Search

CN-122002690-A - Printed circuit board with improved heat dissipation

CN122002690ACN 122002690 ACN122002690 ACN 122002690ACN-122002690-A

Abstract

The present disclosure provides a printed circuit board including a frame having a through portion, a core layer having at least a portion disposed in the through portion, the core layer including a glass layer and a metal via passing through at least a portion of the glass layer, and a first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through portion. The total thickness of the frame is greater than the total thickness of the core layer, thereby enabling improved process capability and enhanced variability characteristics.

Inventors

  • JIN RENJIAN

Assignees

  • 三星电机株式会社

Dates

Publication Date
20260508
Application Date
20250613
Priority Date
20241106

Claims (17)

  1. 1. A printed circuit board, comprising: A frame having a through portion; A core layer having at least a portion disposed in the through-hole, the core layer including a glass layer and a metal via passing through at least a portion of the glass layer, and A first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through-portion, Wherein the total thickness of the frame is greater than the total thickness of the core layer.
  2. 2. The printed circuit board according to claim 1, wherein a center line of the frame in a thickness direction of the printed circuit board and a center line of the core layer in the thickness direction of the printed circuit board are disposed at different heights.
  3. 3. The printed circuit board of claim 1, wherein, The upper surface of the frame is coplanar with the upper surface of the first insulating layer, and The lower surface of the frame is positioned above the lower surface of the core layer.
  4. 4. The printed circuit board of claim 1, wherein, The lower surface of the frame is coplanar with the lower surface of the core layer, and The upper surface of the frame is positioned above the upper surface of the core layer.
  5. 5. The printed circuit board of claim 1, the printed circuit board further comprising: a first wiring layer disposed on an upper surface of the first insulating layer; a second wiring layer disposed on a lower surface of the first insulating layer; a first connection via passing through at least a portion of the upper side of the first insulating layer, the first connection via connecting at least a portion of the first wiring layer to the metal via, and And a second connection via passing through at least a portion of the underside of the first insulating layer, the second connection via connecting at least a portion of the second wiring layer to the metal via.
  6. 6. The printed circuit board of claim 5, wherein, The thickness of the first connection via hole is more than 0 μm and less than or equal to 20 μm, and The diameter of the upper end of the first connection via hole is more than 0 mu m and less than or equal to 20 mu m.
  7. 7. The printed circuit board of claim 5, wherein, The core layer further includes a first metal pad disposed on the upper surface of the glass layer, the first metal pad being connected to the metal via, and a second metal pad disposed on the lower surface of the glass layer, the second metal pad being connected to the metal via, and The first and second connection vias are connected to the first and second metal pads, respectively.
  8. 8. The printed circuit board of claim 5, wherein each of the first and second connection vias is directly connected to the metal via.
  9. 9. The printed circuit board of claim 5, the printed circuit board further comprising: a second insulating layer disposed on the upper surface of the first insulating layer; One or more third wiring layers disposed on or in the second insulating layer; One or more third via layers disposed in the second insulating layer, the one or more third via layers being connected to the one or more third wiring layers; a third insulating layer disposed on the lower surface of the first insulating layer; one or more fourth wiring layers disposed on or in the third insulating layer, and One or more fourth via layers disposed in the third insulating layer, the one or more fourth via layers being connected to the one or more fourth wiring layers.
  10. 10. A printed circuit board, comprising: A frame having a through portion; A core layer having at least a portion disposed in the through-penetration, the core layer comprising a glass layer and a metal via passing through at least a portion of the glass layer; A first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through portion; a first connection via passing through at least a portion of the upper side of the first insulating layer, the first connection via being connected to the upper side of the metal via, and A second connection via passing through at least a portion of the underside of the first insulating layer, the second connection via being connected to the underside of the metal via, Wherein the frame and the first connection via at least partially overlap each other when the frame is viewed in a direction perpendicular to a thickness direction of the printed circuit board.
  11. 11. The printed circuit board as defined in claim 10, wherein the frame and the second connection via do not overlap each other when the frame is viewed in a direction perpendicular to the thickness direction of the printed circuit board.
  12. 12. The printed circuit board of claim 10, wherein, The total thickness of the frame is greater than the total thickness of the core layer, and A center line of the frame in the thickness direction of the printed circuit board and a center line of the core layer in the thickness direction of the printed circuit board are disposed at different heights.
  13. 13. The printed circuit board of claim 10, wherein, The core layer further includes a first metal pad disposed on the upper surface of the glass layer, the first metal pad being connected to the metal via, and a second metal pad disposed on the lower surface of the glass layer, the second metal pad being connected to the metal via, and The first and second connection vias are connected to the first and second metal pads, respectively.
  14. 14. The printed circuit board of claim 10, wherein each of the first and second connection vias is directly connected to the metal via.
  15. 15. The printed circuit board of claim 10, the printed circuit board further comprising: a first wiring layer disposed on an upper surface of the first insulating layer, the first wiring layer having at least a portion connected to the first connection via; A second wiring layer disposed on a lower surface of the first insulating layer, the second wiring layer having at least a portion connected to the second connection via; a second insulating layer disposed on the upper surface of the first insulating layer; One or more third wiring layers disposed on or in the second insulating layer; One or more third via layers disposed in the second insulating layer, the one or more third via layers being connected to the one or more third wiring layers; a third insulating layer disposed on the lower surface of the first insulating layer; one or more fourth wiring layers disposed on or in the third insulating layer, and One or more fourth via layers disposed in the third insulating layer, the one or more fourth via layers being connected to the one or more fourth wiring layers.
  16. 16. A printed circuit board, comprising: A frame having a through portion; A core layer having at least a portion disposed in the through-penetration, the core layer comprising a glass layer and a metal via passing through at least a portion of the glass layer; a first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through-holes, and And a build-up layer formed on both upper and lower sides of the core layer, the build-up layer including at least one wiring layer and at least one connection via.
  17. 17. The printed circuit board of claim 16, wherein the build-up layer comprises a plurality of wiring layers and a plurality of connection vias, and wherein a number of wiring layers formed on the upper side of the core layer is greater than a number of wiring layers formed on the lower side of the core layer.

