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CN-122002743-A - Natural cooling heat radiation structure of crimping IGBT/Diode module

CN122002743ACN 122002743 ACN122002743 ACN 122002743ACN-122002743-A

Abstract

The invention provides a natural cooling radiating structure of a crimping type IGBT/Diode module, which comprises a compressing mechanism, the IGBT/Diode module and a radiator, wherein the radiator is provided with a plurality of radiating bodies, the plurality of radiating bodies and the IGBT/Diode module are alternately overlapped, the compressing mechanism is connected to the outer sides of the alternately overlapped IGBT/Diode module and the radiating body to crimp the IGBT/Diode module and the radiating body together, the crimping structure is more compact, the junction temperature of the IGBT and the Diode can be effectively controlled to be stable in an allowable operating temperature range according to the rapid conduction of the short-time heating value of the IGBT and the Diode in an energy consumption device sub-module, the crimping mode ensures that the whole structure is uniformly stressed, has sufficient natural convection heat exchange space and is compact in the whole structure, is convenient to install and overhaul, the radiator rapidly absorbs heat to heat and heats up, dissipates the heat in air in a relatively short time, and the contact surface of the radiator and the IGBT and the Diode is kept in an acceptable temperature range.

Inventors

  • XU JINGYING
  • HOU JUNYI
  • Cheng Qianfeng
  • WEI PENG
  • WANG YIFAN
  • AN JING
  • WEN FUYUE
  • WANG ZUN
  • ZHANG SHIQI
  • REN MENGGAN

Assignees

  • 中电普瑞电力工程有限公司
  • 国网电力科学研究院有限公司
  • 国网浙江省电力有限公司电力科学研究院
  • 国家电网有限公司

Dates

Publication Date
20260508
Application Date
20241101

Claims (10)

  1. 1. The natural cooling heat dissipation structure of the crimping IGBT/Diode module is characterized by comprising a compressing mechanism, the IGBT/Diode module and a heat dissipation body; The plurality of radiating bodies are arranged and alternately overlapped with the IGBT/Diode modules; The pressing mechanism is connected to the outer sides of the IGBT/Diode modules and the radiator which are alternately overlapped, and the IGBT/Diode modules and the radiator are pressed together.
  2. 2. The natural cooling heat dissipation structure of a crimping type IGBT/Diode module as set forth in claim 1, wherein said heat dissipation body comprises a metal heat dissipation body and a non-metal heat dissipation body.
  3. 3. The natural cooling heat dissipation structure of a crimped IGBT/Diode module of claim 2, wherein the metal heat sink comprises an aluminum heat sink.
  4. 4. The natural cooling heat dissipation structure of a crimping type IGBT/Diode module as set forth in claim 1, wherein the IGBT/Diode module comprises a T1/D1 (100), a D4 (300) and a T2/D2 (200) which are sequentially arranged from bottom to top; the overall dimensions of the T1/D1 (100) and the T2/D2 (200) are larger than the overall dimensions of the D4 (300); And two sides of the T1/D1 (100), the D4 (300) and the T2/D2 (200) are respectively connected with the heat radiation body.
  5. 5. The natural cooling heat dissipation structure of a crimping type IGBT/Diode module as set forth in claim 4, wherein the plurality of heat dissipation bodies comprises a first heat dissipation body S1 (401), a second heat dissipation body S2 (402), a third heat dissipation body S3 (403), a fourth heat dissipation body S4 (404) and a fifth heat dissipation body S5 (405) which are sequentially arranged from bottom to top; The T1/D1 (100) is arranged between the first radiator S1 (401) and the second radiator S2 (402), and the second radiator S2 (402) is in pressure connection with the third radiator S3 (403); The D4 (300) is arranged between the third radiator S3 (403) and the fourth radiator S4 (404); The T2/D2 (200) is arranged between the fourth radiator S4 (404) and the fifth radiator S5 (405); Two ends of the pressing mechanism are respectively connected with the first radiator S1 (401) and the fifth radiator S5 (405).
  6. 6. The natural cooling heat dissipation structure of a crimping type IGBT/Diode module as set forth in claim 5, wherein a plurality of connection busbar are further arranged on the inner side of the compressing mechanism, and the plurality of connection busbar are respectively connected with the compressing mechanism, the IGBT/Diode module or the heat dissipation body; the connection busbar is electrically connected to the energy dissipation resistor.
  7. 7. The natural cooling heat dissipation structure of a crimping type IGBT/Diode module according to claim 6, wherein the plurality of connection busbar comprises a first busbar (601), a second busbar (602), a third busbar (603) and a fourth busbar (604) which are sequentially arranged from bottom to top; the first busbar (601) is positioned between the first heat radiation body S1 (401) and the pressing mechanism; The second busbar (602) is located between the second radiator S2 (402) and the third radiator S3 (403); The third busbar (603) is located between the fourth radiator S4 (404) and the T2/D2 (200); The fourth busbar (604) is located between the T2/D2 (200) and the fifth heat sink S5 (405).
  8. 8. The natural cooling heat dissipation structure of a crimping IGBT/Diode module of claim 5, wherein the IGBT/Diode module, the heat sink, the hold down mechanism, and the connection busbar are connected using a bridge circuit.
  9. 9. The natural cooling heat dissipation structure of a crimped IGBT/Diode module of claim 1, wherein the hold down mechanism comprises: an upper end plate (502) and a lower end plate (501) are respectively positioned at the upper end and the lower end of the IGBT/Diode module and the radiator which are overlapped; an elastic member located between the upper end plate (502) and the IGBT/Diode module; and one end of the pull rod (504) is connected with the upper end plate (502), and the other end of the pull rod is connected with the lower end plate (501).
  10. 10. The natural cooling heat dissipation structure of a crimping type IGBT/Diode module according to claim 9, wherein the elastic member comprises a disc spring (503) connected to the upper end plate (502), and an insulating bearing plate (505) connected between the disc spring (503) and the IGBT/Diode module.

