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CN-122002697-A - Board card with multi-chip stacked layout

CN122002697ACN 122002697 ACN122002697 ACN 122002697ACN-122002697-A

Abstract

The application discloses a multi-chip stacked layout board card, which belongs to the technical field of boards and comprises a tray, wherein a PCB main board is arranged on the tray, a plurality of main chip sub-card modules are vertically arranged on the PCB main board, each main chip sub-card module comprises a PCB sub-card, a main chip is welded on each PCB sub-card, a heat radiating component for radiating the main chip is arranged on the PCB main board, a supporting piece is arranged between two vertically adjacent main chip sub-card modules, the main chip sub-card module positioned at the lowest part is fixed on the top surface of the PCB main board through the supporting piece, and a power supply system and a general management unit are arranged on the PCB main board. The application has the effect of improving the layout density of the board card.

Inventors

  • ZHANG BENYUN
  • Qu Dianhao
  • LI CE

Assignees

  • 北京信而泰科技股份有限公司

Dates

Publication Date
20260508
Application Date
20260128

Claims (9)

  1. 1. The multi-chip stacked layout board card is characterized by comprising a tray (1), wherein a PCB main board (11) is arranged on the tray (1), a plurality of main chip sub-card modules (2) are vertically arranged on the PCB main board (11), each main chip sub-card module (2) comprises a PCB sub-card (23), a main chip (24) is welded on each PCB sub-card (23), a heat dissipation assembly for dissipating heat of each main chip (24) is arranged on the PCB main board (11), a supporting piece is arranged between two main chip sub-card modules (2) vertically adjacent to each other, the main chip sub-card module (2) located at the lowest position is fixed on the top surface of the PCB main board (11) through the supporting piece, and a power supply system (21) and a general management unit (22) are arranged on the PCB main board (11).
  2. 2. The multi-chip stacked layout board card according to claim 1, wherein the supporting member comprises a supporting column (3) arranged at the bottom corner of the PCB sub-card (23), a first stud (31) is fixed on the bottom surface of the supporting column (3), four first threaded holes (32) are formed in the top surface of the PCB main board (11), the four first threaded holes (32) correspond to the supporting column (3) at the bottom corner of the PCB sub-card (23), the first stud (31) at the bottom end of the supporting column (3) is screwed into the first threaded holes (32), through holes (33) are formed in the top surface corners of the PCB sub-card (23), a second threaded hole (34) is formed in the top surface of the supporting column (3), the first stud (31) at the bottom end of the supporting column (3) penetrates through the second threaded holes (34), a first threaded hole (35) is formed in the through hole (33) in the top end of the PCB sub-card (23), and a second threaded hole (35) is formed in the bottom end of the second threaded hole (35).
  3. 3. The multi-chip stacked layout board as recited in claim 1, wherein the heat dissipation assembly comprises a heat dissipation copper plate (45) arranged on the main chip (24), a radiator (4) is arranged on the PCB main board (11), a heat copper pipe (46) is arranged on the heat dissipation copper plate (45), and one end, far away from the heat dissipation copper plate (45), of the heat copper pipe (46) is connected to the radiator (4).
  4. 4. The multi-chip stacked layout board as set forth in claim 3, wherein a temperature sensor (47) is disposed on the heat sink (4), a controller (48) is disposed on the PCB motherboard (11), a cooling fan (49) is disposed on the PCB motherboard (11), an output end of the temperature sensor (47) is electrically connected with an input end of the controller (48), and an output end of the controller (48) is electrically connected with a control end of the cooling fan (49).
  5. 5. The multi-chip stacked layout of claim 1 wherein said power supply system (21) comprises a plurality of power modules (211) disposed on said PCB motherboard (11), said power modules (211) being connected to said PCB daughter card (23) by copper bars.
  6. 6. A multi-chip stacked layout board as defined in claim 1, wherein the PCB motherboard (11) is further provided with an external interface (26) and an internal interface (25).
  7. 7. A multi-chip stacked layout board as defined in claim 1, wherein said universal management unit (22) comprises a microcontroller (221) soldered to said PCB motherboard (11).
  8. 8. The multi-chip stacked layout board as recited in claim 1, wherein the supporting member comprises a first supporting rod (5), a second supporting rod (51) is rotatably installed at the top end of the first supporting rod (5), and studs (54) are fixed at the top end of the second supporting rod (51) and the bottom end of the first supporting rod (5).
  9. 9. The multi-chip stacked layout board as set forth in claim 8, wherein a socket groove (52) is formed in the top surface of the first support rod (5), a moving rod (53) is inserted into the socket groove (52), the moving rod (53) is in threaded connection with the inner wall of the socket groove (52), and the top end of the moving rod (53) is rotatably mounted at the bottom end of the second support rod (51).

