CN-122002699-A - Stacked power converter assembly
Abstract
A stacked power converter assembly is provided. The power converter assembly includes a stack of circuit components to convert an input voltage to an output voltage. The stack of circuit components may include a first component layer including driver circuitry, a second component layer including a plurality of switches controlled by the driver circuitry in the first component layer, and a third component layer disposed between the first component layer and the second component layer, the third component layer including at least one capacitor component to support conversion of an input voltage to an output voltage. In another implementation, a power converter assembly includes a first component layer including at least one capacitor component of a power converter, a second component layer coupled to the first component layer, the second component layer including a driver circuit and a plurality of switches, and a third component layer including at least one inductor.
Inventors
- Sutey Reddy Cha La
- ZHAO YINGSHAN
- Daryl Chilhardt
- Danny R. Kravit
- HUANG WENKANG
- Daryl Galibo
- Matthew Straye
Assignees
- 英飞凌科技奥地利有限公司
Dates
- Publication Date
- 20260508
- Application Date
- 20251031
- Priority Date
- 20241104
Claims (20)
- 1. An apparatus comprising a power converter assembly, The power converter assembly includes a stack of circuit components operable to convert an input voltage to an output voltage, the stack of circuit components including: A first component layer including switch driver circuitry; a second component layer comprising a plurality of switches controlled by the switch driver circuitry in the first component layer, and A third component layer disposed between the first component layer and the second component layer, the third component layer including at least one capacitor component to support converting the input voltage to the output voltage.
- 2. The apparatus of claim 1, further comprising: a conductive path extending through the third component layer, the conductive path operable to communicate control signals from the switch driver circuitry to the plurality of switches.
- 3. The apparatus of claim 1, further comprising: A first redistribution layer disposed between the first component layer and the third component layer, and A second redistribution layer disposed between the third component layer and the second component layer.
- 4. The apparatus of claim 1, wherein the plurality of switches in the second component layer comprise a first switching circuit and a second switching circuit, and A circuit component is disposed in the second component layer between the first switching circuit and the second switching circuit.
- 5. The apparatus of claim 1, wherein the at least one capacitor component comprises: A first capacitor operable to store the input voltage; A second capacitor operable to store a driver voltage used by the switch driver circuitry, and A third capacitor operable to store the output voltage.
- 6. The apparatus of claim 1, wherein the at least one capacitor component in the third component layer comprises: A bootstrap capacitor connected between the switch driver circuitry in the first component layer and an axial end of a conductive path in the third component layer of the power converter assembly.
- 7. The apparatus of claim 1, wherein the stack of circuit components further comprises: A fourth component layer, comprising: Magnetic conductive material, and A first electrically conductive path surrounded by the magnetically permeable material.
- 8. The apparatus of claim 7, wherein the first conductive path is operable to transmit a first current to a load through the fourth component layer in a first direction away from the second component layer, the power converter assembly further comprising: A second electrically conductive path surrounded by the magnetically permeable material, the second electrically conductive path operable to carry the first current from the load through the fourth component layer in a second direction, wherein the second direction is opposite the first direction.
- 9. The apparatus of claim 8, wherein the second conductive path is a single uniform metal element extending through the fourth component layer, the second conductive path being disposed between the first conductive path and a third conductive path in the fourth component layer, the third conductive path being operable to convey a second current to the load in the first direction.
- 10. The apparatus of claim 1, further comprising: A main substrate; Dynamic load, and Wherein the stack of circuit components is disposed between the primary substrate and the dynamic load, the stack of circuit components being operable to receive the input voltage from the primary substrate and supply the output voltage to the dynamic load.
- 11. The apparatus of claim 1, wherein the second component layer comprises at least one capacitor.
- 12. The apparatus of claim 1, further comprising: A main package substrate including a cavity, and Wherein the stack of circuit components is disposed in the main package substrate.
- 13. The device of claim 1, wherein the third component layer is made of: i) Glass; ii) silicon, or Iii) A layer of multi-compound material.
- 14. An apparatus comprising a power converter assembly, The power converter assembly includes a stack of power converter components operable to convert an input voltage to an output voltage, the stack of power converter components including: A first component layer comprising at least one capacitor component; A second component layer coupled to the first component layer, the second component layer including switch driver circuitry and a plurality of switches controlled by the switch driver circuitry, and A third component layer coupled to the second component layer, the third component layer comprising at least one inductor; wherein the second component layer is disposed between the first component layer and the third component layer.
- 15. The apparatus of claim 14, further comprising: A first redistribution substrate disposed between the first component layer and the second component layer, and A second redistribution substrate disposed between the second component layer and the third component layer.
- 16. The apparatus of claim 14, wherein the at least one capacitor component comprises: A first capacitor operable to store the input voltage, and A second capacitor operable to store a driver voltage used by the switch driver circuitry.
