CN-122002685-A - Circuit arrangement, component stack and optical arrangement

Abstract

The invention relates to a circuit device, a component stack and an optical device. The apparatus as discussed herein includes a stack of circuit layers. One layer in the stack includes a first circuit component. The first circuit assembly includes a first surface and a second surface, and a first interface of the first circuit assembly operable to couple the first surface of the first circuit assembly to a first substrate disposed in a second layer of the stack. The first circuit assembly further includes a second interface operable to provide a first connection from the first circuit assembly to the optical component assembly at a third layer in the stack. The first circuit component is disposed between the second layer and the third layer in the stack. The optical component assembly may include a plurality of optical devices controlled via driver circuitry disposed in the first circuit assembly. Multiple optical devices may support the transmission and reception of optical signals.

Inventors

• Muzamir A. Aren

Assignees

• 英飞凌科技奥地利有限公司

Dates

Publication Date

20260508

Application Date

20251104

Priority Date

20241106

Claims (20)

1. 1. A circuit arrangement comprising: A first circuit assembly, the first circuit assembly comprising: a first surface and a second surface; a first interface operable to couple the first surface of the first circuit assembly to a first substrate, and A second interface operable to support a first connection from the second surface of the first circuit assembly to an optical component assembly comprising a plurality of optical devices controlled via driver circuitry in the first circuit assembly disposed between the first surface and the second surface.
2. 2. The circuit device of claim 1, wherein the plurality of optical components of the optical component assembly are configured to receive and transmit optical signals propagating substantially orthogonal to the second surface of the first circuit assembly.
3. 3. The circuit arrangement of claim 2, wherein the first circuit component further comprises: A third interface disposed on the second surface, the third interface operable to provide a second connection of the first circuit component to a load, and A conductive path supporting a third connection between the load and the driver circuitry disposed in the first circuit assembly.
4. 4. The circuit device of claim 3, wherein the optical component assembly comprises a third substrate, and Wherein the plurality of optical devices are disposed on a surface of the third substrate disposed parallel to the second surface of the first substrate.
5. 5. The circuit arrangement of claim 1, further comprising: A processor component coupled to the second surface of the first circuit assembly, the processor component disposed adjacent to the optical component assembly, and A conductive path is disposed in the first circuit assembly between the driver circuitry and the processor component.
6. 6. The circuit arrangement of claim 1, further comprising: A redistribution layer disposed between the second surface of the first circuit assembly and the optical component assembly, the redistribution layer comprising conductive paths operable to communicate signals between the plurality of optical devices of the optical component assembly and a data processor attached to the redistribution layer.
7. 7. The circuit arrangement of claim 6, wherein the plurality of optical devices includes an optical transmitter device and an optical receiver device; wherein each respective one of the optical emitter devices is operable to convert a respective electrical signal received from the data processor into a respective optical signal transmitted from the respective optical emitter device, and Wherein each respective one of the optical receiver devices is operable to convert a respective optical signal received by the respective optical receiver device into a respective electrical signal that is sent to the data processor.
8. 8. The circuit device of claim 1, wherein the first substrate is a motherboard substrate operable to supply power to the first circuit assembly for redistribution to the optical component assembly, and The back side vertical power module is used for providing power to a load or a processor and the optical component assembly through the motherboard substrate and the packaging substrate.
9. 9. The circuit arrangement of claim 1, further comprising: an electronic component coupled to the second surface of the first circuit assembly, the electronic component disposed adjacent to the optical component assembly; A first conductive path extending through the first circuit assembly between the electronic component and an optical emitter device disposed in the optical component assembly, the first conductive path operable to transmit a first electrical signal from the electronic component to the optical emitter device, and A second conductive path extending through the first circuit assembly between an optical receiver device of the optical component assembly and the electronic component, the second conductive path operable to transmit a second electrical signal from the optical receiver device to the electronic component.
10. 10. The circuit device of claim 1, wherein the plurality of optics of the optical component assembly are coupled to a surface of the optical component assembly, the plurality of optics being configured to receive/transmit optical signals traveling in a direction substantially orthogonal to the surface of the optical component assembly.
