CN-122002681-A - Circuit board structure and manufacturing method thereof

Abstract

The invention provides a circuit board structure and a manufacturing method thereof. The circuit board structure comprises a substrate layer, a first circuit layer, a supporting material layer, an additive material layer and a second circuit layer. The first circuit layer is arranged on the substrate layer. The supporting material layer is arranged on the substrate layer and is positioned on one side of the first circuit layer. The build-up material layer is arranged on the first circuit layer and the support material layer. The second circuit layer is arranged on the additive material layer.

Inventors

• CHEN QINGSHENG
• ZHANG QIMIN
• LIAO WEIYU
• HUANG JUNRUI
• LIN YIPING

Assignees

• 欣兴电子股份有限公司

Dates

Publication Date

20260508

Application Date

20241104

Claims (20)

1. 1. A circuit board structure comprising: A base layer; A first circuit layer disposed on the base layer; the supporting material layer is arranged on the substrate layer and is positioned on one side of the first circuit layer; a build-up material layer disposed on the first circuit layer and the support material layer, and The second circuit layer is arranged on the layer of the additive material.
2. 2. The circuit-board structure of claim 1, wherein the substrate layer comprises a first region and a second region, and the ratio of the area of the first circuit layer on the first region to the total area of the first region is smaller than the ratio of the area of the first circuit layer on the second region to the total area of the second region, wherein the support material layer is at least in the first region.
3. 3. The circuit-board structure of claim 2, wherein the ratio of the area of the first circuit layer over the first region to the total area of the first region is less than 50%.
4. 4. The circuit-board structure of claim 1, wherein an upper surface of the first circuit layer is coplanar with an upper surface of the support material layer.
5. 5. The circuit-board structure of claim 1, wherein an upper surface of the layer of build-up material on the layer of support material is coplanar with an upper surface of the layer of build-up material on the first circuit layer.
6. 6. The circuit board structure of claim 1, wherein the material of the support material layer comprises epoxy, silica, bisphenol F, epichlorohydrin, copolymers thereof, or combinations thereof.
7. 7. The circuit board structure of claim 1, wherein the material of the support material layer is the same as the material of the build-up material layer.
8. 8. The circuit board structure of claim 1, wherein the layer of support material has a thickness of between 0.01mm and 0.12 mm.
9. 9. The circuit-board structure of claim 1, wherein the layer of support material does not directly contact the first circuit layer.
10. 10. The circuit-board structure of claim 9, wherein the shortest distance between the support material layer and the first circuit layer is greater than 0.03mm.
11. 11. The circuit board structure of claim 9, wherein the layer of build-up material is located between the layer of support material and the first circuit layer.
12. 12. The circuit-board structure of claim 11, wherein the base layer and the build-up material layer completely surround the first circuit layer.
13. 13. A method of manufacturing a circuit board structure, comprising: providing a base layer; disposing a first circuit layer on the base layer; Providing a layer of support material on the substrate layer, wherein the layer of support material is located on one side of the first circuit layer; providing a build-up material layer on the first circuit layer and the support material layer, and A second circuit layer is disposed on the build-up material layer.
14. 14. The method of manufacturing a circuit board structure according to claim 13, wherein the step of forming the layer of support material comprises: coating a support material on the substrate layer, and A pre-bake process and a bake process are performed to form the support material into the support material layer.
15. 15. The method of claim 14, wherein the support material does not directly contact the first circuit layer.
16. 16. The method of manufacturing a circuit-board structure according to claim 15, wherein the shortest distance between the supporting material and the first circuit layer is greater than 0.03mm.
17. 17. The method of claim 13, wherein the substrate layer comprises a first region and a second region, and the ratio of the area of the first circuit layer on the first region to the total area of the first region is smaller than the ratio of the area of the first circuit layer on the second region to the total area of the second region, wherein the supporting material layer is at least located in the first region.
18. 18. The method of claim 17, wherein the ratio of the area of the first circuit layer on the first region to the total area of the first region is less than 50%.
19. 19. The method of claim 13, wherein an upper surface of the build-up material layer on the support material layer is coplanar with an upper surface of the build-up material layer on the first circuit layer.
20. 20. The method of claim 13, wherein the material of the support material layer comprises epoxy, silica, bisphenol F, epichlorohydrin, copolymers thereof, or combinations thereof.