Description

Board card with multi-chip stacked layout Technical Field The invention relates to the technical field of board cards, in particular to a board card with multi-chip stacking layout. Background The PCB board card is a common term in the electronic industry, and is mainly used for bearing electronic components and realizing electrical connection through a preset conductive path. Under different scenes, the device is called as a circuit board, a printed circuit board and the like, and is commonly used in the fields of computers, communication equipment, industrial control and the like. Components on a traditional PCB board are laid out on a PCB plane, and for the high-density high-power consumption board, the layout area of a main chip in a board layout space is certain, so that the layout area of the main chip in the high-density high-power consumption board layout space is limited. Disclosure of Invention In order to solve the problem that the layout area of a main chip in a board layout space is limited, the application provides a multi-chip stacked layout board. The application provides a multi-chip stacking layout board card which adopts the following technical scheme: The utility model provides a multichip stacks plate card of overall arrangement, includes the tray, be provided with the PCB mainboard on the tray, be provided with a plurality of main chip daughter card modules along vertical on the PCB mainboard, main chip daughter card module includes the PCB daughter card, the welding has the main chip on the PCB daughter card, be provided with on the PCB mainboard and be used for giving main chip radiating subassembly is provided with support piece along vertical adjacent two between the main chip daughter card module, be located the below main chip daughter card module passes through support piece is fixed in the top surface of PCB mainboard, be provided with power supply system and general management unit on the PCB mainboard. Through adopting above-mentioned technical scheme, through with a plurality of main chip daughter card modules, along vertical stack installation on the PCB mainboard, can realize the higher space utilization of PCB mainboard to improve the overall arrangement density of integrated circuit board. Preferably, the support piece comprises a support column arranged at the corner of the bottom surface of the PCB sub-card, a first stud is fixed on the bottom surface of the support column, four first threaded holes are formed in the top surface of the PCB main board, the four first threaded holes correspond to the support column at the corner of the bottom surface of the PCB sub-card, the first stud at the bottom end of the support column is screwed into the first threaded holes, through holes are formed in the corner of the top surface of the PCB sub-card, a second threaded hole is formed in the top surface of the support column, the first stud at the bottom end of the support column between two vertically adjacent PCB sub-cards penetrates through the second threaded holes and is screwed into the second threaded holes, a first screw is penetrated into the through holes in the topmost PCB sub-card, and the bottom end of the first screw is screwed into the second threaded holes. Through adopting above-mentioned technical scheme, screw bolt one of support column bottom screw in the screw hole one of PCB mainboard top surface at first, then place main chip daughter card module in the support column top on the PCB mainboard, make the through-hole on the PCB daughter card aim at the through-hole of support column top surface, then get the support column again, make the screw bolt of support column bottom pass the through-hole on the PCB daughter card insert locate in the screw hole two of below support column top surface, then place main chip daughter card module on the support column, accomplish the stack installation of main chip daughter card module according to above-mentioned step, then pass the through-hole on the top PCB daughter card with the screw, make the bottom of screw in the screw hole two of support column top surface, thereby pile up a plurality of main chip daughter card modules and install on the PCB mainboard. Preferably, the heat dissipation assembly comprises a heat dissipation copper plate arranged on the main chip, a radiator is arranged on the PCB main board, a heat copper pipe is arranged on the heat dissipation copper plate, and one end of the heat copper pipe, which is far away from the heat dissipation copper plate, is connected to the radiator. Through adopting above-mentioned technical scheme, set up the heat dissipation copper on the main chip, make the heat transfer that the main chip produced to the heat dissipation copper on, then on the rethread heat copper pipe transfer to the radiator to make the radiator dispel the heat to the main chip. Preferably, the radiator is provided with a temperature sensor, the PCB main board is provided with a controller, th