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CN-122002755-A - Cooling assembly, heat dissipating device and vehicle

CN122002755ACN 122002755 ACN122002755 ACN 122002755ACN-122002755-A

Abstract

The application discloses a cooling assembly, a heat dissipating device and a vehicle, wherein the cooling assembly comprises a shell and a partition plate, the partition plate is arranged in the shell to divide the shell into a first subchamber and a second subchamber, and a plurality of spray holes are arranged in the partition plate to spray cooling medium of the first subchamber to the second subchamber so that bubbles generated by the second subchamber are separated from the shell. Like this, coolant lets in via first subchamber to form the jet in the jet orifice, make the jet can break up the bubble that the second subchamber produced, make the bubble become the tiny bubble, avoid the bubble to gather and form big bubble, so that coolant soaks the bottom surface of circulation passageway all the time, reinforcing cooling module's heat dispersion.

Inventors

  • GUO YUMING
  • YU HONGYI
  • WANG HONGTAO
  • CHEN YUHONG

Assignees

  • 比亚迪股份有限公司

Dates

Publication Date
20260508
Application Date
20241108

Claims (20)

  1. 1. A cooling assembly, characterized by comprising a housing (2) and a partition plate (1); the separation plate (1) is arranged in the shell (2) to separate the shell (2) into a first subchamber (41) and a second subchamber (42), and a plurality of injection holes (5) are arranged in the separation plate (1) to inject cooling medium of the first subchamber (41) to the second subchamber (42) so that bubbles generated by the second subchamber (42) are separated from the shell (2).
  2. 2. The cooling assembly according to claim 1, wherein the second subchamber (42) is adapted to communicate with a liquid supply system (12), the liquid supply system (12) being adapted to feed a cooling medium into the second subchamber (42) such that a channel flow (18) is formed in the second subchamber (42), with the bubbles being carried away by the channel flow (18).
  3. 3. A cooling assembly according to claim 2, characterized in that a first lead-in hole (23) and a lead-out hole (25) communicating with the second subchamber (42) are provided in the housing (2), the first lead-in hole (23) and the lead-out hole (25) being adapted to communicate with the liquid supply system (12), respectively, the liquid supply system (12) leading in the cooling medium through the first lead-in hole (23) to the second subchamber (42) and discharging the cooling medium through the lead-out hole (25).
  4. 4. The cooling module according to claim 1, characterized in that a number of flow channels (6) are provided in the second subchamber (42), at least part of the injection holes (5) being directed towards the flow channels (6) for injecting the cooling medium of the first subchamber (41) into the flow channels (6) for detaching air bubbles generated in the flow channels (6) from the housing (2).
  5. 5. A cooling module according to claim 4, wherein a plurality of said flow channels (6) are arranged in a first direction (X), at least part of said injection holes (5) having a pore size smaller than or equal to the width of said flow channels (6) in said first direction (X).
  6. 6. The cooling assembly according to claim 4, further comprising a number of heat sinks (3); The heat dissipation elements (3) are arranged on the side cavity wall of the second subchamber (42) facing the partition plate (1), a plurality of heat dissipation elements (3) are distributed at intervals, and a circulation channel (6) is formed between two adjacent heat dissipation elements (3).
  7. 7. The cooling assembly according to claim 6, wherein a number of said flow channels (6) are arranged along a first direction (X), said first subchamber (41) and said second subchamber (42) being arranged along a second direction (Z); The width L1 of the flow channel (6) along the first direction (X) and the height L2 of the flow channel (6) along the second direction (Z) are satisfied that L1/L2 is more than or equal to 0.7 and less than or equal to 1.3; And/or the width L1 of the circulation channel (6) along the first direction (X) and the width L3 of the heat dissipation piece (3) along the first direction (X) are satisfied that L1/L3 is 1.1-4; and/or the height L2 of the circulation channel (6) along the second direction (Z) and the width L3 of the heat dissipation piece (3) along the first direction (X) are satisfied that L2/L3 is less than or equal to 1.1 and less than or equal to 4.
  8. 8. The cooling assembly according to claim 6, wherein a plurality of the heat dissipation members (3) are arranged at intervals to form a plurality of the flow channels (6), and a plurality of the injection holes (5) in the partition plate (1) are arranged at intervals in rows, each row of the injection holes (5) being arranged opposite to one of the flow channels (6).
  9. 9. A cooling module according to claim 6, characterized in that the surface of the side of the heat sink (3) facing the partition plate (1) is provided with a vaporising core layer (9) for capturing bubbles (14) generated by vaporisation of the cooling medium.
  10. 10. A cooling module according to claim 9, characterized in that the side of the heat sink (3) facing the partition plate (1) is provided with a relief structure or a porous structure layer to form the vaporising core layer (9).
  11. 11. The cooling assembly according to claim 4, wherein a liquid inlet channel (26) and a liquid outlet channel (27) are further provided in the housing (2), the liquid inlet channel (26) and the liquid outlet channel (27) being adapted to communicate with a liquid supply system (12), respectively, and the second subchamber (42) being in communication with the liquid inlet channel (26) and the liquid outlet channel (27), respectively.
  12. 12. The cooling assembly according to claim 11, wherein the flow channel (6) extends in a third direction (Y), the liquid inlet channel (26) and the liquid outlet channel (27) being provided separately at both ends of the second subchamber (42) in the third direction (Y); The extending direction of the circulating channel (6) is intersected with the extending direction of the liquid inlet channel (26), and/or the extending direction of the circulating channel (6) is intersected with the extending direction of the liquid outlet channel (27).
  13. 13. A cooling assembly according to claim 1, wherein a second inlet hole (24) communicating with the first subchamber (41) is provided in the housing (2), the second inlet hole (24) being adapted to communicate with a liquid supply system (12), the liquid supply system (12) leading in the cooling medium to the first subchamber (41) through the second inlet hole (24).
  14. 14. The cooling module according to claim 13, characterized in that the spray holes (5) in the partition plate (1) are arranged at intervals in rows, wherein the side of each row of spray holes (5) close to the second introduction hole (24) is a first side (7), the side remote from the second introduction hole (24) is a second side (8), and the hole diameters of the spray holes in each row of spray holes (5) increase from the first side (7) to the second side (8).
  15. 15. A cooling module according to claim 13, wherein the orthographic projection of the second introduction hole (24) on the partition plate (1) and the injection hole (5) are offset from each other in the arrangement direction of the first subchamber (41) to the second subchamber (42).
  16. 16. The cooling assembly according to claim 13, wherein a plurality of seal cavities (4) are provided in the housing (2), the plurality of seal cavities (4) being arranged at intervals, the partition plate (1) being provided in each seal cavity (4) to partition the seal cavity (4) into the first sub-cavity (41) and the second sub-cavity (42).
  17. 17. The cooling assembly according to claim 16, wherein the housing (2) is provided with the second introduction holes (24) at positions corresponding to each of the seal cavities (4), the second introduction holes (24) being in communication with the corresponding first subchambers (41).
  18. 18. The cooling assembly according to claim 16, wherein the housing (2) comprises a first housing (21) and a second housing (22), the first housing (21) being connected to the second housing (22) and enclosing a plurality of the sealed cavities (4), the partition plate (1) being provided between the first housing (21) and the second housing (22) to partition each sealed cavity (4) into one of the first subchambers (41) and one of the second subchambers (42).
  19. 19. The cooling assembly according to claim 18, further comprising a first seal (10), the first seal (10) being provided between the first housing (21) and the partition plate (1) to seal the first housing (21) and the partition plate (1); And/or, further comprising a second sealing member (11), wherein the second sealing member (11) is arranged between the second shell (22) and the partition plate (1) so as to seal the second shell (22) and the partition plate (1).
  20. 20. A heat sink comprising a cooling assembly according to any one of claims 1-19.