- 17. The apparatus of claim 14, wherein the third component layer comprises: Magnetic conductive material, and A first electrically conductive path surrounded by the magnetically permeable material, the first electrically conductive path extending axially from a first node disposed on a first surface of the third component layer and a second node disposed on a second surface of the third component layer, the second surface disposed opposite the first surface.
- 18. The apparatus of claim 17, wherein the first conductive path is operable to transfer a first current received from the second component layer in a first direction through the third component layer to a load, the apparatus further comprising: a second electrically conductive path surrounded by the magnetically permeable material, the second electrically conductive path operable to transfer the first current from the load to the second component layer through the third component layer in a second direction, wherein the second direction is opposite the first direction.
- 19. The apparatus of claim 18, wherein the second conductive path is a single uniform metallic element extending through the third component layer, the second conductive path being disposed between the first and third conductive paths in the third component layer, the third conductive path being operable to carry a second current in the first direction, and Wherein the second conductive path is operable to transfer the second current in the second direction from the load through the third component layer to the second component layer.
- 20. An assembly, comprising: A main substrate; The apparatus of claim 14, wherein the stack of power converter components is coupled to the host substrate, and A dynamic load coupled to the stack of power converter components; wherein the stack of power converter components is disposed between the primary substrate and the dynamic load, the stack of power converter components being operable to receive the input voltage from the primary substrate and to supply the output voltage to the dynamic load.
Description
Stacked power converter assembly Technical Field The invention relates to a stacked power converter assembly. Background Conventional switching power supply circuits sometimes include energy storage components, such as inductors, to produce an output voltage that powers a load. For example, to maintain the magnitude of the output voltage within a desired range, a controller controls the switching of the input current through one or more inductors. Typically, conventional inductors are components that include wires or other conductive materials that are shaped into coils or spirals to increase the magnetic flux through the respective circuit paths. Winding the wire into a plurality of turns increases the number of respective magnetic flux lines in the respective inductor component, thereby increasing the magnetic field and thus the overall inductance of the respective inductor component. Some conventional power converters include a stack of components to convert a respective input voltage to an output voltage. Disclosure of Invention Examples herein provide novel and improved inductor components and novel and improved stacked power converter topologies. Power converter assembly including a first stack of circuit components A first example herein includes a novel power converter assembly and a method of manufacturing the novel power converter assembly. In one example, an apparatus as discussed herein includes a power converter assembly. The power converter assembly includes a stack of circuit components. The stack of power converter components and circuit components is operable to convert an input voltage to an output voltage. The stack of circuit components may be configured to include a first component layer including switch driver circuitry, a second component layer including a plurality of switches controlled by the switch driver circuitry in the first component layer, and a third component layer disposed between the first component layer and the second component layer, the third component layer including at least one capacitor component to support converting an input voltage to an output voltage. In another example, as discussed herein, the stack of the apparatus and corresponding circuit components may include a conductive path extending through the third component layer, wherein the conductive path is operable to transmit control signals from the switch driver circuitry to the plurality of switches. In addition, an apparatus as discussed herein may be configured to include a first redistribution layer disposed between a first component layer and a third component layer, and a second redistribution layer disposed between the third component layer and a second component layer. In addition, the plurality of switches in the second component layer may include a first switch circuit and a second switch circuit, and a circuit component may be disposed between the first switch circuit and the second switch circuit in the second component layer. In another example, the at least one capacitor component includes a first capacitor operable to store an input voltage, a second capacitor operable to store a driver voltage for use by the switch driver circuitry, and a third capacitor operable to store an output voltage. In further examples, the at least one capacitor component may include a bootstrap capacitor connected between the switch driver circuitry in the first component layer and the first axial end of the first conductive path in the third component layer of the power converter assembly. In one example, the bootstrap capacitor is connected to two switches. As another example, the stack of circuit components may include a fourth component layer including magnetically permeable material and a first electrically conductive path surrounded by the magnetically permeable material. The first conductive path may be configured to transmit a first current through the fourth component layer to a load in a first direction away from the second component layer. The power converter assembly may further include a second electrically conductive path surrounded by magnetically permeable material, the second electrically conductive path operable to carry the first current in a second direction from the load through the fourth component layer. The second conductive path may be made of a single uniform metal element extending through the fourth component layer, wherein the second conductive path is disposed between the first conductive path and the third conductive path in the fourth component layer, and wherein the third conductive path is operable to transmit a second current to the load in the first direction. Further, and the components discussed herein may be configured to include a primary substrate and a load. A stack of circuit components may be disposed between the primary substrate and the dynamic load, wherein the stack of circuit components is operable to receive an input voltage from the primary substrate and supply