CN-122002771-A - GPU server rack water-cooling heat abstractor

CN122002771ACN 122002771 ACN122002771 ACN 122002771ACN-122002771-A

Abstract

The invention relates to the technical field of server equipment cooling, and discloses a water-cooling heat dissipation device of a GPU server cabinet, which comprises a heat conduction substrate and a plurality of micro-channels arranged in the heat conduction substrate, wherein a rotating plate and a cleaning frame are arranged in each micro-channel, a containing cavity is arranged on one side of the micro-channel in the heat conduction substrate, the rotating plate is rotationally connected to one side of the containing cavity, which is close to the micro-channel, a memory alloy spring and a reset spring are arranged at the tail end of the micro-channel in parallel, and the cleaning frame is fixedly connected with the tail end of the reset spring, which is far away from the tail end of the micro-channel. According to the invention, after the temperature of cooling liquid flowing into the micro-channel is higher than the phase change temperature of the memory alloy spring due to scale deposition in the micro-channel, the memory alloy spring gradually returns to a preset shrinkage form from an elongation form, the flow sectional area of the cooling liquid is increased, and meanwhile, the scale deposited in the micro-channel is automatically cleaned by the cleaning frame, so that the effective flow sectional area and the heat exchange efficiency of the micro-channel are recovered.

Inventors

WU XIAOLONG
HU YAN

Assignees

重庆亿众数字能源科技有限公司

Dates

Publication Date: 20260508
Application Date: 20260409

Claims (10)

1. The GPU server cabinet water-cooling heat dissipation device is characterized by comprising a heat conduction substrate and a plurality of micro-channels arranged in the heat conduction substrate, wherein a rotating plate and a cleaning frame are arranged in each micro-channel; An accommodating cavity is formed in the heat conducting substrate and located at one side of the micro-channel, the rotating plate is rotatably connected to one side, close to the micro-channel, of the accommodating cavity, and elastic sealing films are fixedly connected between the edge of the rotating plate and the edge of the accommodating cavity; The end of the micro-channel is provided with a memory alloy spring and a return spring in parallel, the cleaning frame is fixedly connected with the end, far away from the end of the micro-channel, of the return spring, a fixed pulley is rotatably connected to the other end of the micro-channel in the heat conducting substrate, the end, far away from the end of the micro-channel, of the memory alloy spring is fixedly connected with a connecting rope, and the end of the connecting rope bypasses the fixed pulley and is fixedly connected with the cleaning frame; The memory alloy spring is positioned on one side of the rotating plate, the external diameter of the memory alloy spring is smaller than the width of the micro-channel after the memory alloy spring is stretched at normal temperature, and the external diameter of the memory alloy spring is larger than the width of the micro-channel after the memory alloy spring is contracted at high temperature.
2. The water-cooling heat dissipation device for a GPU server cabinet as set forth in claim 1, wherein the plurality of micro-channels are disposed on the heat conducting substrate directly below a position for mounting a GPU chip.
3. The water-cooling heat dissipation device for a GPU server cabinet according to claim 1, wherein the elastic sealing film at the rotating connection part far away from the rotating plate is in a tensioning state in an initial state.
4. The GPU server cabinet water-cooling heat dissipation device according to claim 1, wherein the outer wall of the cleaning frame is abutted against the inner wall of the micro-channel, and a first cleaning brush for cleaning the memory alloy spring and a second cleaning brush for cleaning the rotating plate are fixedly connected to the cleaning frame.
5. The water-cooled heat sink of a GPU server cabinet as set forth in claim 4, wherein the first cleaning brush is positioned in the middle of the cleaning frame and is oriented to the surface of the memory alloy spring.
6. The water-cooled heat sink of a GPU server cabinet as set forth in claim 4, wherein the second cleaning brush is located on a side of the cleaning frame adjacent to the rotating plate, and the second cleaning brush faces the surface of the rotating plate.
7. The GPU server cabinet water-cooling heat dissipation device according to claim 1, wherein the heat conduction substrate is internally provided with a water inlet part and a water outlet part at two ends of the micro-channel respectively, the fixed pulley is arranged in the water inlet part, a fixing frame is fixedly arranged in the water outlet part, and the fixing frame is fixedly connected with the ends of the memory alloy spring and the reset spring, which are close to the tail end of the micro-channel respectively.
8. The water-cooling heat dissipation device of a GPU server cabinet as set forth in claim 7, wherein the fixed pulley and the fixed frame are both disposed away from the ends of the micro-channels.
9. The GPU server cabinet water-cooling heat dissipation device according to claim 7, wherein a water outlet flow passage is arranged in the heat conducting substrate and is communicated with the water outlet part.
10. The GPU server cabinet water-cooling heat dissipation device according to claim 9, wherein a water inlet pipe and a water outlet pipe are fixedly penetrated on one side of the heat conducting substrate, the water inlet pipe is communicated with the water inlet part, and the water outlet pipe is communicated with the water outlet runner.

