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CN-122002696-A - Printed circuit board with improved heat dissipation

CN122002696ACN 122002696 ACN122002696 ACN 122002696ACN-122002696-A

Abstract

The present disclosure provides a printed circuit board including a first wiring portion having a first insulating body and a plurality of first wiring layers. An uppermost first wiring layer of the plurality of first wiring layers is embedded on an upper side of the first insulating body, and at least a portion of an upper surface of the uppermost first wiring layer is exposed from an upper surface of the insulating body. The second wiring portion is disposed below the first wiring portion, and includes a second insulating body and a plurality of second wiring layers. An electronic component is embedded in the first insulating body and partially exposed. The plurality of first wiring layers and the plurality of second wiring layers are electrically connected to each other. The minimum pitch of the wirings included in each of the plurality of first wiring layers is smaller than the minimum pitch of the wirings included in each of the plurality of second wiring layers.

Inventors

  • Jiang Binghe

Assignees

  • 三星电机株式会社

Dates

Publication Date
20260508
Application Date
20251030
Priority Date
20241108

Claims (16)

  1. 1. A printed circuit board, comprising: a first wiring section including a first insulating body and a plurality of first wiring layers respectively provided in the first insulating body, an uppermost first wiring layer of the plurality of first wiring layers being embedded on an upper side of the first insulating body, at least a portion of an upper surface of the uppermost first wiring layer being exposed from an upper surface of the first insulating body; A second wiring part disposed on the lower side of the first wiring part, the second wiring part including a second insulating body and a plurality of second wiring layers respectively disposed in the second insulating body, and An electronic component embedded in the upper side of the first insulating body such that at least a portion of an upper surface of the electronic component is exposed from the upper surface of the first insulating body, Wherein the plurality of first wiring layers and the plurality of second wiring layers are electrically connected to each other, and The minimum pitch of the wirings included in each of the plurality of first wiring layers is smaller than the minimum pitch of the wirings included in each of the plurality of second wiring layers.
  2. 2. The printed circuit board of claim 1, wherein a minimum line width of a wire in each of the plurality of first wiring layers and a minimum distance between the wires in each of the plurality of first wiring layers are less than a minimum line width of a wire in each of the plurality of second wiring layers and a minimum distance between the wires in each of the plurality of second wiring layers, respectively.
  3. 3. The printed circuit board of claim 2, wherein, A minimum line width of the wiring included in each of the plurality of first wiring layers is greater than 0 μm and equal to or less than 2 μm, and a minimum distance between the wirings included in each of the plurality of first wiring layers is greater than 0 μm and equal to or less than 2 μm, and A minimum line width of the wirings included in each of the plurality of second wiring layers is greater than 2 μm and equal to or less than 5 μm, and a minimum distance between the wirings included in each of the plurality of second wiring layers is greater than 2 μm and equal to or less than 5 μm.
  4. 4. The printed circuit board of claim 1, wherein, The first wiring portion further includes a plurality of first via layers respectively provided in the first insulating body, the plurality of first via layers being respectively connected to at least one of the plurality of first wiring layers, The second wiring part further includes a plurality of second via layers respectively provided in the second insulating body, the plurality of second via layers being respectively connected to at least one of the plurality of second wiring layers, and In a cross section of the printed circuit board, the connection via included in each of the plurality of first via layers and the plurality of second via layers has a substantially tapered side surface in the same direction.
  5. 5. The printed circuit board of claim 4, wherein in the cross-section of the printed circuit board, a connection via included in each of the plurality of first via layers and the plurality of second via layers has a substantially tapered side surface, a width of an upper end of the connection via having the substantially tapered side surface being smaller than a width of a lower end of the connection via having the substantially tapered side surface.
  6. 6. The printed circuit board of claim 1, wherein the upper surface of the uppermost first wiring layer protrudes above the upper surface of the first insulating body such that a portion of a side surface of the uppermost first wiring layer is exposed from the first insulating body.
  7. 7. The printed circuit board of claim 6, wherein an upper surface of the electronic component protrudes above the upper surface of the first insulating body such that a portion of a side surface of the electronic component is exposed from the first insulating body.
  8. 8. The printed circuit board of claim 1, wherein the electronic component comprises at least one chip capacitor.
  9. 9. The printed circuit board of claim 1, wherein the electronic component comprises at least one interconnect bridge.
  10. 10. The printed circuit board of claim 1, the printed circuit board further comprising: a third wiring portion provided on a lower side of the second wiring portion, the third wiring portion including a third insulating body and one or more third wiring layers provided on or in the third insulating body, respectively, Wherein the plurality of second wiring layers and the one or more third wiring layers are electrically connected to each other, and The third insulating body includes an insulating material different from an insulating material of at least one of the first insulating body and the second insulating body.
  11. 11. The printed circuit board of claim 10, wherein the third insulating body comprises an insulating material having a modulus of elasticity that is greater than a modulus of elasticity of an insulating material included in at least one of the first insulating body and the second insulating body.
  12. 12. The printed circuit board of claim 10, the printed circuit board further comprising: a first semiconductor chip and a second semiconductor chip provided on upper sides of the first wiring portions, respectively, the first semiconductor chip and the second semiconductor chip being connected to the uppermost first wiring layer by a first connection member and a second connection member, respectively; a passivation layer disposed on the lower side of the third wiring portion, the passivation layer having a plurality of openings exposing at least a portion of a lowermost third wiring layer of the one or more third wiring layers, respectively, and And a plurality of electrical connection metal pieces respectively arranged at the plurality of openings, wherein the plurality of electrical connection metal pieces are respectively connected to at least one part of the lowest third wiring layer.
  13. 13. A printed circuit board, comprising: a first wiring section including a first insulating body and a plurality of first wiring layers respectively provided in the first insulating body, an uppermost first wiring layer of the plurality of first wiring layers being embedded on an upper side of the first insulating body, at least a portion of an upper surface of the uppermost first wiring layer being exposed from an upper surface of the first insulating body; A second wiring part disposed on the lower side of the first wiring part, the second wiring part including a second insulating body and a plurality of second wiring layers respectively disposed in the second insulating body, and An electronic component embedded in the upper side of the first insulating body such that at least a portion of an upper surface of the electronic component is exposed from the upper surface of the first insulating body, Wherein the plurality of first wiring layers and the plurality of second wiring layers are electrically connected to each other, and The minimum insulation distance between the plurality of first wiring layers is smaller than the minimum insulation distance between the plurality of second wiring layers.
  14. 14. The printed circuit board of claim 13, wherein a thickness of each of the plurality of first routing layers is less than a thickness of each of the plurality of second routing layers.
  15. 15. The printed circuit board of claim 13, wherein a total thickness of the first insulating body is less than a total thickness of the second insulating body.
  16. 16. The printed circuit board of claim 13, wherein the second wiring portion is disposed on the first wiring portion using a coreless method.

