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CN-122002764-A - Power module bridge and method for assembling a power module bridge

CN122002764ACN 122002764 ACN122002764 ACN 122002764ACN-122002764-A

Abstract

A power module bridge (100) comprising a cooler (102) with a guide surface (116) having at least two power modules (12) with semiconductor components arranged, wherein each power module (12) is assigned a current guide path which is designed as an injection-encapsulated copper component (122) and a phase bridge (128) and is connected to the power module (12) by means of a first material-locking connection by means of a first pre-structure element (106.1), wherein each power module (12) is assigned a signal adapter (118), wherein the signal adapter (118) is connected to the power module (12) by means of an adhesive (902), wherein the signal adapter (118) has a plurality of press-in pins (120) and contact surfaces (602), wherein the contact surfaces (602) can be brought into contact with the semiconductor components of the power module (12) by means of bonding wires (124), wherein the power module (12) is connected to the cooler (102) by means of a second material-locking connection by means of a second pre-structure element (106.2).

Inventors

  • I. Adogmus

Assignees

  • 罗伯特·博世有限公司

Dates

Publication Date
20260508
Application Date
20251106
Priority Date
20241108

Claims (11)

  1. 1. A power module bridge (100) comprising a cooler (102) with a guide surface (116) having at least two power modules (12) with semiconductor components, wherein each power module (12) is assigned a current guide path, which is designed as an injection-encapsulated copper component (122) and a phase bridge (128) and is connected to the power module (12) by means of a first material-locking connection via a first pre-structure element (106.1), wherein each power module (12) is assigned a signal adapter (118), wherein the signal adapter (118) is connected to the power module (12) by means of an adhesive (902), wherein the signal adapter (118) has a plurality of press-in pins (120) and a contact surface (602), wherein the contact surface (602) can be brought into contact with the semiconductor components of the power module (12) by means of a bonding wire connection having bonding wires (124), wherein the power module (12) is connected to the second material-locking connection (102) by means of a second pre-structure element (106.2), respectively.
  2. 2. The power module bridge (100) of claim 1, wherein the first pre-structured element (106.1) and the second pre-structured element (106.2) are configured as brazing sheets.
  3. 3. The power module bridge (100) according to claim 1 or 2, wherein the power modules (12) are each at least partially surrounded by a molded body (130).
  4. 4. The power module bridge (100) of any of the preceding claims, wherein the power module bridge (100) comprises a first power module (110.1), a second power module (110.2) and a third power module (110.3).
  5. 5. The power module bridge (100) of any one of the preceding claims, wherein the contact surface (602) of the signal adapter (118) can be contacted by a third material-locking connection or an adhesive connection with a semiconductor component of the power module (12).
  6. 6. The power module bridge (100) of any one of the preceding claims, wherein the first and second material-locking connections are configured as laser welded connections.
  7. 7. The power module bridge (100) according to any one of the preceding claims, wherein a t+ bridge (126) and a T-bridge (127) are configured alongside each other in the injection-encapsulated copper element (122), such that a low-inductance connection is configured.
  8. 8. The power module bridge (100) according to any one of the preceding claims, wherein the signal adapter (118) has a structural space (702) which can be configured such that contact between the power module (12) and an external contact is ensured.
  9. 9. The power module bridge (100) of any one of the preceding claims, wherein the adhesive (902) is configured such that an adjustable spacing (904) can be implemented during connection between the power module (12) and the signal adapter (118).
  10. 10. The power module bridge (100) of any one of the preceding claims, wherein the guiding surface (116) is configured as a copper coating.
  11. 11. Method for assembling a power module bridge (100) according to any one of claims 1 to 10, comprising at least one first step, a second step and a third step, wherein in the first step the cooler (102) and the power module (12) are connected in a material-locking manner with the introduction of a second pre-structure element (106.2), and the power module (12) is connected in a material-locking manner with the introduction of a first pre-structure element (106.1), wherein in the second step a signal adapter (118) is glued to a power module (12) respectively, wherein in the third step the signal adapter (118) is brought into contact with the power module (12).

Description

Power module bridge and method for assembling a power module bridge Technical Field The invention relates to a power module bridge having a cooler, at least two power modules, each of which has at least one first and one second pre-structural element, and at least one ac power contact and at least one dc power contact, which has injection-molded copper elements and a signal adapter. Furthermore, the invention relates to a method for assembling a power module bridge. Background DE 10 2014 219 998 B4 discloses a power module, in particular for supplying an electric motor with phase current. The power module comprises a circuit carrier with a surface, at least two first contact surfaces on the surface and at least two first power transistors, which each have contact surfaces on the bottom. The first power transistors of the at least two first power transistors are each arranged directly on a respective one of the first contact surfaces and are electrically conductively connected directly to the respective first contact surface via their bottom contact surfaces. The power module further comprises a second contact surface on the surface and at least two second power transistors, each having a ground contact surface. At least two second power transistors are arranged directly on the second contact surface and are electrically conductively connected directly to the second contact surface via their respective bottom contact surfaces. The power module further comprises at least two third contact surfaces on the surface, wherein the at least two second power transistors each have a further contact surface on their side facing away from the surface of the circuit carrier, and the second power transistors of the at least two second power transistors are each electrically conductively connected to a respective third contact surface of the at least two third contact surfaces by way of their further contact surfaces. The at least two first contact surfaces and the at least two third contact surfaces are arranged one behind the other alternately in the longitudinal direction of the power module, and the second contact surfaces are arranged next to the at least two first contact surfaces and the at least two third contact surfaces, wherein the second contact surfaces have at least two contact areas, wherein the contact areas of the at least two contact areas are arranged next to the respective first power transistors of the at least two first power transistors. The at least two first power transistors each have a further contact surface on their side facing away from the circuit carrier, and the first power transistor of the at least two first power transistors is electrically conductively connected by its further contact surface to a respective contact region of the at least two contact regions of the second contact surface lying next to it. The at least two contact regions of the second contact surface and the at least two second power transistors are arranged alternately one behind the other in the longitudinal direction. Disclosure of Invention According to the invention, a power module bridge is proposed, which has a cooling body with a guide surface, which has at least two power modules with semiconductor components arranged, wherein each power module is assigned a current guide path, which is designed as an injection-encapsulated copper component and a phase bridge and is connected to the power module by means of a first material-locking connection via a first pre-structure element. Furthermore, each power module is assigned a signal adapter, which is connected to the power module by means of an adhesive. The signal adapter has a plurality of press-in pins and contact surfaces, which can be brought into contact with the semiconductor component of the power module via a bond wire connection with a bond wire. The power module is furthermore connected to the heat sink by a second material-locking connection via a second pre-structure element. The solution according to the invention provides a power module bridge with a signal adapter which enables a direct integration into an existing production Line of the power module bridge, a so-called "Design-to-Line", unlike conventional solutions, which does not require additional adaptations or modifications. The solution according to the invention results not only in an increase in production efficiency but also in a reduction in production costs. The signal adapter represents a technical interface for transmitting control signals to the power modules of the power module bridge. The signal adapter ensures that the signal parameters between the controller and the corresponding power modules of the power module bridge are optimally adapted. The signal adapter acts, for example, as a transformer, which converts an input signal from the control unit into an output signal suitable for the power module. For this purpose, for example, the voltage level and the current level are adapte