Search

CN-122002695-A - PCB assembly and electronic equipment

CN122002695ACN 122002695 ACN122002695 ACN 122002695ACN-122002695-A

Abstract

The application provides a PCB assembly and electronic equipment, wherein the PCB comprises a switching chip PCB, an IO connection PCB and an intermediate board, the intermediate board with an interconnection PIN pair structure is introduced between the switching chip PCB and the IO connection PCB, the switching chip PCB, the intermediate board and the IO connection PCB are vertically stacked and interconnected, a high-speed signal path which is originally required to be distributed on a single board in a long distance is decomposed into short and straight vertical paths, the space decoupling and the length optimization of the signal transmission path are realized, and the problem of high-frequency loss caused by long-distance wiring of the traditional single board is effectively solved.

Inventors

  • CHENG CHEN
  • LI SHIWEI
  • HU XINYI

Assignees

  • 新华三技术有限公司

Dates

Publication Date
20260508
Application Date
20260331

Claims (11)

  1. 1. The PCB assembly is characterized by comprising an exchange chip PCB, an IO connection PCB and an intermediate board arranged between the exchange chip PCB and the IO connection PCB; The exchange chip PCB is provided with a through hole penetrating through the upper surface and the lower surface, and any through hole is provided with a first bonding pad at an opening of the lower surface of the exchange chip PCB; The IO connection PCB is electrically connected with the IO connector and provided with a second bonding pad; The interface board is provided with a PIN pair, a first PIN in the PIN pair is arranged on the upper surface of the interface board, a second PIN in the PIN pair is arranged on the lower surface of the interface board, the first PIN is connected with a first bonding pad on the lower surface of the exchange chip PCB, and the second PIN is connected with a second bonding pad arranged on the IO connection PCB; And the high-speed signals on the PCB of the exchange chip are transmitted to the IO connection PCB through the PIN pairs arranged on the intermediate board.
  2. 2. The PCB assembly of claim 1, wherein the first PIN and the second PIN of the PIN pair are coaxially disposed along a thickness direction of the interposer.
  3. 3. The PCB assembly of claim 1, wherein a path direction of the high-speed signal on the exchange chip PCB entering the IO connection PCB through the PIN pair is perpendicular to a path direction of the high-speed signal entering the IO connector from the IO connection PCB, and wherein the high-speed signal enters the IO connector along a plugging direction between the IO connector and the IO connection PCB.
  4. 4. The PCB assembly of claim 1, wherein the IO connection PCB comprises an IO connection sub-board and an intermediate contact sub-board, wherein the IO connector is disposed on the IO connection sub-board, wherein the second bonding pad is disposed on the intermediate contact sub-board, and wherein the intermediate contact sub-board is electrically connected with the IO connection sub-board through a bent flexible board.
  5. 5. The PCB assembly of claim 1, wherein the second bonding pad is disposed on a side of the IO connection PCB, the IO connector is disposed on an upper surface or a lower surface of the IO connection PCB, and the second bonding pad is connected to the IO connector through a high-speed signal wiring.
  6. 6. The PCB assembly of claim 1, wherein the interposer is fixedly mounted to the switch chip PCB by physical fastening.
  7. 7. The PCB assembly of claim 1, wherein the interposer comprises any of the following: the conductive adhesive structure comprises a plurality of metal conductive columns distributed along the thickness direction, wherein the upper ends of the metal conductive columns are used as first PIN of the PIN pairs, and the lower ends of the metal conductive columns are used as second PIN of the PIN pairs; or a solder ball array composed of a plurality of solder balls, wherein the upper ends of the solder balls are used as a first PIN in the PIN pairs, and the lower ends of the solder balls are used as a second PIN in the PIN pairs; Or socket structure with elastic contact terminal, including PCB base plate and install in the contact terminal of PCB base plate upper and lower surface, the contact terminal of upper surface is as first PIN, and the contact terminal of lower surface is as the second PIN.
  8. 8. The PCB assembly of claim 1, wherein the number of vias provided on the switch chip PCB is the same as the number of PINs provided on the interposer; the via holes on the exchange chip PCB comprise ground via holes and signal via holes, and the ground via holes and the signal via holes are arranged according to a set sequence; The PIN pairs comprise a grounding PIN pair and a signal PIN pair, wherein the grounding PIN pair corresponds to a grounding through hole, the signal PIN pair corresponds to a signal through hole, and the arrangement sequence of the grounding PIN pair and the signal PIN pair on the intermediate board is consistent with the arrangement sequence of the grounding through hole and the signal through hole on the exchange chip PCB board.
  9. 9. The PCB assembly of claim 8, wherein the number of second pads provided on the IO connection PCB is less than or equal to the number of PIN pairs; The grounding PIN pair comprises a first grounding PIN and a second grounding PIN; the signal PIN pair comprises a first signal PIN and a second signal PIN; the second bonding pad comprises a grounding bonding pad and a signal bonding pad, the grounding bonding pad is electrically connected with a second grounding PIN, and the signal bonding pad is electrically connected with the second signal PIN.
  10. 10. The PCB assembly of claim 9, wherein when the second number of pads is less than the PIN pair number: the second bonding pads are arranged on the IO connection PCB board by taking preset minimum signal transmission units as units, each minimum signal transmission unit comprises at least one signal bonding pad and one or more grounding bonding pads matched with the signal bonding pads, the number of the minimum signal transmission units is N, and the N is a positive integer.
  11. 11. An electronic device comprising a PCB assembly as claimed in any one of the preceding claims 1-10.

