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CN-122002749-A - Wind scooper and electronic device

CN122002749ACN 122002749 ACN122002749 ACN 122002749ACN-122002749-A

Abstract

The invention discloses a wind scooper and an electronic device. The air guide cover comprises a heat conduction part and a first heat dissipation part, wherein the heat conduction part and the first heat dissipation part form a circumferentially surrounding space, at least part of the heat conduction part is used for being in contact with the heating element, and the air guide cover dissipates heat for the heating element. The electronic device comprises a heating element and a wind scooper, wherein the heating element is in contact with a heat conduction part of the wind scooper. Under the vertical power supply framework, the wind scooper can be used as a radiating fin of a heating element such as a power module and the like, and the heat of the heating element is more efficiently transferred to the surrounding air, so that the radiating requirement of the power module in a narrow and closed space is met. The wind scooper can be used as a radiating fin of a heating element, has large radiating area and strong radiating capacity, and also has the drainage wind-guiding function of a load radiator.

Inventors

  • ZHAO JIE
  • LI YINGJUE
  • LIANG LE

Assignees

  • 台达电子企业管理（上海）有限公司

Dates

Publication Date
20260508
Application Date
20241105

Claims (20)

  1. 1. A wind scooper, characterized by comprising: the heat conduction part and the first heat dissipation part form a circumferentially surrounding space; At least part of the heat conducting part is used for contacting with the heating element, and the air guide cover dissipates heat for the heating element.
  2. 2. The wind scooper of claim 1 wherein, At least part of the top surface of the heat conducting part is used for contacting with the bottom surface of the heating element to conduct heat.
  3. 3. The wind scooper of claim 1 wherein, The first heat dissipation part comprises a first component which is of an inverted U-shaped structure; The heat conduction part comprises a second part, the second part is bent and has a bending angle, and the first part is connected with the second part.
  4. 4. The wind scooper of claim 1 wherein the heat conductive portion is at least one of a temperature equalization plate, a heat conductive sheet, a cold plate, and a heat pipe.
  5. 5. The air guide cover according to claim 1, wherein the heat conducting portion and the first heat dissipating portion are made of the same material.
  6. 6. A wind scooper according to claim 3 wherein the first component includes a first portion and a second portion, the first portion and the second portion being connected.
  7. 7. The wind scooper of claim 6 wherein the first portion and the second portion of the first member are each inverted L-shaped.
  8. 8. The wind scooper of claim 4, wherein the heat pipe is an ultra-thin heat pipe having a thickness of 0.3-0.5 mm.
  9. 9. A wind scooper according to claim 2 wherein the thickness of the thermally conductive section in contact with the heating element is less than 8mm.
  10. 10. The wind scooper of claim 1 wherein the thermal conductivity of the wind scooper is greater than or equal to 30W/(m-K).
  11. 11. A wind scooper according to claim 3 wherein the material of the first and/or second components is at least one of copper, an aluminum alloy, graphene, and a composite of diamond and metal.
  12. 12. A wind scooper according to claim 3 wherein the first component includes: a body portion; And the side plate part is detachably connected with the body part, and the second component is connected with the side plate part.
  13. 13. An electronic device, comprising: A heating element; the wind scooper according to any one of claims 1 to 12; wherein, the heating element is contacted with the heat conduction part of the wind scooper.
  14. 14. The electronic device according to claim 13, the electronic device is characterized in that the electronic device further comprises: a first circuit board; And a load, wherein, The heating element comprises at least one power module, the at least one power module is arranged on the bottom surface of the first circuit board, the load is positioned on the top surface of the first circuit board, and the power module supplies power to the load; the bottom surface of the at least one power module is contacted with the top surface of the heat conducting part.
  15. 15. The electronic device according to claim 14, the electronic device is characterized in that the electronic device further comprises: the load radiator is in contact with the load, and is positioned in the air guiding area of the air guiding cover, and the air guiding cover is used for guiding air to the load radiator.
  16. 16. The electronic device of claim 14, wherein the at least one power module and the projection of the load onto the first circuit board at least partially overlap.
  17. 17. The electronic device of claim 14, wherein a projection of the at least one power module onto a first circuit board is within a projection of the load onto the first circuit board.
  18. 18. The electronic device of claim 14, wherein the first circuit board, the at least one power module, and the load form a first module, and at least two of the first modules share one of the wind scoopers.
  19. 19. The electronic device of claim 18, wherein the first module comprises a plurality of the power modules disposed on a bottom surface of the first circuit board.
  20. 20. The electronic device according to claim 14, the electronic device is characterized in that the electronic device further comprises: the second circuit board is positioned below the heat conducting part; Wherein, a first gap is arranged between the second circuit board and the first circuit board; the first circuit board is connected with the second circuit board through a connector positioned in the first gap.