Description

GPU server rack water-cooling heat abstractor Technical Field The invention relates to the technical field of server equipment cooling, in particular to a water-cooling heat dissipation device of a GPU server cabinet. Background The GPU server is a special computing platform based on a Graphic Processor (GPU), is widely applied to high-parallelism processing scenes such as video coding and decoding, deep learning, scientific computing and the like, and remarkably improves the computing processing efficiency and the competitiveness of products. In the running process of the GPU server, a large amount of heat energy is generated in the cabinet, if the heat energy cannot be discharged timely and effectively, the internal temperature of the server can be increased rapidly, the operation performance and the running stability of the GPU chip are directly affected, the peripheral electrical components are extremely easy to overheat and damage, and the service life of equipment is shortened. Currently, the GPU server mostly adopts a micro-channel structure, and has the characteristics of high heat dissipation efficiency, flexible deployment and the like, and the cold plate type water cooling heat dissipation mode can conduct heat dissipation and cooling treatment on heat generated during operation of the GPU server. However, the size of the flow channel of the micro-channel is extremely narrow, calcium and magnesium ions in the cooling medium are easily affected by high temperature and are continuously deposited on the inner wall surface of the flow channel in the long-term operation process, scale is gradually formed and the space of the flow channel is occupied, the effective flow cross section area of the cooling liquid is obviously reduced, the flow channel is blocked when serious, the flow rate of the cooling liquid flowing through the channel is greatly reduced, the flow rate of the cooling liquid at the downstream of the blocking point is reduced, the residence time is prolonged, the temperature of the cooling liquid in the micro-channel is abnormally increased, meanwhile, the heat conducting substrate is higher due to insufficient heat removal, the overheat risk of a chip is increased, and the operation reliability of a GPU server is directly affected. Disclosure of Invention The invention aims to provide a water-cooling heat dissipation device of a GPU server cabinet, which is used for solving the problems in the process. In order to achieve the above purpose, the present invention provides the following technical solutions: A GPU server cabinet water-cooling heat dissipation device comprises a heat conduction substrate and a plurality of micro-channels arranged in the heat conduction substrate, wherein a rotating plate and a cleaning frame are arranged in each micro-channel; An accommodating cavity is formed in the heat conducting substrate and located at one side of the micro-channel, the rotating plate is rotatably connected to one side, close to the micro-channel, of the accommodating cavity, and elastic sealing films are fixedly connected between the edge of the rotating plate and the edge of the accommodating cavity; The end of the micro-channel is provided with a memory alloy spring and a return spring in parallel, the cleaning frame is fixedly connected with the end, far away from the end of the micro-channel, of the return spring, a fixed pulley is rotatably connected to the other end of the micro-channel in the heat conducting substrate, the end, far away from the end of the micro-channel, of the memory alloy spring is fixedly connected with a connecting rope, and the end of the connecting rope bypasses the fixed pulley and is fixedly connected with the cleaning frame; The memory alloy spring is positioned on one side of the rotating plate, the external diameter of the memory alloy spring is smaller than the width of the micro-channel after the memory alloy spring is stretched at normal temperature, and the external diameter of the memory alloy spring is larger than the width of the micro-channel after the memory alloy spring is contracted at high temperature. As an optimal scheme of the water-cooling heat dissipation device of the GPU server cabinet, a plurality of micro-channels are arranged right below the position, on the heat conducting substrate, for installing the GPU chip. As an optimal scheme of the water cooling device of the GPU server cabinet, the elastic sealing film far away from the rotating connection part of the rotating plate is in a tensioning state in an initial state. As an optimal scheme of the GPU server cabinet water-cooling heat dissipation device, the outer wall of the cleaning frame is abutted against the inner wall of the micro-channel, and a first cleaning brush for cleaning the memory alloy spring and a second cleaning brush for cleaning the rotating plate are fixedly connected to the cleaning frame. As an optimal scheme of the GPU server cabinet water-cooling heat d