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CN-122002682-A - High DIMM structure retention

CN122002682ACN 122002682 ACN122002682 ACN 122002682ACN-122002682-A

Abstract

Methods and apparatus relating to high Dual Inline Memory Module (DIMM) structure retention are described. In one embodiment, a dual in-line memory module (DIMM) retention frame is coupled to a top portion of a high (e.g., "two units" or higher) DIMM. A plurality of fasteners physically attach the DIMM retention frame to a Printed Circuit Board (PCB). The DIMM retention frame reduces movement of high DIMMs. Other embodiments are also claimed and disclosed.

Inventors

  • P.Geng
  • D. Hiya
  • X.LI
  • G. Virgin
  • MIER RODOLFO
  • S. Saha
  • J. Smolly

Assignees

  • 英特尔公司

Dates

Publication Date
20260508
Application Date
20251009
Priority Date
20241107

Claims (20)

  1. 1. An apparatus, comprising: a dual inline memory module DIMM, the DIMM having a height of 2U or more; A DIMM retention frame coupled to a top portion of the DIMM, and A plurality of fasteners for physically attaching the DIMM to a printed circuit board PCB.
  2. 2. The apparatus of claim 1, wherein the top portion of the DIMM comprises at least two top corners of the DIMM.
  3. 3. The apparatus of claim 1, wherein the plurality of fasteners comprise at least one of welded through hole mount clips, threaded screws, thumbscrews, plated through hole clips, surface mount technology clips or hooks, locking tabs, and locking pens.
  4. 4. The apparatus of claim 1, wherein sidewalls of the DIMM retention frame are solid.
  5. 5. The apparatus of claim 4, wherein the side wall comprises one or more internal channels for allowing liquid flow to provide submerged cooling.
  6. 6. The apparatus of claim 1, wherein a sidewall of the DIMM holding frame comprises one or more cutouts.
  7. 7. The apparatus of claim 6, wherein the one or more cutouts are to allow air flow to provide air cooling.
  8. 8. The apparatus of claim 1, wherein the top portion of the DIMM comprises a top edge of the DIMM.
  9. 9. The apparatus of claim 8, wherein a top surface of the DIMM holding frame proximate the top edge of the DIMM is solid.
  10. 10. The apparatus of claim 9, wherein the top surface of the DIMM holding frame comprises one or more internal channels for allowing liquid flow to provide submerged cooling.
  11. 11. The apparatus of claim 8, wherein a top surface of the DIMM holding frame proximate the top edge of the DIMM comprises one or more notches.
  12. 12. The apparatus of claim 11, wherein the one or more cutouts are to allow air flow to provide air cooling.
  13. 13. The apparatus of claim 1, further comprising the printed circuit board, the DIMM physically attached to the PCB by the plurality of fasteners.
  14. 14. The apparatus of claim 1, wherein the DIMM retention frame is coupled to a top side of the PCB, wherein the plurality of fasteners are to physically attach the DIMM retention frame to a back plate disposed on a bottom side of the PCB.
  15. 15. The apparatus of claim 1, wherein the DIMM retention frame is coupled to a chassis through the PCB.
  16. 16. The apparatus of claim 15, further comprising a plurality of standoffs coupled between the chassis and the PCB.
  17. 17. The apparatus of claim 16, further comprising a plurality of studs for providing features for aligning the back plate and the plurality of standoffs.
  18. 18. The apparatus of claim 17, wherein the DIMM holding frame is coupled to a top side of the PCB, wherein the plurality of fasteners are to physically attach the DIMM holding frame to the back plate disposed on a bottom side of the PCB.
  19. 19. A system, comprising: A processor for executing one or more instructions; a dual inline memory module DIMM, the DIMM having a height of 2U or more; dual inline memory module retention frame DIMM retention frame coupled to a top portion of the DIMM, and A printed circuit board PCB, wherein the DIMM is physically attached to the printed circuit board by a plurality of fasteners and the processor is attached to the printed circuit board.
  20. 20. The system of claim 19, wherein the DIMM holding frame is coupled to a top side of the PCB, wherein the plurality of fasteners are to physically attach the DIMM holding frame to a back plate disposed on a bottom side of the PCB.

