CN-122002693-A - Printed circuit board with improved heat dissipation

Abstract

The present disclosure provides a printed circuit board. The printed circuit board includes a glass layer having a first surface and a second surface opposite to each other in a first direction, a through hole passing through at least a portion of a space between the first surface and the second surface of the glass layer, a first pad embedded in the first surface of the glass layer, the first pad connected to one end of the through hole in the first direction, and a second pad protruding from the second surface of the glass layer, the second pad connected to the other end of the through hole in the first direction. The first and second pads have different structures and/or arrangements.

Inventors

• JIN SONGYI

Assignees

• 三星电机株式会社

Dates

Publication Date

20260508

Application Date

20250626

Priority Date

20241104

Claims (19)

1. 1. A printed circuit board, comprising: A glass layer having a first surface and a second surface opposite to each other in a first direction; A through via passing through at least a portion of a space between the first surface and the second surface of the glass layer, the through via having a first end and a second end opposite the first end in the first direction; A first pad embedded in the first surface of the glass layer, the first pad connected to the first end of the through via, and And a second pad protruding from the second surface of the glass layer, the second pad being connected to the second end of the through via.
2. 2. The printed circuit board of claim 1, wherein each of the side surface and the bottom surface of the first pad has a rounded shape.
3. 3. The printed circuit board of claim 2, wherein a bottom surface of the second pad has a flat shape.
4. 4. The printed circuit board of claim 1, wherein the first end of the through hole has a step difference from the first surface of the glass layer.
5. 5. The printed circuit board of claim 4, wherein the second end of the through hole is coplanar with the second surface of the glass layer.
6. 6. The printed circuit board of claim 1, wherein, The first pad includes a first seed layer disposed on a surface of the first end of the through hole, and The second pad includes a second seed layer disposed on a surface of the second end of the through hole.
7. 7. The printed circuit board of claim 1, the printed circuit board further comprising: A first insulating body disposed on the first surface of the glass layer, and A second insulating body disposed on the second surface of the glass layer, Wherein the first insulating body is thicker than the second insulating body in the first direction.
8. 8. The printed circuit board of claim 7, the printed circuit board further comprising: a plurality of first wiring layers respectively disposed on or in the first insulating body, and A second wiring layer provided on or in the second insulating body, Wherein the plurality of first wiring layers have more layers than the second wiring layers.
9. 9. The printed circuit board of claim 8, the printed circuit board further comprising: a plurality of first via layers respectively disposed in the first insulating body, the plurality of first via layers respectively connected to one or more first wiring layers of the plurality of first wiring layers, and A second via layer disposed in the second insulating body, the second via layer being connected to the second wiring layer, Wherein the plurality of first via layers has more layers than the second via layers.
10. 10. The printed circuit board of claim 9, wherein, The glass layer having a cavity extending from the first surface of the glass layer through at least a portion of the glass layer in the first direction, The printed circuit board further includes a first electronic component connected to one or more of the plurality of first wiring layers through the one or more of the plurality of first via layers, and at least a portion of the first electronic component is disposed in the cavity, and The first insulating body covers at least a portion of the first electronic component and fills a portion of the cavity.
11. 11. The printed circuit board of claim 9, the printed circuit board further comprising: A first resist layer provided on the first insulating body, the first resist layer covering a first portion of an outermost first wiring layer of the plurality of first wiring layers in the first direction, the first resist layer not covering a second portion of the outermost first wiring layer of the plurality of first wiring layers in the first direction; a second resist layer provided on the second insulating body, the second resist layer covering a first portion of the second wiring layer, the second resist layer not covering a second portion of the second wiring layer; a first electrical connection metal disposed on the first resist layer; A second electronic component disposed on the first resist layer, the second electronic component being connected to the second portion of the outermost first wiring layer through the first electrical connection metal, and And a second electrical connection metal disposed on the second resist layer, the second electrical connection metal being connected to the second portion of the outermost second wiring layer.
12. 12. The printed circuit board of claim 1, the printed circuit board further comprising: A frame having a through portion, Wherein at least a portion of the glass layer is disposed in the through portion, and The space between the frame and the glass layer includes a filler that fills the space.
13. 13. The printed circuit board of claim 12, wherein the frame continuously surrounds the glass layer.
14. 14. The printed circuit board of claim 12, wherein the through-portion has a continuous wall surface.
15. 15. The printed circuit board of claim 1, wherein the first end of the through via is offset from the first surface of the glass layer in the first direction.
16. 16. A printed circuit board, comprising: A glass layer having a first surface and a second surface opposite to each other in a first direction; A through via passing through at least a portion of a space between the first surface and the second surface of the glass layer, the through via having a first end and a second end opposite the first end in the first direction; A first bonding pad arranged on the first surface of the glass layer and connected to the first end of the through via hole, and A second pad disposed on the second surface of the glass layer, the second pad being connected to the second end of the through via, Wherein the first and second pads are asymmetric with respect to a centerline between the first and second surfaces of the glass layer.
17. 17. The printed circuit board of claim 16, wherein a distance between the first pad and the centerline in the first direction is shorter than a distance between the second pad and the centerline in the first direction.
18. 18. The printed circuit board of claim 16, wherein a surface of the first pad connected to the first end of the through via has a rounded shape and a surface of the second pad connected to the second end of the through via has a flat shape.
19. 19. The printed circuit board of claim 16, wherein, The first pad includes a first seed layer disposed on a surface of the first end of the through hole, and The second pad includes a second seed layer disposed on a surface of the second end of the through hole.

