CN-122002688-A - Electrical component of multilayer low-temperature co-fired ceramic sheet

Abstract

The invention provides an electrical component of a multilayer low-temperature co-fired ceramic wafer. The design of overlapping laser perforation areas is adopted on the low-temperature co-fired ceramic material sheet, so that the adjacent laser perforation processing ranges are partially overlapped or combined to form a composite through hole structure. By overlapping the laser processing areas, the invention can effectively increase the freedom degree of the design of the through holes, improve the stability of the hole shape and reduce the alignment precision requirement of the multi-layer low-temperature co-fired ceramic material sheets during lamination, so that the overall structure can still maintain the conduction quality under the design of the high-layer number low-temperature co-fired ceramic material sheets, and the multi-layer circuit design of the low-temperature co-fired ceramic material sheets has the advantages of higher density, smaller size and better manufacturing process tolerance.

Inventors

• Yang Nianguo
• XIE ZHENZHONG
• Lin Cichun
• LI KECHENG
• Lai Mingkai
• Liu Bangxun
• LI DAOKAI
• YANG JIANZHI
• XU SHIFENG
• FAN LIANGFANG

Assignees

• 千如电机工业股份有限公司

Dates

Publication Date

20260508

Application Date

20260227

Claims (6)

1. 1. An electrical component of a multilayer low temperature cofired ceramic sheet comprising: a plurality of layers of low-temperature co-fired ceramic sheets, wherein at least one via hole is arranged between each layer of low-temperature co-fired ceramic sheets, and An external electrode layer including at least one external electrode via, Wherein, the The at least one via hole and the at least one external electrode via hole are filled with a conductive metal material, so that the plurality of layers of low-temperature co-fired ceramic plates are electrically connected with the external electrode layer, and the at least one via hole and the at least one external electrode via hole are formed by two round holes.
2. 2. The electrical component of the multilayer low temperature co-fired ceramic wafer of claim 1, wherein the two circular holes are arranged in an overlapping manner.
3. 3. The electrical component of the multilayer low temperature co-fired ceramic sheet according to claim 2, wherein the area of the overlapping arrangement of the two circular holes is less than 50% of the area of each circular hole.
4. 4. The electrical component of the multilayer low temperature co-fired ceramic wafer of claim 1, wherein the conductive metal material is selected from at least one of gold, silver, copper, molybdenum, and tungsten.
5. 5. The electrical component of the multilayer low temperature co-fired ceramic sheet according to claim 1, wherein at least one of the plurality of layers of low temperature co-fired ceramic sheets is printed with an inductor circuit.
6. 6. The electrical component of the multilayer low temperature co-fired ceramic sheet according to claim 1, wherein at least one of the plurality of layers of low temperature co-fired ceramic sheets is printed with a capacitive trace.

Description

Electrical component of multilayer low-temperature co-fired ceramic sheet Technical Field The present invention relates to a multilayer ceramic device, and more particularly, to a multilayer ceramic device for laser via processing of low temperature cofired ceramic (Low Temperature Co-FIRED CERAMIC, LTCC) substrates. Background The low-temperature co-fired ceramic has the advantages of low dielectric constant, good high-frequency characteristic, multi-layer stacking, good material stability and the like, and is widely applied to the fields of communication modules, automotive radars, radio frequency elements, high-density packaging and the like. In the LTCC process, the through holes are important structures for realizing multi-layer circuit interconnection, and are small in size, large in number and densely distributed, so that the punching quality directly affects the subsequent conductivity, interlayer impedance control and overall product reliability. In the existing low-temperature co-fired ceramic substrate manufacturing process, the material sheet needs to be punched with through holes before the interlayer circuit is formed, so that the connectivity between the subsequent conductive filling holes and the multilayer circuit is established. Conventional LTCC substrate punching methods can be generally classified into mechanical punching and laser punching. The mechanical punching uses a punch pin to form a through hole (Chinese patent number: CN 106851985A) in a material sheet, but is limited by the problems of mechanical strength and abrasion of the punch pin, and the aperture reduction capability is limited. In addition, because the material sheet has toughness and plasticity, burrs, hole wall deformation and non-round hole patterns are easy to generate in the punching process, and even the defect that the hole wall is pulled due to abrasion or deformation of a punching needle occurs. The uniformity of the aperture is also gradually reduced due to the loss of the punching needle, and the requirement of high precision required by high-density tiny through holes cannot be met. The laser drilling method (China patent number: CN 115156740A) can improve the processing capability of small holes. Common lasers include CO 2 lasers, UV lasers, or green lasers, among others. The laser drilling technique has the advantages of non-contact processing, reduced aperture, good roundness of the hole, high processing speed, etc., however, it still involves several process limitations and drawbacks. First, the laser energy is concentrated in a very small area, and excessive energy can cause local carbonization of the hole wall, expansion of a heat affected zone, and increase of taper of the hole, so that the hole diameter is inconsistent up and down, and the filling efficiency of the subsequent conductive paste is affected. Second, when punching high density arrays, the laser machined areas are adjacent to each other, and the web may be heated and accumulated to cause distortion of the hole shape, or the hole wall may be excessively converged due to local carbonization of the material, resulting in a decrease in the conduction rate. In addition, the conventional laser drilling is generally performed in a single-point and single-hole manner, i.e. each hole is scanned only once or in multiple stages according to the set parameters. The mode is difficult to realize in a very small aperture, and the aperture wall smoothness, the aperture shape consistency and the effective aperture control are simultaneously considered. Particularly when the perforation layout is close to the edge of the web or the hole-to-hole distance is very small, conventional laser processing can reduce the energy absorption efficiency due to the fact that the hole site is close to the edge of the material, resulting in incomplete hole shape or insufficient hole diameter. Fig. 1 illustrates a conventional LTCC substrate punching method. Fig. 1A shows a ceramic web (100) after laser processing to form a via, and then filling a conductive metal material to form a single laser via (V1), and a web (201) after laser via is formed. Fig. 1B shows a filled web printed with conductive traces (L3) onto the surface of a single laser via (V1), forming a web (202) with conductive traces covering the vias. FIG. 1C shows an external electrode (P1) printed on the surface of a single laser via (V1) of a ceramic web (100) to form a web (203) with the external electrode covering the via. A conventional multilayer low temperature cofired ceramic wafer electrical component is shown in fig. 2. A conventional multilayer low temperature co-fired ceramic chip electrical device is provided, in which a chip (101) having a designed printed circuit (L1) on the surface, a chip (201) having a plurality of laser single laser via holes (V1) filled with holes, a chip (202) having a printed circuit (L3) covering the single laser via holes (V1), and a chip (203) having an external elec