CN-122002757-A - Pipeline guide module, liquid cooling device and data processing system

CN122002757ACN 122002757 ACN122002757 ACN 122002757ACN-122002757-A

Abstract

The invention provides a pipeline guide module, a liquid cooling device and a data processing system. The pipeline guiding module comprises a base, a floating member and a first elastic member. The base is provided with an accommodating hole and a first limiting structure. The floating piece is floatably arranged in the accommodating hole. The first elastic piece is arranged along an axial direction of the accommodating hole and is clamped between the first limiting structure and the floating piece. The pipeline guide module can be applied to liquid cooling devices and data processing systems to offset pipeline bending stress and avoid leakage at the joint of the pipeline and the joint.

Inventors

HU ZHAOYAN
CHEN YANYU

Assignees

纬颖科技服务股份有限公司

Dates

Publication Date: 20260508
Application Date: 20241121
Priority Date: 20241107

Claims (13)

1. A pipeline guide module, comprising: A base having a receiving hole and a first limiting structure; A floating member floatably disposed in the receiving hole, and The first elastic piece is arranged along an axial direction of the accommodating hole and is clamped between the first limiting structure and the floating piece.
2. The pipeline guide module of claim 1, wherein the base further comprises a second limiting structure, the first limiting structure and the second limiting structure are located at opposite sides of the accommodating hole, the pipeline guide module further comprises a second elastic member disposed along the axial direction of the accommodating hole and sandwiched between the second limiting structure and the floating member, and the first elastic member and the second elastic member are located at opposite sides of the floating member.
3. The circuit guide module of claim 2, wherein at least one of the first elastic member and the second elastic member is a wave spring.
4. The pipeline guide module of claim 1, further comprising a plurality of third elastic members disposed around the floating member along a radial direction of the receiving hole and abutting against the base.
5. The pipeline guide module according to claim 4, wherein each of the third elastic members comprises a head, a sleeve and a spring, the spring is disposed in the sleeve, and the head is disposed at one end of the sleeve and abuts against the spring.
6. The pipeline guide module of claim 5, wherein the floating member has a plurality of fixing holes around, the sleeve of each third elastic member is fixed to one of the fixing holes, and the head of each third elastic member abuts against the base.
7. The pipeline guide module of claim 1, wherein the floating member comprises a first pipeline connector and a plurality of second pipeline connectors, the first pipeline connector and the plurality of second pipeline connectors being located on opposite sides of the floating member, the first pipeline connector being in communication with the plurality of second pipeline connectors.
8. The circuit guiding module according to claim 1, wherein the first limiting structure comprises a plurality of baffles symmetrically disposed around the accommodating hole.
9. A liquid cooling apparatus comprising: A liquid cooling plate; the pipeline guide module according to any one of claims 1 to 8, connected to the liquid cooling plate, and A pipeline connecting module connected to the pipeline guiding module.
10. The liquid cooling device of claim 9, wherein the pipeline connection module comprises a frame body and a floating block, the frame body is provided with a containing cavity, the floating block is floatably arranged in the containing cavity, the liquid cooling device further comprises a first pipeline and a second pipeline, the first pipeline is connected with the floating piece and the floating block, and the second pipeline is connected with the liquid cooling plate and the floating piece.
11. The liquid cooling apparatus of claim 9, wherein a distance between the piping connection module and the liquid cooling plate is greater than or equal to 1 mm.
12. The liquid cooling apparatus of claim 9, wherein a distance between the pipe guide module and the pipe connection module is between 100mm and 200 mm.
13. A data processing system, comprising: A cabinet; A manifold disposed in the cabinet; an electronic device arranged in the cabinet, and The liquid cooling device of claim 9, wherein the pipeline connection module is connected to the manifold.