Description

Printed circuit board with improved heat dissipation The present application claims the benefit of priority of korean patent application No. 10-2024-0154403 filed at the korean intellectual property office on 4/11/2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates to a printed circuit board. Background An interposer, an intermediate substrate used in semiconductor packaging technology, may include a rewiring layer on its portion that is typically connected to the die for electrical connection between the die and the substrate with a large pitch difference. Thus, the upper and lower portions of the interposer may be asymmetric with respect to each other. In this case, there may be a limitation in controlling the occurrence of warpage. Disclosure of Invention An aspect of the present disclosure provides a printed circuit board capable of easily controlling warpage even in an asymmetric structure. A glass layer with a through hole may be used and the two pads of the through hole may have different arrangements and structures. According to an aspect of the present disclosure, there is provided a printed circuit board including a glass layer having a first surface and a second surface opposite to each other in a first direction, a through via passing through at least a portion of a space between the first surface and the second surface of the glass layer, the through via having a first end and a second end opposite to the first end in the first direction, a first pad embedded in the first surface of the glass layer, the first pad being connected to the first end of the through via, and a second pad protruding from the second surface of the glass layer, the second pad being connected to the second end of the through via. According to another aspect of the present disclosure, there is provided a printed circuit board including a glass layer having a first surface and a second surface opposite to each other in a first direction, a through via passing through at least a portion of a space between the first surface and the second surface of the glass layer, the through via having a first end and a second end opposite to the first end in the first direction, a first pad provided at the first surface of the glass layer, the first pad being connected to the first end of the through via, and a second pad provided at the second surface of the glass layer, the second pad being connected to the second end of the through via. The first and second pads may be asymmetric with respect to a centerline between the first and second surfaces of the glass layer. According to example embodiments of the present disclosure, a printed circuit board can easily control warpage even in an asymmetric structure. Drawings The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which: FIG. 1 is a schematic block diagram of an example of an electronic device system; FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board; FIG. 3 is a schematic process cross-sectional view of an example of manufacturing a through hole and first and second pads included in the printed circuit board of FIG. 2; FIG. 4 is a schematic process cross-sectional view of an example of step B of FIG. 3; FIG. 5 is a schematic process cross-sectional view of another example of step B of FIG. 3, and Fig. 6 is a schematic cross-sectional view of another example of a printed circuit board. Detailed Description Hereinafter, example embodiments of the present disclosure are described with reference to the accompanying drawings. In the drawings, the shape and size of the components may be exaggerated or reduced for clarity of description. Fig. 1 is a schematic block diagram of an example of an electronic device system. Referring to fig. 1, an electronic device 1000 may house a motherboard 1010. Chip-related component 1020, network-related component 1030, and other components 1040 may be physically and/or electrically connected to motherboard 1010. Such electronic components may be connected to other electronic components to be described below through various signal lines 1090. The chip-related component 1020 may include a memory chip such as a volatile memory (e.g., dynamic Random Access Memory (DRAM)), a non-volatile memory (e.g., read Only Memory (ROM), or flash memory), an application processor chip such as a Central Processing Unit (CPU), a graphics processor (e.g., a Graphics Processing Unit (GPU)), a digital signal processor, a cryptographic processor, a microprocessor, or a microcontroller, and a logic chip such as an analog-to-digital converter or an Application Specific Integrated Circuit (ASIC). However, the chip-related component 1020 is not limited thereto and may include other types of chip-related components. Furth