11. 11. The circuit device of claim 1, wherein the optical component assembly comprises i) a third substrate coupled to the second interface of the first circuit assembly, and ii) wherein the plurality of optical devices are attached to a first surface of the third substrate, the first surface of the third substrate disposed parallel to the second surface of the first circuit assembly.
12. 12. A component stack, comprising: A first layer comprising an optical component assembly; A second layer comprising a first circuit assembly comprising i) a first surface and a second surface, ii) a first interface operable to couple the first surface of the first circuit assembly to a first substrate, iii) a second interface operable to support a first connection from the second surface of the first circuit assembly to the optical component assembly, the optical component assembly comprising a plurality of optical devices controlled via driver circuitry in the first circuit assembly disposed between the first surface and the second surface, iv) a power converter disposed between the first surface of the first circuit assembly and the second surface of the first circuit assembly, the power converter operable to convert a received input voltage to an output voltage, and v) a conductive path operable to transfer the output voltage from the power converter to the plurality of optical devices of the optical component assembly; a third layer including the first substrate, and Wherein the second layer is disposed between the first layer and the third layer.
13. 13. The component stack of claim 12, wherein the second interface comprises a third substrate disposed between the first circuit assembly and the optical component assembly, the third substrate providing an electrical connection between the first circuit assembly and the optical component assembly.
14. 14. An optical device, comprising: a substrate; Modulator assembly, and An optical transmitter device attached to the substrate, the optical transmitter device configured to transmit an optical signal transmitted in a direction orthogonal to a surface of the substrate, the optical signal comprising different wavelengths transmitted to optical modulator elements in the modulator assembly, each of the optical modulator elements being operable to control modulation of a respective one of the different wavelengths of the optical signal onto an optical fiber for transmission through the optical fiber to a remote destination.
15. 15. The optical device of claim 14, further comprising: An optical lens disposed between the optical emitter device and the optical modulator element in the modulator assembly.
16. 16. The optical device of claim 14, further comprising: A conductive path extending through the substrate to the optical modulator element in the modulator assembly, the conductive path operable to communicate a modulator control signal to the optical modulator element of the modulator assembly.
17. 17. The optical device of claim 16, wherein the modulator control signal comprises a first modulator control signal transmitted from the substrate to a first optical modulator element of the modulator assembly, the first optical modulator element operable to modulate a first wavelength of the plurality of different wavelengths according to the first modulator control signal, and Wherein the modulator control signal comprises a second modulator control signal transmitted from the substrate to a second optical modulator element of the modulator assembly, the second optical modulator element being operable to modulate a second wavelength of the plurality of different wavelengths in accordance with the second modulator control signal.
18. 18. An optical device, comprising: a substrate; an optical interface for receiving an optical signal; an optical splitter disposed between the optical interface and the substrate, the optical splitter operable to split a received optical signal into different wavelengths, and A plurality of optical receiver devices attached to a surface of the substrate, the plurality of optical receiver devices being operable to receive the optical signals at different wavelengths, the plurality of optical receiver devices receiving the optical signals at different wavelengths in a direction orthogonal to the surface of the substrate.
19. 19. The optical device of claim 18, wherein the optical splitter comprises a wavelength demultiplexer operable to split a received optical signal into the optical signals of different wavelengths.
20. 20. The optical apparatus of claim 19, wherein the plurality of optical receiver devices comprises a first optical receiver device attached to the substrate, the first optical receiver device operable to receive the optical signal at a first wavelength and convert the received optical signal at the first wavelength into a first electrical signal; wherein the plurality of optical receiver devices includes a second optical receiver device attached to the substrate, the second optical receiver device being operable to receive the optical signal at a second wavelength and convert the received optical signal at the second wavelength into a second electrical signal, the optical apparatus further comprising: A first conductive path extending from the first optical receiver device through the substrate, the first conductive path operable to transmit the first electrical signal, and A second conductive path extending from the second optical receiver device through the substrate, the second conductive path operable to transmit the second electrical signal.

