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CN-122002770-A - Multilayer graphite heat radiation structure with high heat radiation and buffering and damping functions

CN122002770ACN 122002770 ACN122002770 ACN 122002770ACN-122002770-A

Abstract

The invention relates to the technical field of graphite layers, and discloses a multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping, the black rubber-containing Mylar layer comprises a first black rubber-containing Mylar layer, a first high heat conduction layer, a first double-sided adhesive layer, a buffer layer, a second double-sided adhesive layer, a second high heat conduction layer and a second black rubber-containing Mylar layer from top to bottom. The invention adopts a double-layer high heat conduction graphite structure to form a high-efficiency heat conduction path, the in-plane heat conduction coefficient can reach more than 1400W/(m.K), the heat dissipation efficiency is improved by more than 30% compared with that of a single-layer graphite material, and the local hot spot can be rapidly diffused to a large-area; the middle layer is made of high-resilience foam material, compression set rate is less than or equal to 10%, vibration energy can be effectively absorbed, the high-resilience foam material is suitable for high-vibration environments such as mobile equipment and vehicle-mounted electronics, the black rubber-containing Mylar layer on the surface has conductivity, and certain electromagnetic shielding effectiveness (SE is more than or equal to 30 dB) can be provided by combining the inner graphite layer, so that the use requirement of an EMI sensitive scene is met.

Inventors

  • WANG LIUYANG

Assignees

  • 吴江朗恩电子科技有限公司

Dates

Publication Date
20260508
Application Date
20260330

Claims (7)

  1. 1. A multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping comprises a first black rubber-containing Mylar layer (1), a first high heat conduction layer (2), a first double-sided adhesive layer (3), a buffer layer (4), a second double-sided adhesive layer (5), a second high heat conduction layer (6) and a second black rubber-containing Mylar layer (7) from top to bottom.
  2. 2. The multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping according to claim 1, wherein the first high heat conduction layer (2) and the second high heat conduction layer (6) are one or more of artificial graphite films, natural graphite films, copper foils or nano copper foils, and the thickness is 0.01-0.05 mm.
  3. 3. The multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping according to claim 1, wherein the buffer layer (4) is one of polyurethane foam, silica gel foam, heat conducting silica gel or heat conducting gel, and has a thickness of 0.05-0.5 mm.
  4. 4. The multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping as claimed in claim 1, wherein the first double-sided adhesive layer (3) and the second double-sided adhesive layer (5) are substrate-free acrylate pressure-sensitive adhesives or hot melt adhesives, and the thickness is 0.005-0.02 mm.
  5. 5. The multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping functions according to claim 1 is characterized in that the thickness of the first black rubber-containing Mylar layer (1) and the thickness of the second black rubber-containing Mylar layer (7) are 0.01-0.05 mm, and pressure-sensitive adhesives with electromagnetic shielding functions are coated on the surfaces of the first black rubber-containing Mylar layer and the second black rubber-containing Mylar layer.
  6. 6. The multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping as claimed in claim 1, wherein the buffer layer (4) contains phase change material microcapsules, the particle size of the microcapsules is 1-10 μm, and the phase change temperature is 40-50 ℃.
  7. 7. A multi-layered graphite heat dissipation structure with high heat dissipation and cushioning according to claim 1, characterized in that one or more heat conduction enhancing layers may be provided between the first high heat conduction layer (2) and the second high heat conduction layer (6).

Description

Multilayer graphite heat radiation structure with high heat radiation and buffering and damping functions Technical Field The invention relates to the technical field of graphite layers, in particular to a multilayer graphite heat dissipation structure with high heat dissipation and buffering and damping. Background With the rapid development of electronic devices in the directions of high performance, high integration and light weight, the power consumption density of chips is continuously increased, and the heat dissipation problem has become a key bottleneck for restricting the performance and reliability of products. Traditional heat dissipation modes such as air cooling, radiating fins and the like have difficulty in meeting the increasingly severe heat dissipation requirements. In recent years, an artificial graphite heat conducting film gradually becomes one of main stream heat radiating materials due to its extremely high heat conducting coefficient, good flexibility and light and thin characteristics, however, the following problems still exist in the prior art: Most graphite heat dissipation materials only have a heat conduction function, lack of comprehensive performances such as buffering, damping and electromagnetic shielding, are difficult to adapt to the structural stress and electromagnetic interference caused by stacking of multiple components in high-integration equipment, meanwhile, the traditional composite heat dissipation materials are mostly simple in adhesive lamination, weak in interlayer binding force, easy to delaminate and fall off in the use process, and influence the heat dissipation effect and the service life, and part of the composite heat dissipation materials contain volatile organic matters or materials which are difficult to recycle, so that the development trend of green and environment protection is not met. For this reason, we have devised a multi-layered graphite heat dissipation structure with high heat dissipation and cushioning. Disclosure of Invention The invention aims to solve the problems of poor interlayer binding force, single function, uneven thickness, poor environmental protection and the like of a composite heat dissipation material in the prior art, and provides a multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping. In order to achieve the above purpose, the present invention adopts the following technical scheme: A multi-layer graphite heat dissipation structure with high heat dissipation and buffering and damping comprises a first black rubber-containing Mylar layer, a first high heat conduction layer, a first double-sided adhesive layer, a buffer layer, a second double-sided adhesive layer, a second high heat conduction layer and a second black rubber-containing Mylar layer from top to bottom. Preferably, the first high heat conduction layer and the second high heat conduction layer are compounded by one or more of an artificial graphite film, a natural graphite film, a copper foil or a nano copper foil, the thickness is 0.01-0.05 mm, and the heat conduction coefficient is more than or equal to 1400W/(m.K). Preferably, the buffer layer is one of polyurethane foam, silica gel foam, heat-conducting silica gel or heat-conducting gel, the thickness is 0.05-0.5 mm, and the compression rebound rate is more than or equal to 80%. Preferably, the first double-sided adhesive layer and the second double-sided adhesive layer are both substrate-free acrylate pressure-sensitive adhesives or hot melt adhesives, and the thickness is 0.005-0.02 mm. Preferably, the thickness of the first black glue-containing Mylar layer and the second black glue-containing Mylar layer is 0.01-0.05 mm, and the surface is coated with pressure-sensitive adhesive, so that the electromagnetic shielding function is achieved. Preferably, the buffer layer internally contains phase change material microcapsules, the particle size of the microcapsules is 1-10 mu m, and the phase change temperature is 40-50 ℃. Preferably, one or more heat conduction enhancement layers, such as copper foil grids, graphene coatings and the like, can be arranged between the first high heat conduction layer and the second high heat conduction layer, so that the in-plane thermal diffusion capability is further improved. The beneficial effects of the invention are as follows: 1. the invention adopts a double-layer high heat conduction graphite structure to form a high-efficiency heat conduction path, the in-plane heat conduction coefficient can reach more than 1400W/(m.K), the heat dissipation efficiency is improved by more than 30% compared with that of a single-layer graphite material, and the local hot spot can be rapidly diffused to a large-area; 2. the invention has the advantages that through a multilayer adhesive structure and a precise composite process, the interlayer peeling strength is more than or equal to 0.8kN/m, and after aging for 500 hours at high temp