CN-122002692-A - Printed circuit board with improved heat dissipation

Abstract

The present disclosure provides a printed circuit board including a first insulating layer including a protrusion, and a metal layer disposed on the protrusion of the first insulating layer. A width of a first end of the protrusion away from the metal layer is greater than a width of a second end of the protrusion opposite the first end.

Inventors

• Pu Zanzhen
• Liang Xuanxi
• ZHENG MINGGEN
• Quan Kenxu

Assignees

• 三星电机株式会社

Dates

Publication Date

20260508

Application Date

20251030

Priority Date

20241106

Claims (20)

1. 1. A printed circuit board, comprising: A first insulating layer including a protrusion, and A metal layer disposed on the protruding portion of the first insulating layer, Wherein a width of a first end of the protrusion away from the metal layer is greater than a width of a second end of the protrusion opposite the first end.
2. 2. The printed circuit board of claim 1, wherein the width of the protrusion increases gradually from the second end toward the first end.
3. 3. The printed circuit board of claim 1, wherein a width of a first end of the metal layer proximate the protrusion is greater than a width of a second end of the metal layer opposite the first end.
4. 4. The printed circuit board of claim 1, wherein the width of the metal layer gradually increases from a second end of the metal layer distal from the protrusion toward a first end of the metal layer opposite the second end.
5. 5. The printed circuit board of claim 1, wherein a width of the metal layer proximate to the first end of the protrusion is less than the width of the first end of the protrusion.
6. 6. The printed circuit board of claim 1, wherein a width of the metal layer proximate to a first end of the protrusion and the width of the second end of the protrusion are equal to each other.
7. 7. The printed circuit board of claim 1, wherein, in at least a portion of a region where the metal layer and the protrusion are connected to each other, side surfaces of the metal layer and the protrusion are coplanar with each other.
8. 8. The printed circuit board of claim 7, wherein a width of the metal layer gradually increases from a second end of the metal layer distal from the protrusion toward a first end of the metal layer opposite the second end, and a width of the protrusion gradually increases from the second end of the protrusion toward the first end of the protrusion.
9. 9. The printed circuit board of claim 1, wherein the metal layer comprises a seed layer and a plating layer disposed on the seed layer.
10. 10. The printed circuit board of claim 9, wherein a width of the seed layer proximate the first end of the protrusion is greater than a width of the plating layer proximate the first end of the protrusion.
11. 11. The printed circuit board of claim 9, wherein the seed layer does not extend to an area of the first insulating layer other than an upper surface of the protrusion.
12. 12. The printed circuit board of claim 1, wherein, The first insulating layer includes a plurality of protruding portions, and The width of the metal layer proximate the first end of the protrusion is greater than the distance between adjacent protrusions of the plurality of protrusions.
13. 13. The printed circuit board of claim 12, wherein a width of a second end of the metal layer opposite the first end is greater than a distance between adjacent ones of the plurality of protrusions.
14. 14. The printed circuit board of claim 12, wherein the width of the first end of the tab is greater than a distance between adjacent tabs of the plurality of tabs.
15. 15. The printed circuit board of claim 1, wherein a width of a second end of the metal layer remote from the protrusion and a width of a first end of the metal layer opposite the second end are equal to each other.
16. 16. The printed circuit board of claim 1, wherein an end surface of the metal layer remote from the second end of the protrusion comprises a curved surface.
17. 17. The printed circuit board of claim 1, wherein an end surface of the metal layer remote from the second end of the protrusion is pointed.
18. 18. The printed circuit board of claim 9, wherein the seed layer comprises copper.
19. 19. The printed circuit board of claim 1, wherein at least a portion of the side surface of the metal layer and at least a portion of the side surface of the protrusion are inclined at the same angle with respect to a plane perpendicular to a direction in which the protrusion and the metal layer are stacked.
20. 20. The printed circuit board of claim 16, wherein the curved surface comprises an apex of the metal layer.

Description

Printed circuit board with improved heat dissipation The present application claims the benefit of priority of korean patent application No. 10-2024-0155827 filed in the korean intellectual property office on day 11 and 6 of 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates to a printed circuit board. Background In response to recent trends in miniaturization and weight saving of mobile devices, demands for miniaturization and weight saving of Printed Circuit Boards (PCBs) mounted in such mobile devices are increasing. As the weight and size of mobile devices decrease, undercut phenomena may occur during the fabrication of microcircuits, which can lead to defects in the circuits. In order to meet such technical demands, research has been continuously conducted to improve the reliability of microcircuits while realizing circuits having reduced line widths and distances between them. Disclosure of Invention An aspect of the present disclosure provides a printed circuit board including a fine metal layer with high reliability. According to an aspect of the present disclosure, there is provided a printed circuit board including a first insulating layer including a protrusion, and a metal layer disposed on the protrusion of the first insulating layer. A width of a first end of the protrusion remote from the metal layer may be greater than a width of a second end of the protrusion opposite the first end. The width of the protrusion may gradually increase from the second end toward the first end. A width of a first end of the metal layer proximate to the protrusion may be greater than a width of a second end of the metal layer opposite the first end. The width of the metal layer may gradually increase from a second end of the metal layer away from the protrusion toward a first end of the metal layer opposite the second end. A width of the metal layer proximate to the first end of the protrusion may be less than the width of the first end of the protrusion. The width of the metal layer near the first end of the protrusion and the width of the second end of the protrusion are equal to each other. In at least a portion of a region where the metal layer and the protrusion are connected to each other, side surfaces of the metal layer and the protrusion may be coplanar with each other. The width of the metal layer may gradually increase from a second end portion of the metal layer away from the protrusion toward a first end portion of the metal layer opposite to the second end portion, and the width of the protrusion may gradually increase from the second end portion of the protrusion toward the first end portion of the protrusion. The metal layer may include a seed layer and a plating layer disposed on the seed layer. The width of the seed layer near the first end of the protrusion may be greater than the width of the plating layer near the first end of the protrusion. The seed layer may not extend to a region of the first insulating layer other than the upper surface of the protrusion. The first insulating layer may include a plurality of protrusions. The width of the metal layer proximate the first end of the protrusion may be greater than the distance between adjacent protrusions of the plurality of protrusions. A width of a second end of the metal layer opposite the first end may be greater than a distance between adjacent ones of the plurality of protrusions. The width of the first end of the protrusion may be greater than a distance between adjacent protrusions of the plurality of protrusions. The width of the second end of the metal layer remote from the protrusion and the width of the first end of the metal layer opposite to the second end may be equal to each other. An end surface of the metal layer remote from the second end of the protrusion may include a curved surface. An end surface of the metal layer remote from the second end of the protrusion may be pointed. The seed layer may comprise copper. At least a portion of the side surface of the metal layer and at least a portion of the side surface of the protrusion may be inclined at the same angle with respect to a plane perpendicular to a direction in which the protrusion and the metal layer are stacked. The curved surface may include an apex of the metal layer. According to another aspect of the present disclosure, there is provided a printed circuit board including a first insulating layer including a protrusion, and a metal layer disposed on the protrusion of the first insulating layer. The width of the lowermost portion of the protruding portion is greater than the width of the uppermost portion of the protruding portion. According to example embodiments of the present disclosure, a printed circuit board may include a fine metal layer having high reliability. Drawings The foregoing and other aspects, features, and advantages of the present disclosure will be more clearly u