radio frequency transceiver component is continuously promoted to be upgraded, so that the radio frequency transceiver component supports higher speed, wider frequency spectrum and lower time delay. However, the broadband radio frequency transceiver component of the traditional communication system is still limited by the bottlenecks of narrow frequency range, high radio frequency transmission loss, discrete functional units, huge volume and the like, and is difficult to meet the urgent requirement of the future communication system on 'multifunctional integration+terminal miniaturization'. In contrast, the rapid development of integrated circuit technology promotes the evolution of the broadband radio frequency transceiver component of the communication system from a huge discrete microwave circuit architecture to a miniaturized system-in-package integrated architecture, and provides powerful support for miniaturization, low power consumption and multifunctional integration of the base station and the terminal, but with the improvement of the integrated frequency, the broadband radio frequency transceiver component still faces many challenges in broadband signal processing, multifunctional integration and miniaturized design. Disclosure of Invention The invention provides an ultra-wideband radio frequency digital photoelectric integrated component and a signal transmission system, which are used for solving the technical problems of narrow frequency range, high radio frequency transmission loss, low integration level and large volume of the radio frequency transceiver component. The aim of the invention is realized by adopting the following technical scheme. The ultra-wideband radio frequency digital photoelectric integrated assembly comprises a radio frequency board, a digital board and a packaging substrate which are stacked, wherein the radio frequency board and the digital board cover a packaging shell, the packaging shell is arranged on the packaging substrate, all chips on the radio frequency board, all chips on the digital board and all chips on the radio frequency board are connected with each other through signals, all chips on the radio frequency board and all chips on the digital board are connected with the packaging substrate through signals, a superheterodyne secondary frequency conversion radio frequency transceiver link which is built by a microwave chip and is used for converting a high-frequency signal and an intermediate-frequency signal is arranged on the radio frequency board, a digital/analog conversion chip which is used for converting a radio frequency electric signal and a digital electric signal is arranged on the digital board, a digital chip which is used for converting a voltage stabilizing and controlling circuit and an optical chip which is used for converting a digital electric signal and a digital optical signal is arranged on the digital board, and the packaging shell is provided with an optical fiber outlet, and optical fibers are coupled with the optical chip through the optical fiber outlet so as to realize input/output of an external digital optical signal. Compared with the prior art, the invention has the following advantages: The broadband radio frequency transceiver component in the traditional communication system has high profile and low integration level. The invention adopts a System In Package (SIP) technology to reduce the whole size, adopts a three-dimensional heterogeneous integration technology, arranges a microwave chip, a digital-to-analog conversion chip, a digital chip and an optical chip on a radio frequency board and a digital board according to functional partitions, and completes three-dimensional stacking through vertical interconnection of micro bumps and high-density through holes so as to complete low-profile integrated integration of an ultra-wideband radio frequency digital photoelectric component in a single package shell. The broadband radio frequency transceiver component in the traditional communication system only outputs electric signals, and has high long-