Description

High DIMM structure retention Technical Field The present disclosure relates generally to the field of electronics. More particularly, embodiments relate to high dual inline memory module (Dual Inline Memory Module, DIMM) structure retention. Background High Dual Inline Memory Module (DIMM) connectors mounted on printed circuit boards (Printed Circuit Board, PCBs) typically have a high dynamic risk in the lateral DIMM direction. Some current board level solutions may be provided indirectly through DIMM connector components. However, these solutions may generate significant high DIMM lateral movement and high DIMM connector solder joint risk. In addition, some current system level solutions may be provided by chassis topside retention to the DIMM top edge. However, these solutions may be highly dependent on chassis configuration and may not be efficient enough. Drawings The detailed description is provided with reference to the accompanying drawings. In the drawings, the leftmost digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items. FIG. 1 illustrates an example of a high DIMM that may be utilized in some embodiments. Fig. 2A and 2B illustrate a side view of a high DIMM holding frame and a top view of the high DIMM holding frame, respectively, according to some embodiments. Fig. 3 illustrates a side view of a complete DIMM holding frame with a back plate attached to a PCB, according to an embodiment. Fig. 4 illustrates a side view of a full DIMM holding frame attached to a hole mounting clip on a motherboard according to an embodiment. Fig. 5 illustrates a side view of a complete DIMM holding frame attached to a soldering surface mount clip or hook on a motherboard according to an embodiment. Fig. 6 illustrates a side view of a high DIMM holding frame according to an embodiment. Fig. 7 illustrates a top view of a full high DIMM holding frame constraining the top edge of the DIMM, according to embodiments. Fig. 8 illustrates a top view of a portion of a high DIMM retention frame in accordance with embodiments. Fig. 9 illustrates a side view of a portion of a high DIMM retention frame in accordance with embodiments. Fig. 10 illustrates an exploded view of a portion of the DIMM retention frame mount of fig. 9, in accordance with embodiments. Fig. 11 illustrates an integrated or complete high DIMM retention frame in accordance with embodiments. Fig. 12 illustrates a side view of a partial DIMM retention frame in accordance with embodiments. FIG. 13 illustrates a block diagram of an embodiment of a computing system that can be utilized in the various embodiments discussed herein. FIG. 14 illustrates a block diagram of an embodiment of a computing system that can be utilized in the various embodiments discussed herein. Fig. 15 illustrates various components of a processor according to some embodiments. Detailed Description In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. However, embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to obscure the particular embodiments. Further, aspects of the embodiments may be performed using various means, such as integrated semiconductor circuits ("hardware"), computer-readable instructions organized into one or more programs ("software"), or some combination of hardware and software. For the purposes of this disclosure, reference to "logic" shall mean hardware (such as logic circuitry or, more generally, circuitry or circuitry), software, firmware, or some combination thereof. As mentioned above, some high Dual Inline Memory Module (DIMM) connectors mounted on a Printed Circuit Board (PCB) may generally have a higher dynamic risk in the lateral DIMM direction. Furthermore, some system level solutions provided by chassis topside retention to the DIMM top edge may be highly dependent on chassis configuration and may not be efficient enough. To this end, some embodiments provide a solution for high DIMM structure retention. Embodiments keep the DIMM directly supplied to the PCB. Another embodiment provides DIMM retention directly attached to the bottom of the chassis. In one embodiment, the DIMM retention frame is coupled to a top portion of a high (e.g., "two units" or higher) DIMM. A plurality of fasteners physically attach the DIMM retention frame to the PCB to reduce movement of the tall DIMM (e.g., in a lateral or vertical direction). Fig. 1 illustrates an example of a high 2U ("two unit") DIMM 102 that may be utilized in some embodiments. Without DIMM retention, DIMM 102 may fail the operating vibration test (50 grams of virtual card, e.g., according to intel's blue book board level vibration specification) and an electrica