Description

Circuit arrangement, component stack and optical arrangement Technical Field The present invention relates to a power solution and an optical interface of a circuit assembly, and also to a circuit arrangement, a stack of components and an optical arrangement. Background A Printed Circuit Board (PCB) or a printed wiring board is a laminated structure of conductive layers separated by insulating layers. Generally, a PCB has two functions. The first function is to fix the electronic components at specified locations on the outer layer of the PCB by means of attachment, such as soldering. The electronic circuits instantiated by the populated circuit board are designed to provide one or more specific functions. After manufacture, the electronic circuitry is powered to perform the desired function. Typically, the printed circuit board is a planar device on which a plurality of components are interconnected via traces to provide the functionality as previously discussed. Such implementations of manufacturing circuitry such as power converters, computer devices, and optical interfaces on planar circuit board assemblies are limited in size. One type of electronic component is an Integrated Circuit (IC). Some examples of ICs are computer CPUs, GPUs, and data processing devices. These ICs include an IC substrate that is necessary for connecting the IC to the PCB. These substrates provide connections between the plurality of chips and the PCB, protect and support the chips, protect and support the ICs, and distribute power and input/output signals for communication with other ICs, PCBs, and systems. Note that package substrates or IC substrates are sometimes referred to as interposers (interposers), particularly when the substrates provide connectivity between different types of ICs, such as electronic and optical ICs. Disclosure of Invention The implementation of clean energy (or green technology) is very important to reduce the human impact on the environment. Generally, clean energy sources include any evolutionary method and materials for reducing the overall toxicity of energy consumption to the environment. The present disclosure includes the observation that raw energy, such as received from a green or non-green energy source, typically needs to be converted into an appropriate form (e.g., a desired AC voltage, DC voltage, etc.) before it can be used to power a terminal device, such as a server, computer, mobile communication device, etc. Whether the energy is received from a green energy source or a non-green energy source, it is desirable to most effectively utilize the primary energy provided by such a system to reduce our impact on the environment. The present disclosure helps reduce our carbon footprint (and green energy) via more efficient energy conversion, optical signal conversion, and circuit implementations supporting these conversions. In one example, optical signal conversion may be used to connect together different ICs (integrated circuits) located on different PCBs (printed circuit boards), which may be implemented in a data center. One example as discussed herein includes using vertical optical I/O (input/output) circuitry to address these challenges of connecting multiple computer systems together over a large distance. More specifically, an apparatus as discussed herein includes a first circuit component. The apparatus may be configured to include a stack of layers (circuit component layers). In one example, a first layer in the stack includes a first circuit component. The first circuit assembly may include a first surface and a second surface. The first interface of the first circuit assembly is operable to couple the first surface of the first circuit assembly and the corresponding interface to a first substrate disposed in a second layer of the stack. The first circuit assembly further includes a second interface operable to provide a first connection from the first circuit assembly to the optical component assembly at a third layer in the stack. The first circuit component may be disposed between the second layer and the third layer in the stack. The optical component assembly may include a plurality of optical devices (circuit components) controlled via driver circuitry disposed in the first circuit assembly. Multiple optical devices may support the transmission and reception of optical signals. In one example, the plurality of optics of the optical component assembly may be configured to receive and transmit optical signals propagating substantially orthogonal to the second surface of the first circuit assembly. The first circuit assembly may further include a third interface disposed on the second surface, the third interface operable to provide a second connection of the first circuit assembly to a load, and a conductive path supporting a third connection between the load and driver circuitry disposed in the first circuit assembly. Further, an optical component assembly as discussed h