CN-122002923-A - Image sensor package and related methods

Abstract

The present disclosure relates to image sensor packages and related methods. Implementations of a method of forming an image sensor package may include providing an image sensor substrate including an image sensor die, bonding a light transmissive substrate to the image sensor substrate, forming a plurality of electrical interconnects on the image sensor substrate, and, after forming the plurality of electrical interconnects, thinning the light transmissive substrate to a desired thickness.

Inventors

• J. Luguban
• G. ROBERT

Assignees

• 半导体元件工业有限责任公司

Dates

Publication Date

20260508

Application Date

20250922

Priority Date

20241104

Claims (20)

1. 1. A method of forming an image sensor package, the method comprising: providing an image sensor substrate comprising an image sensor die; Bonding a light transmissive substrate to the image sensor substrate; forming a plurality of electrical interconnects on the image sensor substrate, and After forming the plurality of electrical interconnects, the light transmissive substrate is thinned to a desired thickness.
2. 2. The method of claim 1, further comprising eliminating scratches from the exposed surface of the light-transmissive substrate by the thinning.
3. 3. The method of claim 1, wherein thinning comprises grinding.
4. 4. The method of claim 3, wherein thinning comprises polishing.
5. 5. The method of claim 1, wherein forming a plurality of interconnects further comprises coupling a plurality of balls to the image sensor substrate.
6. 6. The method of claim 1, further comprising not using a protective tape on the exposed surface of the optically transmissive substrate.
7. 7. A method of forming an image sensor package, the method comprising: providing an image sensor substrate comprising an image sensor die; Bonding a light transmissive substrate to the image sensor substrate; Forming a titanium tungsten layer on a maximum flat surface of the light-transmitting substrate; forming a plurality of electrical interconnects on the image sensor substrate, and After forming the plurality of electrical interconnects, the titanium tungsten layer is removed.
8. 8. The method of claim 7, wherein forming the titanium tungsten layer occurs prior to bonding the light transmissive substrate.
9. 9. The method of claim 7, wherein forming the titanium tungsten layer occurs after bonding the light transmissive substrate.
10. 10. The method of claim 7, further comprising eliminating scratches in the titanium tungsten layer by removing the titanium tungsten layer.
11. 11. The method of claim 7, wherein the titanium tungsten layer is located on a largest planar surface of the light transmissive substrate facing away from the image sensor substrate.
12. 12. The method of claim 7, wherein forming the plurality of interconnects further comprises coupling a plurality of balls to the image sensor substrate.
13. 13. The method of claim 7, further comprising not using a protective tape on the exposed surface of the optically transmissive substrate.
14. 14. The method of claim 7, wherein forming the titanium tungsten layer further comprises forming across the entire maximum planar surface of the light transmissive substrate.
15. 15. The method of claim 7, wherein forming the plurality of interconnects further comprises forming through silicon vias.
16. 16. A method of forming an image sensor package, the method comprising: providing an image sensor substrate comprising an image sensor die; Bonding a light transmissive substrate to the image sensor substrate; forming a titanium tungsten layer on a portion of a maximum planar surface of the light transmissive substrate; applying a protective tape over the titanium tungsten layer and the maximum planar surface of the light transmissive substrate; Forming a plurality of electrical interconnects on the image sensor substrate; Removing the guard band after forming the plurality of electrical interconnects, and And removing the titanium tungsten layer.
17. 17. The method of claim 16, wherein the titanium tungsten layer is located around a perimeter of the optically transmissive substrate.
18. 18. The method of claim 16, wherein the titanium tungsten layer is located around a perimeter of the image sensor die.
19. 19. The method of claim 17, wherein the titanium tungsten layer is located around a perimeter of the optically transmissive substrate.
20. 20. The method of claim 16, the method further comprising: eliminating scratches in the transparent substrate by removing the protective tape, and Damage to the edge region of the light-transmitting substrate is prevented by the titanium tungsten layer.

Description

Image sensor package and related methods Technical Field Aspects of the present document relate generally to image sensor devices and image sensor packages. Background Various semiconductor package designs have been created to help form electrical connections between the semiconductor die and a motherboard or other circuit board to which the semiconductor package is attached. Other semiconductor packages are used to protect the semiconductor die from shock or vibration. Still other semiconductor packages include components for preventing damage to the semiconductor die from electrostatic discharge. Disclosure of Invention Implementations of a method of forming an image sensor package may include providing an image sensor substrate including an image sensor die, bonding a light transmissive substrate to the image sensor substrate, forming a plurality of electrical interconnects on the image sensor substrate, and, after forming the plurality of electrical interconnects, thinning the light transmissive substrate to a desired thickness. Implementations of a method of forming an image sensor package may include one, all, or any of the following: the method may include eliminating scratches on the exposed surface of the transparent substrate by the thinning. Thinning may include grinding. Thinning may include polishing. Forming the plurality of interconnects may include coupling a plurality of balls to the image sensor substrate. The method may include not using a protective tape on the exposed surface of the optically transmissive substrate. Implementations of a method of forming an image sensor package may include providing an image sensor substrate including an image sensor die, bonding a light transmissive substrate to the image sensor substrate, forming a titanium tungsten layer on a largest planar surface of the light transmissive substrate, forming a plurality of electrical interconnects on the image sensor substrate, and removing the titanium tungsten layer after the plurality of electrical interconnects are formed. Implementations of a method of forming an image sensor package may include one, all, or any of the following: the formation of the titanium tungsten layer may occur prior to bonding the light transmissive substrate. The formation of the titanium tungsten layer may occur after bonding the light transmissive substrate. The method may include removing scratches in the titanium tungsten layer by removing the titanium tungsten layer. The titanium tungsten layer may be located on a maximally flat surface of the light transmissive substrate facing away from the image sensor substrate. Forming the plurality of interconnects may further include coupling a plurality of balls to the image sensor substrate. The method may include not using a protective tape on the exposed surface of the optically transmissive substrate. Forming the titanium tungsten layer may also include forming the layer across the entire maximum planar surface of the light transmissive substrate. Forming the plurality of interconnects may further include forming through silicon vias. Implementations of a method of forming an image sensor package may include providing an image sensor substrate including an image sensor die, bonding a light transmissive substrate to the image sensor substrate, forming a titanium tungsten layer on a portion of a maximum planar surface of the light transmissive substrate, and applying a guard band over the titanium tungsten layer and the maximum planar surface of the light transmissive substrate, the method may include forming a plurality of electrical interconnects on the image sensor substrate, removing the guard band after forming the plurality of electrical interconnects, and removing the titanium tungsten layer. Implementations of a method of forming an image sensor package may include one, all, or any of the following: The titanium tungsten layer may be located around the perimeter of the light transmissive substrate. The titanium tungsten layer may be located around the perimeter of the image sensor die. The titanium tungsten layer may be located around the perimeter of the light transmissive substrate. The method may include eliminating scratches in the transparent substrate by removing the protective tape, and preventing damage to an edge region of the transparent substrate by the titanium tungsten layer. The above and other aspects, features and advantages will be readily apparent to those of ordinary skill in the art from the description and drawings and from the claims. Drawings The detailed description will hereinafter be described in conjunction with the appended drawings, wherein like designations denote like elements, and: FIG. 1 is a side cross-sectional view of a portion of an implementation of an image sensor substrate bonded to a light transmissive substrate to which an implementation of a guard band is coupled; FIG. 2 is a cross-sectional view of a portion of an implementation of a thi