CN-122002740-A - Electronic module, electronic equipment and control method

CN122002740ACN 122002740 ACN122002740 ACN 122002740ACN-122002740-A

Abstract

The application discloses an electronic module, electronic equipment and a control method. The electronic module comprises at least two circuit boards, wherein each circuit board is provided with a pluggable connector and a chip, the at least two circuit boards are connected in a stacked mode through the pluggable connectors, the chips on the circuit boards are in data communication through the pluggable connectors, the at least two circuit boards comprise a main circuit board and a sub circuit board, the main circuit board is provided with a main control chip, and the main control chip is used for function management when the sub circuit board is detached or connected. The application provides a scheme which takes the product size, the integration level and the maintenance convenience into consideration.

Inventors

ZHOU XIAOFENG
LI WENXIN

Assignees

西安紫光国芯半导体股份有限公司

Dates

Publication Date: 20260508
Application Date: 20260323

Claims (10)

1. An electronic module, comprising: At least two circuit boards, wherein each circuit board is provided with a pluggable connector and a chip, the at least two circuit boards are connected in a stacked manner through the pluggable connectors, and the chips on each circuit board realize data communication through the pluggable connectors; the at least two circuit boards comprise a main circuit board and a sub circuit board, wherein a main control chip is arranged on the main circuit board, and the main control chip is used for function management when the sub circuit board is detached or accessed.
2. The electronic module of claim 1, further comprising: the shell and the heat conducting fin fixed in the shell; the at least two circuit boards are arranged in the shell, and the chip conducts heat to the shell through the heat conducting sheet.
3. An electronic module as recited in claim 2, wherein: At least two heat conducting sheets are fixed in the shell, and the at least two heat conducting sheets and the at least two circuit boards are alternately stacked.
4. An electronic module as recited in claim 2, wherein: The heat conducting material layer is arranged on the chip and is in contact with the heat conducting sheet so as to conduct heat on the chip to the shell through the heat conducting sheet.
5. An electronic module as recited in claim 2, wherein: the at least two circuit boards comprise double-sided circuit boards, and the chips are arranged on the top surface and the bottom surface of each double-sided circuit board.
6. An electronic module as recited in claim 2, wherein: the shell is provided with vent holes, and the vent holes are opposite to gaps between adjacent circuit boards to form an airflow heat dissipation passage.
7. An electronic module as recited in claim 1, wherein: The chip on the sub-circuit board is a memory chip, the main control chip is used for isolating and disassembling the interference on the memory function caused by the sub-circuit board, and the main control chip is used for controlling the memory capacity expansion management when the sub-circuit board is accessed.
8. An electronic device, comprising: an electronic module according to any one of claims 1-7.
9. The electronic device of claim 8, wherein: the chip on the sub-circuit board is a memory chip, and the electronic equipment is an open industry standard interconnection interface device.
10. A control method of an electronic module, wherein the method is applied to the electronic module of any one of claims 1 to 7, the chip on the sub-circuit board is a memory chip, and the method includes: when the sub-circuit board is detected to be detached or connected into the electronic module, the main control chip adjusts the storage capacity of the electronic module and manages the storage function of the electronic module according to the adjusted storage capacity.

Description

Electronic module, electronic equipment and control method Technical Field The present invention relates to the field of electronic technologies, and in particular, to an electronic module, an electronic device, and a control method. Background Along with the development of electronic technology, various electronic products are increasingly applied, and the requirements on the integration level and the capacity of chips in the products are also higher. In order to improve the integration level and capacity of the product, the size of the product housing is often enlarged to increase the area of a printed circuit board (Printed Circuit Board, PCB), so as to achieve the purpose of increasing the number of chips fixed by the printed circuit board. However, this solution affects the size of the product on the one hand and on the other hand requires the removal of the whole product when maintenance or replacement of the chip is required, which is complex and costly to operate. Disclosure of Invention The present invention has been made in view of the above problems, and has as its object to provide an electronic module, an electronic device and a control method which overcome or at least partially solve the above problems. In a first aspect, an electronic module is provided, including: At least two circuit boards, wherein each circuit board is provided with a pluggable connector and a chip, the at least two circuit boards are connected in a stacked manner through the pluggable connectors, and the chips on each circuit board realize data communication through the pluggable connectors; the at least two circuit boards comprise a main circuit board and a sub circuit board, wherein a main control chip is arranged on the main circuit board, and the main control chip is used for function management when the sub circuit board is detached or accessed. Optionally, the electronic module further comprises a shell and a heat conducting sheet fixed in the shell, wherein the at least two circuit boards are arranged in the shell, and the chip conducts heat to the shell through the heat conducting sheet. Optionally, at least two heat conducting sheets are fixed in the shell, and the at least two heat conducting sheets and the at least two circuit boards are alternately stacked. Optionally, a heat conducting material layer is disposed on the chip, and the heat conducting material layer contacts with the heat conducting sheet, so as to conduct heat on the chip to the housing through the heat conducting sheet. Optionally, the at least two circuit boards include a double-sided circuit board, and the top surface and the bottom surface of the double-sided circuit board are both provided with the chip. Optionally, the casing is provided with a vent hole, and the vent hole is opposite to a gap between the adjacent circuit boards, so as to form an airflow heat dissipation channel. Optionally, the chip on the sub-circuit board is a memory chip, the main control chip is used for isolating interference to a memory function caused by disassembling the sub-circuit board, and the main control chip is used for controlling memory capacity expansion management when the sub-circuit board is accessed. In a second aspect, an electronic device is provided, including an electronic module according to any one of the first aspects. Optionally, the chip on the sub-circuit board is a memory chip, and the electronic device is an open industry standard interconnection interface device. In a third aspect, a control method of an electronic module is provided, where the method is applied to any one of the electronic modules in the first aspect, and the chip on the sub-circuit board is a memory chip, and the method includes: when the sub-circuit board is detected to be detached or connected into the electronic module, the main control chip adjusts the storage capacity of the electronic module and manages the storage function of the electronic module according to the adjusted storage capacity. The technical scheme provided by the embodiment of the invention has at least the following technical effects or advantages: According to the electronic module, the electronic equipment and the control method provided by the embodiment of the invention, the plurality of circuit boards are arranged to realize detachable lamination connection through the pluggable connector. On the one hand, under the condition that the size of the shell of the product is unchanged, the three-dimensional space can be effectively utilized through lamination to increase the area of the circuit board, so that the number of fixable chips is increased, and the effects of improving the integration level and the capacity are achieved. On the other hand, the circuit board adopts detachable connection mode, need not to disassemble whole module when dilatation or maintenance, only need dismantle or insert sub-circuit board can, improved the maintenance convenience. And through the setting of main cont