Description

Cooling assembly, heat dissipating device and vehicle Technical Field The application belongs to the technical field of heat dissipation, and particularly relates to a cooling assembly, a heat dissipation device and a vehicle. Background The high temperature can cause great harm to the performance and reliability of the electronic device, and the failure rate of the electronic device can increase exponentially with the increase of the temperature. The large amount of heat generated by the electronic device during operation must be evacuated in time to ensure that the device can operate normally, efficiently and safely. With the rapid development of semiconductor technology and electronic technology, the integration level of electronic devices is doubled, and accordingly, the heat generation amount is increased, for example, billions of transistors and connecting wires for generating heat are integrated in a millimeter-sized chip. Because the iterative development speed of the heat dissipation technology is far less than the blowout development of the electronic device, the design and application of the electronic device are severely restricted by the current thermal management technology. In the related art, a heat dissipation structure is used to dissipate heat of an electronic device, that is, a cooling medium is introduced from one end of the heat dissipation structure, and the cooling medium leaves the heat dissipation structure after absorbing heat of the electronic device, so as to dissipate heat of the electronic device through the cooling medium. However, with the heat dissipation structure in the related art, the heat dissipation capability is poor, and the heat dissipation requirement of the electronic device cannot be met. Disclosure of Invention The application aims to provide a cooling assembly, a heat dissipation device and a vehicle, which can solve the problem of poor heat dissipation capacity of a heat dissipation structure in the prior art. In order to solve the technical problems, the application is realized as follows: In a first aspect, an embodiment of the application provides a cooling assembly, which comprises a shell and a partition plate, wherein the partition plate is arranged in the shell to divide the shell into a first subchamber and a second subchamber, and a plurality of spray holes are arranged in the partition plate to spray cooling medium of the first subchamber to the second subchamber so as to separate bubbles generated by the second subchamber from the shell. Optionally, the second subchamber is adapted to communicate with a liquid supply system for introducing a cooling medium into the second subchamber to form a channel flow in the second subchamber through which the bubbles are carried away. Optionally, a first inlet hole and a discharge hole are provided in the housing, which are in communication with the second subchamber, the first inlet hole and the discharge hole being adapted to communicate with the liquid supply system, respectively, which supplies the cooling medium to the second subchamber through the first inlet hole and discharges the cooling medium through the discharge hole. Optionally, a plurality of circulation channels are arranged in the second subchamber, and at least part of the injection holes face the circulation channels so as to inject the cooling medium of the first subchamber into the circulation channels, so that bubbles generated in the circulation channels are separated from the shell. Optionally, the plurality of flow channels are arranged along a first direction, and at least part of the spray holes have a pore diameter smaller than or equal to the width of the flow channels along the first direction. Optionally, the heat dissipation device further comprises a plurality of heat dissipation pieces, wherein the heat dissipation pieces are arranged on the cavity wall of the second subchamber facing the separation plate, the plurality of heat dissipation pieces are arranged at intervals, and the circulation channel is formed between two adjacent heat dissipation pieces. Optionally, the plurality of circulation channels are arranged along a first direction, the first subchamber and the second subchamber are arranged along a second direction, the width L1 of the circulation channels along the first direction and the height L2 of the circulation channels along the second direction are 0.7-1/L2-1.3, and/or the width L1 of the circulation channels along the first direction and the width L3 of the heat dissipation piece along the first direction are 1.1-4, and/or the height L2 of the circulation channels along the second direction and the width L3 of the heat dissipation piece along the first direction are 1.1-2/L3-4. Optionally, the plurality of heat dissipation parts are arranged at intervals to form a plurality of circulation channels, the plurality of injection holes in the partition plate are arranged at intervals in rows, and each row of inj