Description

Natural cooling heat radiation structure of crimping IGBT/Diode module Technical Field The invention relates to the technical field of heat dissipation of semiconductor devices, in particular to a natural cooling heat dissipation structure of a crimping IGBT/Diode module. Background The application of the direct current transmission technology can effectively improve the transmission efficiency and stability of the power grid, and has important significance for solving the problems of uneven energy and load distribution and the like. The direct current transmission technology is beneficial to optimizing energy configuration, improves the utilization rate of renewable energy sources, and plays an important role in balancing electric power requirements and supporting energy structure transformation. The direct current energy consumption device is used for absorbing surplus power in the direct current power transmission system when the alternating current main network fails at low voltage and converting surplus electric energy into heat energy of internal resistance of the energy consumption device. In the process, in order to ensure reliable short circuit after the bypass switch of the energy consumption device fails, a crimping IGBT/Diode is generally adopted to cope with the second-level through flow of the energy consumption branch. In such a short-time through-flow state, the crimping IGBT/Diode module will operate in a high heat generation power mode, and therefore it is necessary to control the junction temperature of the IGBT and the Diode within an allowable operating temperature range of the power semiconductor device. Considering that the crimping IGBT/Diode module only runs for a short time in the fault state of the energy consumption device, the total heating value is not high in the second-level through-flow state, and the rest time is not conducted and no heat is generated. If the conventional water cooling heat dissipation method for the direct current transmission engineering is utilized, the water cooling system needs to operate for a long time, so that the economy and the safety of the system operation can be reduced, and the water cooling method has no obvious advantage in the aspect of heat capacity heat dissipation of a contact body for a device with short-time high heating power. Therefore, it is important to design a natural cooling heat dissipation structure capable of keeping the junction temperature of the IGBT and the Diode within a proper range. Disclosure of Invention In order to solve the problem that a crimping IGBT/Diode module operates in a high heating power mode in a short-time through-flow state in the prior art, the invention provides a natural cooling heat dissipation structure of the crimping IGBT/Diode module, which comprises a pressing mechanism, an IGBT/Diode module and a heat dissipation body; The plurality of radiating bodies are arranged and alternately overlapped with the IGBT/Diode modules; The pressing mechanism is connected to the outer sides of the IGBT/Diode modules and the radiator which are alternately overlapped, and the IGBT/Diode modules and the radiator are pressed together. Preferably, the heat radiating body comprises a metal heat radiating body and a nonmetal heat radiating body. Preferably, the metal radiator comprises an aluminum radiator. Preferably, the IGBT/Diode module comprises T1/D1, D4 and T2/D2 which are sequentially arranged from bottom to top; the overall dimension of the T1/D1 and the T2/D2 is larger than that of the D4; And two sides of the T1/D1, the D4 and the T2/D2 are respectively connected with the heat radiation body. Preferably, the plurality of heat radiating bodies comprise a first heat radiating body S1, a second heat radiating body S2, a third heat radiating body S3, a fourth heat radiating body S4 and a fifth heat radiating body S5 which are sequentially arranged from bottom to top; The T1/D1 is arranged between the first radiator S1 and the second radiator S2; the second radiator S2 is in pressure connection with the third radiator S3; The D4 is arranged between the third radiator S3 and the fourth radiator S4; the T2/D2 is arranged between the fourth radiator S4 and the fifth radiator S5; Two ends of the pressing mechanism are respectively connected with the first radiator S1 and the fifth radiator S5. Preferably, a plurality of connection busbar are further arranged on the inner side of the pressing mechanism, and the connection busbar is respectively connected with the pressing mechanism, the IGBT/Diode module or the heat radiation body; the connection busbar is electrically connected to the energy dissipation resistor. Preferably, the plurality of connecting busbar comprises a first busbar, a second busbar, a third busbar and a fourth busbar which are arranged from bottom to top in sequence; the first busbar is positioned between the first heat radiation body S1 and the pressing mechanism; The second busbar is located b