Description

Pipeline guide module, liquid cooling device and data processing system Technical Field The present invention relates to a pipeline guiding module, and more particularly to a pipeline guiding module capable of compensating bending stress of a pipeline, a liquid cooling device and a data processing system. Background With the increase of the speed and efficiency of electronic components (e.g., a cpu) in a server, more and more servers use a liquid cooling method to dissipate heat of the electronic components, so as to improve the heat dissipation efficiency. Generally, liquid cooling devices take up space than air cooling devices. When the liquid cooling apparatus is disposed in a limited space above the server, the following problems occur due to insufficient space. When the distance between the two joints of the connecting pipeline is too short, the pipeline is not easy to bend, so that the joint of the pipeline and the joint is easy to leak. In addition, the pipe bending stress is too large, so that the joint is easy to assemble and even damaged. Disclosure of Invention The present invention is directed to a pipeline guide module, a liquid cooling device and a data processing system, so as to solve at least one of the above problems. According to one embodiment, the pipeline guide module of the present invention includes a base, a floating member and a first elastic member. The base is provided with an accommodating hole and a first limiting structure. The floating piece is floatably arranged in the accommodating hole. The first elastic piece is arranged along an axial direction of the accommodating hole and is clamped between the first limiting structure and the floating piece. According to an embodiment, the liquid cooling device of the present invention includes a liquid cooling plate, the above-mentioned pipeline guiding module and a pipeline connecting module. The pipeline guide module is connected to the liquid cooling plate. The pipeline connecting module is connected with the pipeline guiding module. According to one embodiment, a data processing system of the present invention includes a cabinet, a manifold, an electronic device, and a liquid cooling device as described above. The manifold is disposed in the cabinet. The electronic device is arranged in the cabinet. The liquid cooling device is arranged on the electronic device. The pipeline connecting module is connected to the manifold. The invention has the advantages that when the pipeline is connected with the pipeline guide module, the floating piece of the pipeline guide module can bear force to float, so as to offset the bending stress of the pipeline and avoid the leakage at the joint of the pipeline and the joint. In addition, since the floating member can float in three directions, the slider of the pipeline connecting module can be kept at the central position, and the slider (and the first pipeline joint and the plurality of second pipeline joints thereon) is prevented from being eccentric due to the influence of pipeline bending stress from any direction. Drawings FIG. 1 is a schematic diagram of a data processing system according to an embodiment of the invention. Fig. 2 is a perspective view of the liquid cooling apparatus in fig. 1. Fig. 3 is a top view of the liquid cooling apparatus of fig. 2. Fig. 4 is a perspective view of the pipe guide module of fig. 2. Fig. 5 is an exploded view of the pipeline guide module of fig. 4. Fig. 6 is a perspective view of the pipe guide module of fig. 2 at another view angle. Fig. 7 is an exploded view of the pipeline guide module of fig. 6. Fig. 8 is a cross-sectional view of the pipeline guide module of fig. 2. Fig. 9 is a cross-sectional view of the piping connection module of fig. 2. The reference numerals are as follows: 1 data processing system 10 Cabinet 12 Manifold 14 Electronic device 16 Liquid cooling device 160 Liquid cooling plate 162 Pipeline guiding module 164 Pipeline connecting module 166 First pipeline 168 Second pipeline 170 Third pipeline 1620 Base 1620A,1620b fixing block 1622 Float member 1624 First elastic member 1626 Second elastic member 1628 Third elastic member 1630 Fixing piece 1640 Frame body 1642 Slider 1644 Fourth elastic member 16200 Accommodating hole 16202 First limiting structure 16204 Second spacing structure 16206,16208 Baffle plate 16220,16420 Fixing hole 16222 First pipeline joint 16224 Second pipeline joint 16280 Head part 16282 Sleeve pipe 16284 Spring 16400 Containing cavity D1, D2 distance X, Z radial direction Y axial direction Detailed Description Referring to fig. 1 to 9, fig. 1 is a schematic diagram of a data processing system 1 according to an embodiment of the present invention, fig. 2 is a perspective view of a liquid cooling device 16 in fig. 1, fig. 3 is a top view of the liquid cooling device 16 in fig. 2, fig. 4 is a perspective view of a pipeline guiding module 162 in fig. 2, fig. 5 is an exploded view of the pipeline guiding module 162 in f