Description

Circuit board structure and manufacturing method thereof Technical Field The present invention relates to circuit board structures, and more particularly, to a circuit board structure having a supporting material layer disposed between a build-up material layer and a substrate, and a method for manufacturing the same. Background With the widespread use of electronic products, the electronic products are required to have higher performance. For example, to meet high frequency applications, circuit board structures in electronic products are required to have more excellent impedance matching and signal integrity. However, some defects of the circuit board structure, such as uneven thickness, material mismatch, etc., may result in poor impedance matching and signal integrity. Thus, while existing circuit board structures have been increasingly satisfactory for their intended use, they have not been satisfactory in all respects. Accordingly, there remains a need to develop new circuit board structures and methods of manufacturing the same. Disclosure of Invention According to some embodiments, a circuit board structure is provided. The circuit board structure comprises a substrate layer, a first circuit layer, a supporting material layer, an additive material layer and a second circuit layer. The first circuit layer is arranged on the substrate layer. The supporting material layer is arranged on the substrate layer and is positioned on one side of the first circuit layer. The build-up material layer is arranged on the first circuit layer and the support material layer. The second circuit layer is arranged on the additive material layer. In some embodiments, the substrate layer includes a first region and a second region, and a ratio of an area of the first circuit layer on the first region to a total area of the first region is less than a ratio of an area of the first circuit layer on the second region to a total area of the second region, wherein the support material layer is located at least in the first region. In some embodiments, the ratio of the area of the first circuit layer over the first region to the total area of the first region is less than 50%. In some embodiments, an upper surface of the first circuit layer is coplanar (coplanar) with an upper surface of the support material layer. In some embodiments, an upper surface of the build-up material layer on the support material layer is coplanar with an upper surface of the build-up material layer on the first circuit layer. In some embodiments, the material of the support material layer includes epoxy, silicon dioxide, bisphenol F (Bisphenol F), epichlorohydrin (Epichlorhydrin), copolymers thereof, or combinations thereof. In some embodiments, the material of the support material layer further comprises a product of Karong chemistry, and the product code is UCP-70S/ITEQ IT-702G. In some embodiments, the material of the support material layer is the same as the material of the build-up material layer. In some embodiments, the thickness of the layer of support material is between 0.01mm and 0.12 mm. In some embodiments, the layer of support material does not directly contact the first circuit layer. In some embodiments, the shortest distance between the support material layer and the first circuit layer is greater than 0.03mm. In some embodiments, the build-up material layer is located between the support material layer and the first circuit layer. In some embodiments, the base layer and the build-up material layer completely surround the first circuit layer. In some embodiments, a method of manufacturing a circuit board structure is provided. The manufacturing method comprises the steps of providing a substrate layer, arranging a first circuit layer on the substrate layer, arranging a supporting material layer on the substrate layer, wherein the supporting material layer is positioned on one side of the first circuit layer, arranging an additive material layer on the first circuit layer and the supporting material layer, and forming a second circuit layer on the additive material layer. In some embodiments, the step of forming the layer of support material includes coating a support material on the substrate layer and performing a pre-bake process and a bake process to form the support material into the layer of support material. In some embodiments, the support material does not directly contact the first circuit layer. In some embodiments, the shortest distance between the support material and the first circuit layer is greater than 0.03mm. In some embodiments, the substrate layer includes a first region and a second region, and a ratio of an area of the first circuit layer on the first region to a total area of the first region is less than a ratio of an area of the first circuit layer on the second region to a total area of the second region, wherein the support material layer is located at least in the first region. In some embodiments, the rat