Description

Wind scooper and electronic device Technical Field The present invention relates to power electronic systems and heat dissipation techniques thereof, and more particularly to a wind scooper and an electronic device. Background With the steep demands of industries such as cloud computing, artificial intelligence and the like on computing power and power density, higher requirements are put on the efficiency and dynamic performance of a power supply system. The vertical power supply system architecture is attracting attention because of its advantages of good dynamic performance, high efficiency, and low capacitance. By "vertical power system architecture", i.e. a layout in which the power modules and the loads are stacked perpendicular to the circuit board on the top and bottom surfaces of the circuit board, respectively, the projections of the power modules and the loads onto the circuit board in this case at least partly overlap. As shown in fig. 1, a conventional "vertical power system architecture" generally lays out a load 301' (e.g., a processor) on the top surface of an OAM board 300', and lays out a plurality of power modules 200' on the bottom surface of the OAM board 300' to supply power to the load 301 '. And the projection of the plurality of power modules 200' on the plane of the OAM plate is located within the range of the projection of the load on the plane of the OAM plate. In order to increase the strength of the OAM plate 300', the upper and lower sides of the OAM plate 300' may be further provided with reinforcing bars 400 'and 500', respectively. Because the load has larger heating power, the area above the load 301 'can be as large as possible, but the projection of the load on the plane of the OAM plate is located in the load radiator 600' (such as a fin radiator) with a certain height in the OAM plate, so as to timely dissipate the heat of the load 301', and the maximum possible heat dissipation space of the load radiator 600' is all the space right above the OAM plate. The device of the OAM board 300', the load 301', the plurality of power modules 200', and the load heat sink 600' in combination is referred to as an "OAM module" (denoted as M1' in the figure). In order to increase the rigidity of the OAM plate and prevent buckling deformation thereof, the "OAM module" may further include reinforcing ribs provided above and below the OAM plate 300'. And the OAM module M1' and the system board (not shown) may transmit high-speed signals through a connector (not shown) to establish a communication connection. For a common AI server, eight OAM modules may be configured on one system board. However, the vertical power supply system architecture also presents a great challenge for heat dissipation of the power supply module, which faces the problem of high heat dissipation requirements but great heat dissipation difficulties. Generally, 10 to 30 power modules are needed to supply power to a load, and the power modules are generally arranged under the OAM board in a concentrated manner, so that the power density is high, the heat flux density is high, and the heat dissipation requirement is high. However, the OAM module is limited by the high-speed signal transmission quality requirement between the OAM module and the system board, the distance between the OAM board and the system board is small (5-8 mm according to OCP (Open Computing Project, open computing project) standard), the power module is arranged on the lower surface of the OAM board, so that the distance between the power module and the system board is smaller, and therefore, a fin radiator cannot be arranged between the power module and the system board. The width direction of the server is a direction perpendicular to the incoming flow direction in a plane parallel to the upper surface of the OAM board. That is, when the wind scooper is a square wind tunnel, the direction perpendicular to the side wall of the wind scooper is the width direction of the server. In addition, the incoming flow direction of wind of the power module on the OAM board is completely blocked by the two large connectors, so that the incoming flow wind can hardly blow to the position of the power module, and the heat dissipation difficulty is high. The power module faces the problems of high heat dissipation requirement and high heat dissipation difficulty. Currently, for the architecture of a vertical power supply system, there are mainly the following heat dissipation techniques: The first prior art is a "3D VC (Vapor Chamber) up-heat dissipation scheme", which is shown with reference to fig. 1, in which a 3D VC heat sink 10' is disposed in an OAM module M1', and the heat dissipation structure thereof mainly includes VC 11', heat pipes 12', and fins 13'. The OAM plate 300 'is grooved 302' such that the heat pipe 12 'passes through and extends to the upper portion of the OAM plate 300', and fins 13 'are arranged at the top ends of the heat pipe 12'. The h