CN-122002758-A - Liquid-cooled power cabinet and liquid-cooled power cabinet using same

Abstract

The invention provides a liquid cooling type power supply cabinet, which comprises at least one power supply, at least one cold plate, a cooling liquid input/output unit and a power bus. The cold plate is in thermal contact with the power supply to absorb a thermal energy. Each cold plate has a coolant input and a coolant output. The cooling fluid input/output unit comprises a first conduit, a second conduit and a heat dissipation manifold plate. The first conduit is connected with the cooling liquid input end and the heat dissipation manifold plate, and the second conduit is connected with the cooling liquid output end and the heat dissipation manifold plate. The power bus comprises a first bus copper bar and a second bus copper bar which are oppositely arranged, and the first bus copper bar and the second bus copper bar are electrically insulated from each other. The heat dissipation manifold plate is in heat extraction contact with the first bus copper bar and the second bus copper bar.

Inventors

• ZHU SHUWEI
• LI JIANZHI
• LIANG WEIHAO

Assignees

• 光宝科技股份有限公司

Dates

Publication Date

20260508

Application Date

20250218

Priority Date

20241106

Claims (20)

1. 1. The liquid cooling type power supply cabinet is characterized by comprising: At least one power supply; At least one cold plate in thermal contact with the power supply to absorb a thermal energy, the cold plate having a coolant input and a coolant output; A cooling fluid input/output unit including a first conduit connected to the cooling fluid input end and the heat dissipation manifold plate, a second conduit connected to the cooling fluid output end and the heat dissipation manifold plate, and a heat dissipation manifold plate A power bus including a first bus bar and a second bus bar electrically insulated from each other, The heat dissipation manifold plate is in heat extraction contact with the first bus copper bar and the second bus copper bar.
2. 2. The liquid-cooled power chassis of claim 1, wherein the heat sink manifold plate is disposed between the first bus bar and the second bus bar, the heat sink manifold plate comprising a first surface and a second surface, the first bus bar being in thermal contact with the first surface, and the second bus bar being in thermal contact with the second surface.
3. 3. The liquid-cooled power chassis of claim 2, further comprising a first thermal pad disposed on the first surface and a second thermal pad disposed on the second surface.
4. 4. The liquid-cooled power chassis of claim 1, wherein the second copper busbar is disposed between the first copper busbar and the heat sink manifold plate, the second copper busbar includes a first surface and a second surface, the first copper busbar is in thermal contact with the first surface, and the heat sink manifold plate is in thermal contact with the second surface.
5. 5. The liquid-cooled power chassis of claim 4, further comprising a first thermal pad disposed on the first surface and a second thermal pad disposed on the second surface.
6. 6. The liquid-cooled power chassis of claim 1, wherein the heat sink manifold plate comprises a first heat sink manifold plate and a second heat sink manifold plate, the first heat sink manifold plate is disposed between the first bus bar and the second bus bar, the second bus bar is disposed between the first heat sink manifold plate and the second heat sink manifold plate, the first heat sink manifold plate comprises a first surface and a second surface, the first bus bar is in thermal contact with the first surface, the second bus bar is in thermal contact with the second surface, the second heat sink manifold plate comprises a third surface, and the second bus bar is in thermal contact with the third surface.
7. 7. The liquid-cooled power chassis of claim 6, further comprising a first thermal pad, a second thermal pad and a third thermal pad, wherein the first thermal pad is disposed on the first surface, the second thermal pad is disposed on the second surface, and the third thermal pad is disposed on the third surface.
8. 8. The liquid-cooled power chassis of claim 1, further comprising a circuit board electrically connected to the power supply, wherein at least one of the first and second copper buss bars comprises at least one copper post passing through the heat dissipating manifold plate and connected to the circuit board.
9. 9. The liquid-cooled power chassis of claim 1, further comprising a power connector having a positive electrode and a negative electrode, wherein the first copper busbar and the second copper busbar are respectively connected to the positive electrode and the negative electrode.
10. 10. The liquid-cooled power cabinet is characterized by comprising: at least one liquid-cooled power supply cabinet comprising at least one power supply; A cooling fluid input/output unit including a first connection port, a second connection port, a heat dissipation manifold plate, a cooling fluid input manifold and a cooling fluid output manifold, wherein the heat dissipation manifold plate is positioned in the liquid cooling power supply case, the first connection port is connected with the heat dissipation manifold plate and the cooling fluid input manifold, the second connection port is connected with the heat dissipation manifold plate and the cooling fluid output manifold, and A power bus including a first bus bar and a second bus bar electrically insulated from each other, The heat dissipation manifold plate is in heat extraction contact with the first bus copper bar and the second bus copper bar.
11. 11. The liquid-cooled power cabinet of claim 10, wherein the liquid-cooled power cabinet further comprises at least one cold plate in thermal contact with the power supply to absorb a thermal energy, the cold plate having a coolant input and a coolant output, the coolant input and the coolant output being respectively coupled to the heat sink manifold plate.
12. 12. The liquid-cooled power cabinet of claim 11, wherein the coolant input/output unit further comprises a first conduit and a second conduit, the first conduit connecting the coolant input and the heat dissipation manifold plate, the second conduit connecting the coolant output and the heat dissipation manifold plate.
13. 13. The liquid-cooled power cabinet of claim 10, wherein the heat sink manifold plate is disposed between the first bus bar and the second bus bar, the heat sink manifold plate comprising a first surface and a second surface, the first bus bar being in thermal contact with the first surface and the second bus bar being in thermal contact with the second surface.
14. 14. The liquid-cooled power cabinet of claim 13 further comprising a first thermal pad disposed on the first surface and a second thermal pad disposed on the second surface.
15. 15. The liquid-cooled power cabinet of claim 10, wherein the second copper busbar is disposed between the first copper busbar and the heat sink manifold plate, the second copper busbar including a first surface and a second surface, the first copper busbar being in thermal contact with the first surface, and the heat sink manifold plate being in thermal contact with the second surface.
16. 16. The liquid-cooled power cabinet of claim 15 further comprising a first thermal pad disposed on the first surface and a second thermal pad disposed on the second surface.
17. 17. The liquid-cooled power cabinet of claim 10, wherein the heat sink manifold plate comprises a first heat sink manifold plate and a second heat sink manifold plate, the first heat sink manifold plate is disposed between the first bus bar and the second bus bar, the second bus bar is disposed between the first heat sink manifold plate and the second heat sink manifold plate, the first heat sink manifold plate comprises a first surface and a second surface, the first bus bar is in thermal contact with the first surface, the second bus bar is in thermal contact with the second surface, the second heat sink manifold plate comprises a third surface, and the second bus bar is in thermal contact with the third surface.
18. 18. The liquid-cooled power cabinet of claim 17, further comprising a first thermal pad, a second thermal pad, and a third thermal pad, wherein the first thermal pad is disposed on the first surface, the second thermal pad is disposed on the second surface, and the third thermal pad is disposed on the third surface.
19. 19. The liquid-cooled power cabinet of claim 10, wherein at least one of the first bus bar and the second bus bar comprises at least one copper post that passes through the heat dissipating manifold plate.
20. 20. The liquid-cooled power cabinet of claim 10, further comprising a power connector having a positive electrode and a negative electrode, wherein the first copper busbar and the second copper busbar are respectively connected to the positive electrode and the negative electrode.

