CN-122002683-A - Electronic component module

Abstract

The invention provides an electronic component module. In an electronic component module, signal interference between components mounted on a circuit board is suppressed. The electronic component module includes a rigid substrate on which a plurality of electronic components are mounted, a plurality of electronic components mounted on the rigid substrate, and a flexible substrate mounted on the rigid substrate so as to be bendable, the flexible substrate being mounted on the rigid substrate through between the plurality of electronic components, the flexible substrate including a wiring for transmitting a signal and a 1 st ground layer electrically connected to a reference potential of the rigid substrate.

Inventors

• IMAI TAKASHI

Assignees

• 株式会社村田制作所

Dates

Publication Date

20260508

Application Date

20251103

Priority Date

20241105

Claims (9)

1. 1. An electronic component module, wherein, The electronic component module includes: a rigid substrate on which a plurality of electronic components are mounted; A plurality of electronic components mounted on the rigid substrate, and A flexible substrate attached to the rigid substrate and bendable, The flexible board is mounted on the rigid board through being mounted between the plurality of electronic components of the rigid board when one main surface of the rigid board is viewed in plan, The flexible substrate includes a wiring for transmitting a signal and a1 st ground layer, The 1 st ground layer is electrically connected to a reference potential of the rigid substrate.
2. 2. The electronic component module of claim 1, wherein, The flexible substrate includes: A connection part connected to one main surface of the rigid substrate, and An upright portion that is erected from one main surface of the rigid substrate by bending, The flexible substrate in a bent state is mounted on the rigid substrate.
3. 3. The electronic component module according to claim 2, wherein, The flexible substrate has two of the connection portions, The two connection portions are connected to separate positions on one main surface of the rigid substrate.
4. 4. The electronic component module according to claim 1 or 2, wherein, The flexible substrate includes a base film and, The wiring is provided on one principal surface side of the base film, The 1 st ground layer is provided on the other main surface side of the base film.
5. 5. The electronic component module according to claim 1 or 2, wherein, The flexible substrate further includes a2 nd ground layer, The wiring is disposed between the 1 st ground layer and the 2 nd ground layer.
6. 6. The electronic component module according to claim 2, wherein, The part of the wiring is arranged at the connecting part, The surface mount component is connected to the wiring provided in the connection portion.
7. 7. The electronic component module of claim 6, wherein, A concave portion is provided on one principal surface of the rigid substrate, The connecting portion is provided in the recess.
8. 8. The electronic component module according to claim 2, wherein, The flexible substrate includes an electrode plate electrically connected to the 1 st ground layer, The electrode plate stands from one main surface of the rigid substrate, The portion of the flexible substrate other than the end portions of the electrode plates and the rigid substrate are sealed by an insulating member, A reference potential is applied to an end of the electrode plate.
9. 9. The electronic component module according to claim 2, wherein, The flexible substrate includes a1 st electrode plate electrically connected to the wiring, The electronic component module further includes: a grounding substrate arranged so as to surround the flexible substrate, and A connection substrate covering the flexible substrate and the ground substrate, The grounding substrate comprises a 2 nd electrode plate, The 1 st electrode plate and the 2 nd electrode plate are erected from one main surface of the rigid substrate, The portion of the flexible substrate other than the end portion of the 1 st electrode plate, the portion of the ground substrate other than the end portion of the 2 nd electrode plate, and the rigid substrate are sealed with an insulating member, The connecting substrate is provided with electrodes at positions corresponding to the end part of the 1 st electrode plate and the end part of the 2 nd electrode plate respectively, The end part of the 1 st electrode plate and the end part of the 2 nd electrode plate are respectively connected with the electrodes at the corresponding positions.

Description

Electronic component module Technical Field The present disclosure relates to electronic component modules. Background The electronic component module includes a substrate having a wiring applied to a surface thereof, and a plurality of electronic components mounted on the surface of the substrate. The electronic component module disclosed in patent document 1 includes a circuit board and an electrical component disposed so as to straddle an electronic component mounted on the circuit board. Prior art literature Patent literature Patent document 1 International publication No. 2018/151134 Disclosure of Invention Problems to be solved by the invention The electronic component module disclosed in patent document 1 has room for improvement in suppression of signal interference between components mounted on a circuit board. The present disclosure has been made in view of the above circumstances, and an object thereof is to provide an electronic component module capable of suppressing signal interference between components mounted on a circuit board. Solution for solving the problem The electronic component module includes a rigid substrate on which a plurality of electronic components are mounted, a plurality of electronic components mounted on the rigid substrate, and a flexible substrate mounted on the rigid substrate and capable of being bent, wherein the flexible substrate is mounted on the rigid substrate through being mounted between the plurality of electronic components of the rigid substrate when one main surface of the rigid substrate is seen in plan view, the flexible substrate includes a wiring for transmitting a signal and a 1 st ground layer, and the 1 st ground layer is electrically connected to a reference potential of the rigid substrate. ADVANTAGEOUS EFFECTS OF INVENTION According to the present disclosure, signal interference between components mounted on a circuit board can be suppressed. Drawings Fig. 1 is a perspective view showing an electronic component module according to embodiment 1. Fig. 2 is a perspective view showing a structure of the multilayer wiring board before the flexible board is mounted in fig. 1. Fig. 3 is a diagram showing a structure of a flexible substrate according to embodiment 1. Fig. 4 is an enlarged view showing a part of the flexible substrate of fig. 3. Fig. 5 is a view showing a flexible substrate in a state of being bent along a bending line. Fig. 6 is a view showing a partial cross section of the flexible substrate of fig. 5. Fig. 7 is a view illustrating a structure of a short-sized portion of the flexible substrate shown in fig. 5. Fig. 8 is a diagram illustrating a structure of a short-sized portion of the flexible substrate shown in fig. 5. Fig. 9 is a diagram showing a configuration of a main portion of a flexible substrate used in the electronic component module according to embodiment 2. Fig. 10 is a diagram showing a configuration of a main portion of a flexible substrate used in the electronic component module according to embodiment 2. Fig. 11 is a diagram showing a configuration of a main portion of a flexible substrate used in the electronic component module according to embodiment 2. Fig. 12 is a view showing example 1 of a structure in which a surface mount component is mounted using the flexible substrate according to embodiment 2. Fig. 13 is a view showing a partial cross section of the flexible substrate of fig. 12. Fig. 14 is a view showing example 2 of a structure in which a surface mount component is mounted using the flexible substrate according to embodiment 2. Fig. 15 is a view showing a partial cross section of the flexible substrate of fig. 14. Fig. 16 is a cross-sectional view showing the structure of a flexible substrate according to a modification of embodiment 2. Fig. 17 is a diagram showing a configuration of a main portion of a flexible substrate used in the electronic component module according to embodiment 3. Fig. 18 is a view showing a flexible substrate in a state of being bent along each bending line. Fig. 19 is a perspective view showing an electronic component module according to embodiment 3. Fig. 20 is a diagram showing a state in which the electronic component module is filled with resin. Fig. 21 is a diagram showing a configuration of a main portion of a flexible substrate used in the electronic component module according to embodiment 4. Fig. 22 is a view showing a flexible substrate in a state of being bent along each bending line. Fig. 23 is a perspective view showing a structural example of the ground substrate. Fig. 24 is a view showing a state in which a flexible board and a ground board are provided on a multilayer wiring board. Fig. 25 is a view showing a state where resin is filled in the state shown in fig. 24. Fig. 26 is a diagram showing an example of a connection board. Detailed Description Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In th