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CN-122002744-A - Heat abstractor, electronic components module and vehicle

CN122002744ACN 122002744 ACN122002744 ACN 122002744ACN-122002744-A

Abstract

The disclosure relates to a heat dissipating device, an electronic component module and a vehicle. The heat dissipation device comprises a first cavity and a heat dissipation device, wherein the first cavity is provided with an opening, the first cavity is internally used for circulating a first cooling medium, the heat dissipation device covers the opening, the top of the heat dissipation device is suitable for being connected with a heating source, the heat dissipation device is provided with a second cavity, a second cooling medium is arranged in the second cavity, and the second cooling medium is used for cooling the heating source and can transfer heat to the first cooling medium. Through above-mentioned technical scheme, this disclosure will have the first cavity of cooling function and heat abstractor respectively and multiplexing into a heat abstractor, and its integrated level is higher, and is also more retrencied structurally to heat abstractor and first cavity form two-layer cooling, this kind of dual refrigerated mode is more favorable to improving the radiating efficiency to the heat generating source.

Inventors

  • CUI WEI
  • CHEN YUHONG
  • YU HONGYI
  • WANG HONGTAO

Assignees

  • 比亚迪股份有限公司

Dates

Publication Date
20260508
Application Date
20241101

Claims (13)

  1. 1. A heat sink, comprising: A first chamber having an opening for circulating a first cooling medium therein; The heat dissipation device is covered on the opening, the top of the heat dissipation device is suitable for being connected with a heating source, the heat dissipation device is provided with a second cavity, a second cooling medium is arranged in the second cavity, and the second cooling medium is used for cooling the heating source and can transfer heat to the first cooling medium.
  2. 2. The heat dissipating device of claim 1, wherein the second cooling medium is a phase change medium, and wherein a capillary wick is further disposed within the second cavity.
  3. 3. The heat sink of claim 2, wherein the heat sink further comprises a hollow post disposed on a side of the heat sink facing the first cavity, and the post is in communication with the second cavity.
  4. 4. A heat dissipating device according to claim 3, wherein the heat dissipating means comprises an upper housing and a lower housing, the boss is provided on the lower housing, the upper housing is covered on a side of the lower housing away from the boss, wherein the inner wall of the upper housing, the inner wall of the lower housing and the inner wall of the boss are provided with the capillary wick.
  5. 5. The heat sink of claim 4, further comprising a support post connected between the inner wall of the upper housing and the inner wall of the lower housing, the support post configured to provide a capillary force that returns liquid.
  6. 6. The heat dissipating device of claim 3, wherein the posts comprise a plurality of posts arranged in an array along a first direction and a second direction, respectively, wherein the plurality of posts are aligned along both the first direction and the second direction, or wherein the plurality of posts are aligned along one of the first direction and the second direction and staggered along the other direction, wherein the first direction is orthogonal to the second direction.
  7. 7. A heat sink according to claim 3, wherein the stud is configured to be non-cylindrical.
  8. 8. The heat dissipating device of claim 3, further comprising a plurality of heat dissipating fins disposed in a stack within said first cavity, said stud extending through and connected to said heat dissipating fins.
  9. 9. The heat sink of claim 8, wherein a plurality of the heat dissipating fins are disposed at intervals, and a first passage for the cooling medium is formed between two adjacent heat dissipating fins.
  10. 10. The heat sink of claim 1, wherein the heat sink device is removably capped at the opening of the first cavity.
  11. 11. An electronic component module comprising an electronic component and the heat dissipating device of any one of claims 1-10, the electronic component being disposed on top of the heat dissipating device.
  12. 12. The electronic component module of claim 11, wherein the substrate of the electronic component is disposed on top of and in direct contact with the heat sink by soldering.
  13. 13. A vehicle comprising the electronic component module of claim 11 or 12.

Description

Heat abstractor, electronic components module and vehicle Technical Field The disclosure relates to the technical field of heat dissipation control, in particular to a heat dissipation device, an electronic component module and a vehicle. Background With the continuous development of technology, the computing power of electronic components with computing power is continuously improved, for example, with the development of intelligent driving technology of vehicles, an enhanced auxiliary driving system needs chip support with higher computing power, however, the power consumption of the electronic components is also obviously increased, and the heat generation quantity is also improved. When the electronic components with high calculation force work, the heat flux density is high, the local temperature is easy to rise rapidly, the working efficiency is affected, and the components are seriously possibly burnt. Therefore, how to quickly and effectively dissipate heat of the electronic components is a key for further improving the computing power of the electronic components. Disclosure of Invention In order to overcome the problems in the related art, the present disclosure provides a heat dissipating device, an electronic component module, and a vehicle. According to a first aspect of an embodiment of the present disclosure, there is provided an electronic component heat dissipating device, including: A first chamber having an opening for circulating a first cooling medium therein; The heat dissipation device is covered on the opening, the top of the heat dissipation device is suitable for being connected with a heating source, the heat dissipation device is provided with a second cavity, a second cooling medium is arranged in the second cavity, and the second cooling medium is used for cooling the heating source and can transfer heat to the first cooling medium. Optionally, the second cooling medium is a phase change medium, and a capillary core is further disposed in the second cavity. Optionally, the heat dissipation device further includes a hollow protruding column, the protruding column is disposed on a side of the heat dissipation device facing the first cavity, and the protruding column is communicated with the second cavity. Optionally, the heat dissipation device includes an upper housing and a lower housing, the protruding column is disposed on the lower housing, the upper housing covers one side of the lower housing far away from the protruding column, wherein the inner wall of the upper housing, the inner wall of the lower housing and the inner wall of the protruding column are all provided with the capillary core. Optionally, the heat dissipating device further comprises a support column connected between the inner wall of the upper housing and the inner wall of the lower housing, and configured to provide a capillary force that returns the liquid. Optionally, the convex columns include a plurality of convex columns respectively arranged along a first direction and a second direction, wherein the convex columns are aligned in the first direction and the second direction, or the convex columns are aligned in one direction of the first direction and the second direction and staggered in the other direction, and the first direction is orthogonal to the second direction. Optionally, the stud is configured to be non-cylindrical. Optionally, the electronic component heat dissipation device further includes a plurality of heat dissipation fins stacked in the first cavity, and the protruding columns penetrate through the heat dissipation fins and are connected with the heat dissipation fins. Optionally, a plurality of radiating fins are arranged at intervals, and a channel for the first cooling medium to circulate is formed between two adjacent radiating fins. Optionally, the heat dissipation device is detachably covered on the opening of the first cavity. According to a second aspect of the embodiments of the present disclosure, there is provided an electronic component module including an electronic component and the heat dissipating device of any one of the above, where the electronic component is disposed on top of the heat dissipating device. Optionally, the substrate of the electronic component is disposed on the heat dissipation device by soldering and is in direct contact with the heat dissipation device. According to a third aspect of embodiments of the present disclosure, there is provided a vehicle including the electronic component module of any one of the above. The technical scheme provided by the embodiment of the disclosure can include the following beneficial effects that the heat dissipating device provided by the disclosure comprises the first cavity for circulating the first cooling medium and the heat dissipating device which covers the opening of the first cavity and is used for circulating the second cooling medium, namely, the first cavity and the heat dissipating device respect