Description

PCB assembly and electronic equipment Technical Field The application relates to the technical field of circuit interconnection, in particular to a PCB assembly and electronic equipment. Background In the current network equipment schemes such as an AI whole cabinet and a data center, interconnection is usually completed between the exchange chip and the IO interface through PCB wiring, and high-speed signal loss mainly originates from a PCB wiring transmission path. With the increasing of the signal rate to 224Gbps or even 448Gbps, the traditional PCB wiring interconnection mode has the following limitations that the performance improvement of the PCB material cannot meet the requirement of the signal rate improvement, the wiring length of the traditional wiring mode is limited by a system architecture and cannot be shortened, so that the loss exceeds the standard, and with the continuous improvement of the signal rate, the PCB main board bearing the exchange chip is developed towards a higher layer number and a larger PCB board thickness for meeting the high-density wiring. At present, the PCB passing Kong Houjing ratio under the PCB processing technology is at least less than 30:1, the processing difficulty is caused by the excessively thick PCB, the minimum via diameter is forced to be increased, the signal bandwidth is seriously deteriorated, and the signal integrity is further deteriorated due to the fact that the via impedance is discontinuous to cause multiple reflection. Disclosure of Invention In view of the above, the present application provides a PCB assembly and an electronic device, which can optimize the electrical performance of high-speed signal transmission. Specifically, the application is realized by the following technical scheme: According to a first aspect of an embodiment of the present application, there is provided a PCB assembly including an exchange chip PCB, an IO connection PCB, and an interposer disposed between the exchange chip PCB and the IO connection PCB; The exchange chip PCB is provided with a through hole penetrating through the upper surface and the lower surface, and any through hole is provided with a first bonding pad at an opening of the lower surface of the exchange chip PCB; The IO connection PCB is electrically connected with the IO connector and provided with a second bonding pad; The interface board is provided with a PIN pair, a first PIN in the PIN pair is arranged on the upper surface of the interface board, a second PIN in the PIN pair is arranged on the lower surface of the interface board, the first PIN is connected with a first bonding pad on the lower surface of the exchange chip PCB, and the second PIN is connected with a second bonding pad arranged on the IO connection PCB; And the high-speed signals on the PCB of the exchange chip are transmitted to the IO connection PCB through the PIN pairs arranged on the intermediate board. Optionally, the first PIN and the second PIN of the PIN pair are coaxially disposed along a thickness direction of the interposer. Optionally, the path direction of the high-speed signal on the exchange chip PCB entering the IO connection PCB is perpendicular to the path direction of the high-speed signal entering the IO connector from the IO connection PCB through the PIN pair, wherein the high-speed signal enters the IO connector along the plugging direction between the IO connector and the IO connection PCB. Optionally, the IO connection PCB comprises an IO connection sub-board and an intermediate contact sub-board, the IO connector is disposed on the IO connection sub-board, the second bonding pad is disposed on the intermediate contact sub-board, and the intermediate contact sub-board is electrically connected with the IO connection sub-board through a bent flexible board. Optionally, the second bonding pad is disposed on one side surface of the IO connection PCB, the IO connector is disposed on the upper surface or the lower surface of the IO connection PCB, and the second bonding pad is connected to the IO connector through a high-speed signal wiring. Optionally, the interposer is fixedly mounted on the switch chip PCB by physical fixing. Optionally, the interposer includes any one of the following structures: the conductive adhesive structure comprises a plurality of metal conductive columns distributed along the thickness direction, wherein the upper ends of the metal conductive columns are used as first PIN of the PIN pairs, and the lower ends of the metal conductive columns are used as second PIN of the PIN pairs; or a solder ball array composed of a plurality of solder balls, wherein the upper ends of the solder balls are used as a first PIN in the PIN pairs, and the lower ends of the solder balls are used as a second PIN in the PIN pairs; Or socket structure with elastic contact terminal, including PCB base plate and install in the contact terminal of PCB base plate upper and lower surface, the contact terminal