Description

Liquid-cooled power cabinet and liquid-cooled power cabinet using same Technical Field The present invention relates to a liquid cooling system, and more particularly to a liquid cooling power cabinet and a liquid cooling power cabinet using the same. Background The traditional liquid cooling architecture needs to add an active heat dissipation cooling plate or a heat conduction copper sheet in the cabinet, heat energy is transferred to cooling liquid through the cooling plate or the heat conduction copper sheet, and then the cooling liquid takes away the heat energy. However, if the heat energy is not conducted to the outside of the cabinet through the cooling plate or the heat conducting copper sheet, the internal temperature of the cabinet is too high, which leads to damage of parts. In addition, the copper bars with high current load also generate heat, which causes the internal temperature of the cabinet to be too high. Disclosure of Invention The invention relates to a liquid-cooled power cabinet and a liquid-cooled power cabinet using the same, which can conduct waste heat to the outside of the cabinet through cooling liquid so as to achieve the effect of rapid cooling. According to one aspect of the present invention, a liquid-cooled power supply case is provided, which includes at least one power supply, at least one cold plate, a cooling liquid input/output unit, and a power bus. The cold plate is in thermal contact with the power supply to absorb a thermal energy. Each of the cold plates has a coolant input and a coolant output. The cooling fluid input/output unit comprises a first conduit, a second conduit and a heat dissipation manifold plate. The first conduit is connected with the cooling liquid input end and the heat dissipation manifold plate, and the second conduit is connected with the cooling liquid output end and the heat dissipation manifold plate. The power bus comprises a first bus copper bar and a second bus copper bar which are oppositely arranged, and the first bus copper bar and the second bus copper bar are electrically insulated from each other. The heat dissipation manifold plate is in heat extraction contact with the first bus copper bar and the second bus copper bar. According to one aspect of the present invention, a liquid-cooled power cabinet is provided, comprising at least one liquid-cooled power cabinet, a cooling liquid input/output unit, and an electric bus. The liquid-cooled power supply case comprises at least one power supply. The cooling fluid input/output unit comprises a first connection port, a second connection port, a heat dissipation manifold plate, a cooling fluid input manifold and a cooling fluid output manifold. The heat radiation manifold plate is positioned in the liquid cooling type power supply case, the first connecting port is connected with the heat radiation manifold plate and the cooling liquid input manifold, the second connecting port is connected with the heat radiation manifold plate and the cooling liquid output manifold, the electric bus comprises a first bus copper bar and a second bus copper bar which are oppositely arranged, and the first bus copper bar and the second bus copper bar are electrically insulated from each other. The heat dissipation manifold plate is in heat extraction contact with the first bus copper bar and the second bus copper bar. For a better understanding of the above and other aspects of the invention, reference will now be made in detail to the following examples, examples of which are illustrated in the accompanying drawings. Drawings Fig. 1 is a schematic diagram of a liquid-cooled power supply chassis according to an embodiment of the invention. Fig. 2 is a schematic perspective view of the busbar of fig. 1. Fig. 3A and 3B are an external view and an exploded view of the cooling liquid input/output unit in fig. 1. Fig. 4 is a schematic diagram illustrating a cooling fluid conduction of a liquid-cooled power cabinet according to an embodiment of the invention. Fig. 5 is a schematic diagram of a liquid-cooled power supply chassis according to another embodiment of the present invention. Fig. 6A is a 3D schematic diagram of the cooling fluid input/output unit of fig. 5. FIG. 6B is a schematic cross-sectional view of line A-A of FIG. 6A. Fig. 7 is a schematic diagram illustrating a cooling fluid conduction of a liquid-cooled power cabinet according to another embodiment of the invention. Fig. 8 is a schematic diagram of a liquid-cooled power supply chassis according to another embodiment of the present invention. Fig. 9A and 9B are external views of the cooling liquid input/output unit of fig. 8. Fig. 10 to 12 are schematic diagrams illustrating cooling liquid conduction of a liquid-cooled power cabinet according to another embodiment of the invention. Wherein, the reference numerals: 100 liquid cooling power supply cabinet 101A-101E liquid cooled power cabinet 102 Power supply 103A, 103b electrical connector 104