Description

Printed circuit board with improved heat dissipation The present application claims the benefit of priority from korean patent application No. 10-2024-0157998 filed in the korean intellectual property office on day 11 and 8 of 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates to a printed circuit board. Background The demand for package substrates including high-density circuits has been growing due to the realization of high performance of semiconductor chips such as Application Processors (APs) of smart phones, central Processing Units (CPUs) of servers, and Artificial Intelligence (AI) accelerators. Accordingly, bump pitch is shrinking, and a high number of layers and a large substrate area are increasingly required. Furthermore, microcircuit implementation techniques are becoming increasingly important in order to cope with the increasing number of input and output terminals. Disclosure of Invention An aspect of the present disclosure is to provide a printed circuit board capable of facilitating formation of microcircuits and reducing the number of layers to reduce the total thickness of a package, the printed circuit board having excellent power characteristics and/or die-to-die microconnection. A first wiring portion including a microcircuit may be formed on the carrier, a coreless second wiring portion may be formed on the first wiring portion, and an electronic component may be embedded at an upper surface of the first wiring portion. According to an aspect of the present disclosure, there is provided a printed circuit board including a first wiring portion including a first insulating body and a plurality of first wiring layers respectively provided in the first insulating body, an uppermost first wiring layer of the plurality of first wiring layers being embedded in an upper side of the first insulating body, at least a portion of an upper surface of the uppermost first wiring layer being exposed from an upper surface of the first insulating body, a second wiring portion provided on a lower side of the first wiring portion, the second wiring portion including a second insulating body and a plurality of second wiring layers respectively provided in the second insulating body, and an electronic component embedded in the upper side of the first insulating body such that at least a portion of an upper surface of the electronic component is exposed from the upper surface of the first insulating body. The plurality of first wiring layers and the plurality of second wiring layers may be electrically connected to each other. The minimum pitch of the wirings included in each of the plurality of first wiring layers may be smaller than the minimum pitch of the wirings included in each of the plurality of second wiring layers. According to another aspect of the present disclosure, there is provided a printed circuit board including a first wiring portion including a first insulating body and a plurality of first wiring layers respectively provided in the first insulating body, an uppermost first wiring layer of the plurality of first wiring layers being embedded in an upper side of the first insulating body, at least a portion of an upper surface of the uppermost first wiring layer being exposed from an upper surface of the first insulating body, a second wiring portion provided on a lower side of the first wiring portion, the second wiring portion including a second insulating body and a plurality of second wiring layers respectively provided in the second insulating body, and an electronic component embedded in the upper side of the first insulating body such that at least a portion of an upper surface of the electronic component is exposed from the upper surface of the first insulating body. The plurality of first wiring layers and the plurality of second wiring layers may be electrically connected to each other. The minimum insulation distance between the plurality of first wiring layers may be smaller than the minimum insulation distance between the plurality of second wiring layers. A printed circuit board according to example embodiments of the present disclosure may facilitate formation of microcircuits and reduce the number of layers to reduce the overall thickness of the package, and may have excellent power characteristics and/or die-to-die microconnections. Drawings The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which: FIG. 1 is a schematic block diagram of an example of an electronic device system; FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board, and Fig. 3 is a schematic cross-sectional view of another example of a printed circuit board. Detailed Description Hereinafter, example embodiments of the present disclosure are descr