Description

Printed circuit board with improved heat dissipation The present application claims the benefit of priority from korean patent application No. 10-2024-0155978 filed in the korean intellectual property office on day 11 and 6 of 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates to a printed circuit board. Background In order to cope with the trend of high performance and miniaturization of semiconductors, demands for miniaturization and densification of printed circuit boards have been increasing. For example, in order to manufacture high-end products such as server substrates, a multi-layered and large-sized body has been required. However, as the number of wiring layers increases and the size of the main body increases, the substrate may be more likely to warp. In order to solve such a problem, the use of a glass core has been considered. Disclosure of Invention An aspect of the present disclosure is to improve the process capability and variability characteristics of printed circuit boards comprising glass layers, which have fine vias and fine insulation thickness. One of the various solutions of the present disclosure is that a core layer comprising a glass layer may be provided in a through-portion formed in the frame and the total thickness of the frame may be made larger than the total thickness of the core layer such that the insulating layers stacked on the frame and the core layer maintain a constant thickness tolerance. In this case, the center line of the frame in the thickness direction and the center line of the core layer in the thickness direction may be disposed at different heights. In addition, when the frame is viewed in a direction perpendicular to the thickness direction, the insulating layer and the connection via formed at the upper side of the frame may at least partially overlap each other, and the insulating layer and the connection via formed at the lower side of the frame may not overlap each other. According to one aspect of the present disclosure, a printed circuit board is provided that includes a frame having a through-portion, a core layer having at least a portion disposed in the through-portion, the core layer including a glass layer and a metal via passing through at least a portion of the glass layer, and a first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through-portion. The total thickness of the frame may be greater than the total thickness of the core layer. According to another aspect of the present disclosure, there is provided a printed circuit board including a frame having a through portion, a core layer having at least a portion disposed in the through portion, the core layer including a glass layer and a metal via passing through at least a portion of the glass layer, a first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through portion, a first connection via passing through at least a portion of an upper side of the first insulating layer, the first connection via being connected to an upper side of the metal via, and a second connection via passing through at least a portion of a lower side of the first insulating layer, the second connection via being connected to a lower side of the metal via. The frame and the first connection via may at least partially overlap each other when the frame is viewed in a direction perpendicular to a thickness direction of the printed circuit board. According to another aspect of the present disclosure, there is provided a printed circuit board including a frame having a penetration portion, a core layer having at least a portion disposed in the penetration portion, the core layer including a glass layer and a metal via passing through at least a portion of the glass layer, a first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the penetration portion, and a buildup layer formed on both upper and lower sides of the core layer, the buildup layer including at least one wiring layer and at least one connection via. According to example embodiments of the present disclosure, a printed circuit board including a glass layer may have improved process capability and variation characteristics, wherein the printed circuit board includes fine vias and fine insulation thickness. Drawings The foregoing and other aspects, features, and advantages of the disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which: FIG. 1 is a schematic block diagram of an example of an electronic device system; FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board; FIG. 3