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CN-122002700-A - Package structure and microphone

CN122002700ACN 122002700 ACN122002700 ACN 122002700ACN-122002700-A

Abstract

The invention relates to the technical field of chip packaging, and discloses a packaging structure and a microphone. The package structure includes a housing, a substrate, a stiffener, a MEMS chip, and an ASIC chip. The first side face of the substrate is arranged facing the shell, the first side face at least partially sinks towards the second side face to form a thinning area, and sound holes are formed in the thinning area. The reinforcement is connected to the first side and placed in the thinned area, and the reinforcement is provided with a through hole communicated with the sound hole. The MEMS chip is connected with the reinforcement and communicated with the through hole, the ASIC chip is connected with the reinforcement and arranged at intervals with the MEMS chip, and the ASIC chip is respectively and electrically connected with the MEMS chip and the substrate. By arranging the reinforcing part in the thinning area, the thinning area is converted into a composite structure carried by the base plate and the reinforcing part together by a single thin plate, the rigidity reduction caused by thinning is compensated, the bending resistance and the impact resistance are improved, and the deformation and cracking risks caused by assembly extrusion, drop impact or thermal stress are reduced.

Inventors

  • YANG JIE
  • DANG MAOQIANG
  • WANG SHUN
  • ZHU YAN

Assignees

  • 歌尔微电子股份有限公司

Dates

Publication Date
20260508
Application Date
20251230

Claims (10)

  1. 1. A package structure, comprising: A housing; A base plate connected to the housing, the base plate having oppositely disposed first and second sides, the first side including first and second sides, the first side being formed by a portion of the first side sinking in a direction toward the second side, the second side being formed by another portion of the first side, the first and second sides forming a stepped structure; The reinforcement piece is connected with the first surface, the projection surface of the reinforcement piece completely covers the projection surface of the first surface along the direction from the first side surface to the second side surface, and the reinforcement piece is provided with a first through hole communicated with the sound hole; The MEMS chip is connected to one side surface of the reinforcement, which is away from the substrate, and is communicated with the first through hole; And the ASIC chip is connected to one side surface of the reinforcement, which is away from the substrate, and is arranged at intervals with the MEMS chip, and the ASIC chip is respectively and electrically connected with the MEMS chip and the substrate.
  2. 2. The package structure according to claim 1, further comprising a first waterproof film interposed between the stiffener and the substrate, the first through hole being in communication with the sound hole through the first waterproof film.
  3. 3. A package structure, comprising: A housing; a base plate connected to the housing, the base plate having oppositely disposed first and second sides; The reinforcement piece is connected with the first side face, the projection face of the reinforcement piece completely covers the projection face of the first side face along the direction from the first side face to the second side face, and the reinforcement piece is provided with a second through hole communicated with the sound hole; The MEMS chip is connected to one side surface of the reinforcement, which is away from the substrate, and is communicated with the second through hole; And the ASIC chip is connected to one side surface of the reinforcement, which is away from the substrate, and is arranged at intervals with the MEMS chip, and the ASIC chip is respectively and electrically connected with the MEMS chip and the substrate.
  4. 4. A package structure according to claim 3, wherein the stiffener is a steel sheet.
  5. 5. The package structure of claim 4, wherein the steel sheet and the substrate are of unitary construction.
  6. 6. The package of claim 4, wherein the steel sheet is connected to the first side by conductive glue.
  7. 7. The package structure of claim 6, further comprising a second waterproof membrane sandwiched between the stiffener and the substrate, the second through-hole communicating with the acoustic hole through the second waterproof membrane.
  8. 8. The package structure according to any one of claims 3 to 7, further comprising a bonding wire, wherein a via hole is formed in the steel sheet, and the bonding wire passes through the via hole and is electrically connected to the ASIC chip and the substrate, respectively.
  9. 9. The package structure according to any one of claims 3 to 7, wherein the MEMS chip and the ASIC chip are adhered to the stiffener by primer.
  10. 10. Microphone, characterized by comprising a package structure according to any of claims 1-9.

Description

Package structure and microphone Technical Field The invention relates to the technical field of chip packaging, in particular to a packaging structure and a microphone. Background With the development of smart phones, smart watches, and real wireless headphones, the miniature microphone modules for collecting voice signals are also required to achieve lower heights and higher acoustic performance in a limited installation space. A Microphone (Micro-Electro-MECHANICAL SYSTEMS Microphone, abbreviated as MEMS MIC) is widely used in the existing products, and generally includes a MEMS chip (Micro-Electro-MECHANICAL SYSTEMS), an ASIC chip (Application-SPECIFIC INTEGRATED Circuit), a substrate carrying a Circuit, a cover member for forming an acoustic cavity, and the like. The conventional MIC packaging structure generally adopts a mode of mounting an MEMS chip on the surface of a PCB (Printed Circuit Board ) and realizing electric connection through bonding of bonding wires, and the thickness of a chip body, the arc height of the bonding wires and the space superposition of a packaging cavity required for ensuring the reliability in the structure lead to difficulty in further compressing the whole packaging height and difficulty in meeting the design requirement of the MIC with ultra-low height To reduce the package height, some approaches attempt to compress the height dimension by partially grooving or entirely thinning the PCB to form a countersink at the chip mounting location. However, the structural rigidity of the substrate is significantly weakened by the grooving or thinning of the PCB, and deformation or even cracking is easily generated under the action of assembly extrusion, drop impact or thermal stress, thereby affecting the structural reliability and service life of the MIC. Disclosure of Invention The invention aims to at least solve the problem that the PCB substrate is easy to have insufficient rigidity after being thinned. The aim is achieved by the following technical scheme: the invention provides a packaging structure, which comprises: A housing; A base plate connected to the housing, the base plate having oppositely disposed first and second sides, the first side including first and second sides, the first side being formed by a portion of the first side sinking in a direction toward the second side, the second side being formed by another portion of the first side, the first and second sides forming a stepped structure; The reinforcement piece is connected with the first surface, the projection surface of the reinforcement piece completely covers the projection surface of the first surface along the direction from the first side surface to the second side surface, and the reinforcement piece is provided with a first through hole communicated with the sound hole; The MEMS chip is connected to one side surface of the reinforcement, which is away from the substrate, and is communicated with the first through hole; And the ASIC chip is connected to one side surface of the reinforcement, which is away from the substrate, and is arranged at intervals with the MEMS chip, and the ASIC chip is respectively and electrically connected with the MEMS chip and the substrate. According to the packaging structure, the reinforcing piece is arranged on the first surface of the substrate, so that the single thin plate structure is converted into the composite structure borne by the substrate and the reinforcing piece together, the rigidity reduction caused by the thinned first surface is compensated, the bending rigidity and the impact resistance of the first surface are improved, and the deformation and cracking risks caused by assembly extrusion, drop impact or thermal stress are reduced. Simultaneously, the MEMS chip and the ASIC chip are connected with the reinforcing piece, so that the load in the chip mounting and interconnection process is borne by the reinforcing piece preferentially, the stress concentration of the thinning area is further reduced, and the overall reliability of the packaging structure is improved. In addition, the packaging structure according to the invention can also have the following additional technical characteristics: In some embodiments of the invention, the package structure further includes a first waterproof film interposed between the stiffener and the substrate, and the through hole communicates with the sound hole through the first waterproof film. The invention also provides another packaging structure, which comprises: A housing; a base plate connected to the housing, the base plate having oppositely disposed first and second sides; The reinforcement piece is connected with the first side face, the projection face of the reinforcement piece completely covers the projection face of the first side face along the direction from the first side face to the second side face, and the reinforcement piece is provided with a second through hole communicated with the sound h